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    • 3. 发明申请
    • Methods and apparatuses for protecting data on mass storage devices
    • 保护大容量存储设备数据的方法和装置
    • US20070130434A1
    • 2007-06-07
    • US11294230
    • 2005-12-05
    • Simon ChuWilliam Piazza
    • Simon ChuWilliam Piazza
    • G06F12/14
    • G06F21/80
    • Methods, apparatuses, and media to protect sensitive information in data storage devices are disclosed. Embodiments comprise a method of transmitting and receiving unique identification information of components of a computer system, comparing the information with previously saved information in the storage device, and not allowing access to the data if the information is substantially different. In some embodiments, the storage device may simply prevent access to the information. In other embodiments, the storage device may erase the information after detecting a change in the computer system. In other embodiments, the storage device may provide various options for effectively resetting the unique identification stored in the data storage device so that the device may be used in an altered system.
    • 公开了用于保护数据存储设备中的敏感信息的方法,装置和媒体。 实施例包括发送和接收计算机系统的组件的唯一标识信息的方法,将信息与先前保存的存储设备中的信息进行比较,并且如果信息显着不同,则不允许访问数据。 在一些实施例中,存储设备可以简单地阻止对信息的访问。 在其他实施例中,存储设备可以在检测到计算机系统中的改变之后擦除该信息。 在其他实施例中,存储设备可以提供用于有效地重置存储在数据存储设备中的唯一标识的各种选项,使得该设备可以在改变的系统中使用。
    • 8. 发明申请
    • System, method, and apparatus for providing a thermal bypass in electronic equipment
    • 用于在电子设备中提供热旁路的系统,方法和装置
    • US20050247067A1
    • 2005-11-10
    • US10842284
    • 2004-05-10
    • Martin CrippenJason MattesonWilliam Piazza
    • Martin CrippenJason MattesonWilliam Piazza
    • F25B21/02F25D23/12H05K7/20
    • H05K7/20F25B21/02F25B2321/0251
    • A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.
    • 系统机箱使用两个热交换器和热电冷却模块来管理系统内的热量。 气流进入系统并由服务器刀片加热。 气流的一部分分流并移动到系统外壳的各个部分。 在下游子系统周围循环之前,通过第一热交换器从气流中除去一些热量。 第一个热交换器接触TEC模块的冷端,以降低气流的温度。 空气然后进入网络交换机模块或进一步加热的其他子系统。 此后,第二热交换器通过将上游热量重新插入下游气流中来绕过这些部件。 第二个热交换器接触TEC模块的热侧。 然后将所有加热空气的混合物从系统外壳排出。