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1. 发明授权

US07830597B2 Optical system having selectable field for inspection 有权
标题翻译：光学系统具有可选择的检查范围
公开(公告)号：US07830597B2
公开(公告)日：2010-11-09
申请号：US11853296
申请日：2007-09-11
申请人： Siu Wing Lau , Zhuan Yun Zhang , Yiu Ming Cheung , Chi Ping Hung
发明人： Siu Wing Lau , Zhuan Yun Zhang , Yiu Ming Cheung , Chi Ping Hung
IPC分类号： G02B21/00
CPC分类号： G02B21/084 , G02B21/025
摘要： An optical system for viewing an object has a plurality of lenses and a main optical axis coincident with the centers of the lenses. The optical system further comprises a low magnification optical subsystem that is operative to view the object at a first magnification and a high magnification optical subsystem that is operative to view the object at a second magnification that is higher than the first magnification. The high magnification optical subsystem has a high magnification optical axis along which light rays that are received from the main optical axis are transmitted. A movable element is locatable on the high magnification optical axis and is movable in directions transverse to the axis for receiving and transmitting light rays.
摘要翻译：用于观看物体的光学系统具有与透镜的中心一致的多个透镜和主光轴。光学系统还包括低倍率光学子系统，其可操作以在第一放大率下观看物体，以及高倍率光学子系统，其可操作以在高于第一放大率的第二放大率下观察物体。高倍率光学子系统具有高倍率的光轴，沿主光轴从主光轴接收的光线被传送。可移动元件可定位在高放大倍率的光轴上，并且可在横向于轴线的方向上移动以接收和传输光线。

2. 发明授权

US09281290B2 Bond head for thermal compression die bonding 有权
标题翻译：粘合头用于热压缩芯片粘接
公开(公告)号：US09281290B2
公开(公告)日：2016-03-08
申请号：US13561241
申请日：2012-07-30
申请人： Kin Yik Hung , Pak Kin Leung , Cheuk Wah Tang , Chi Ping Hung , Gary Peter Widdowson
发明人： Kin Yik Hung , Pak Kin Leung , Cheuk Wah Tang , Chi Ping Hung , Gary Peter Widdowson
IPC分类号： B32B37/00 , H01L23/00 , B32B38/18
CPC分类号： H01L24/75 , B32B38/1858 , B32B2457/14 , H01L2224/75252 , H01L2224/7531 , H01L2224/75745 , H01L2224/80203 , H01L2224/81203 , H01L2224/83203
摘要： A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.
摘要翻译：用于热压缩管芯接合的接合头包括在芯片接合期间在夹头的第一侧上支撑模具的夹头和位于与第一侧相对的夹头的第二侧上的接合头加热器，用于加热夹头和死。接合头加热器上的模具真空吸孔施加真空吸力以保持夹头，并且粘结头加热器上的夹头真空吸孔施加真空吸力以保持模具。形成在夹头的第二侧上的至少一个真空分配通道与夹头真空吸入孔流体连通，并且将真空抽吸力分布在夹头的第二侧的表面上，以固定夹头。

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