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1. 发明申请

WO2005119773A1 MODULE INTEGRATION INTEGRATED CIRCUITS 审中-公开
标题翻译：模块集成集成电路
公开(公告)号：WO2005119773A1
公开(公告)日：2005-12-15
申请号：PCT/CA2005/000779
申请日：2005-05-27
申请人： SIGE SEMICONDUCTOR INC. , DERBYSHIRE, James, H. , TRAINOR, Alan, J.A.
发明人： DERBYSHIRE, James, H. , TRAINOR, Alan, J.A.
IPC分类号： H01L23/538
CPC分类号： H01L23/66 , H01L24/48 , H01L2224/48137 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H04B1/005 , H04B1/0483 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A first signal conditioning circuit is formed from a first portion, a second portion and a third portion. Signal conditioning functions of each of these portions are facilitated by a predetermined type of integrated semiconductor die within which they are formed. Two different semiconductor dies are thus provided for facilitating integration of the first through third signal conditioning portions therein. Wire bonds are provided between the two different semiconductor dies in order to form circuit paths between the different first through third portions. The signal routing using between the two different semiconductor dies provides for completing of the first signal conditioning circuit having a first signal conditioning function. For example, circuits such as interstage matching circuits are disposed on a different semiconductor die than power amplifier circuits.
摘要翻译：第一信号调理电路由第一部分，第二部分和第三部分形成。这些部分中的每一个的信号调理功能由形成它们的预定类型的集成半导体管芯来促进。因此，提供了两个不同的半导体管芯，以便于其中的第一至第三信号调节部分的集成。在两个不同的半导体管芯之间提供引线键以形成不同的第一至第三部分之间的电路。在两个不同半导体管芯之间使用的信号路由提供具有第一信号调节功能的第一信号调理电路的完成。例如，诸如级间匹配电路的电路设置在与功率放大器电路不同的半导体管芯上。

2. 发明申请

WO2005034240A1 MODULE INTEGRATION INTEGRATED CIRCUITS 审中-公开
标题翻译：模块集成集成电路
公开(公告)号：WO2005034240A1
公开(公告)日：2005-04-14
申请号：PCT/CA2004/001789
申请日：2004-10-08
申请人： SIGE SEMICONDUCTOR INC. , TRAINOR, Alan, J.A.
发明人： TRAINOR, Alan, J.A.
IPC分类号： H01L27/02
CPC分类号： H04B1/0483 , H04B1/005
摘要： An electronic module that operates at various radio frequency standards is provided. The module includes a first integrated circuit die formed in a first semiconductor substrate and manufactured using a first semiconductor process. Disposed within the first integrated circuit is the first signal conditioning circuit for performing a function and the first and second ancillary circuits. The first ancillary circuit electrically coupled to the first signal conditioning circuit for use by the first signal conditioning circuit during operation thereof. The second ancillary circuit is for other than being used by the first signal conditioning circuit during operation thereof since the second integrated circuit die is electrically coupled to the second ancillary circuit and formed in the second semiconductor substrate and co-located with the first integrated circuit within the module. The second integrated circuit die benefits from the operation of the second ancillary circuit for functioning thereof for performing a similar function to the first signal conditioning circuit.
摘要翻译：提供以各种射频标准操作的电子模块。该模块包括形成在第一半导体衬底中并使用第一半导体工艺制造的第一集成电路管芯。设置在第一集成电路内的是用于执行功能的第一信号调节电路和第一和第二辅助电路。电耦合到第一信号调理电路的第一辅助电路供第一信号调理电路在其工作期间使用。第二辅助电路除了在其操作期间被第一信号调理电路使用之外，因为第二集成电路管芯电耦合到第二辅助电路并形成在第二半导体衬底中并与第一集成电路内的位置模块。第二集成电路管芯由于第二辅助电路的操作而受益于其功能，用于执行与第一信号调理电路类似的功能。

3. 发明授权

EP1676319B1 MODULE INTEGRATION INTEGRATED CIRCUITS 有权
标题翻译：与集成模块集成电路
公开(公告)号：EP1676319B1
公开(公告)日：2009-08-19
申请号：EP04789699.8
申请日：2004-10-08
申请人： SiGe Semiconductor Inc.
发明人： TRAINOR, Alan, J.A.
IPC分类号： H01L27/02 , H01L21/70 , H04B1/00 , H04B1/04
CPC分类号： H04B1/0483 , H04B1/005
摘要： An electronic module that operates at various radio frequency standards is provided. The module includes a first integrated circuit die formed in a first semiconductor substrate and manufactured using a first semiconductor process. Disposed within the first integrated circuit is the first signal conditioning circuit for performing a function and the first and second ancillary circuits. The first ancillary circuit electrically coupled to the first signal conditioning circuit for use by the first signal conditioning circuit during operation thereof. The second ancillary circuit is for other than being used by the first signal conditioning circuit during operation thereof since the second integrated circuit die is electrically coupled to the second ancillary circuit and formed in the second semiconductor substrate and co-located with the first integrated circuit within the module. The second integrated circuit die benefits from the operation of the second ancillary circuit for functioning thereof for performing a similar function to the first signal conditioning circuit.

4. 发明授权

EP1774590B1 MODULE INTEGRATION INTEGRATED CIRCUITS 有权转让
公开(公告)号：EP1774590B1
公开(公告)日：2020-02-12
申请号：EP05745367.2
申请日：2005-05-27
申请人： SIGE Semiconductor Inc
发明人： DERBYSHIRE, James, H. , TRAINOR, Alan, J.A.
IPC分类号： H01L23/538 , H01L27/02 , H01L21/58 , H03F3/195 , H04B1/00 , H04B1/04 , H01L23/66

5. 发明公开

EP1676319A1 MODULE INTEGRATION INTEGRATED CIRCUITS 有权
标题翻译：与集成模块集成电路
公开(公告)号：EP1676319A1
公开(公告)日：2006-07-05
申请号：EP04789699.8
申请日：2004-10-08
申请人： SiGe Semiconductor Inc.
发明人： TRAINOR, Alan, J.A.
IPC分类号： H01L27/02 , H01L21/70 , H04B1/00
CPC分类号： H04B1/0483 , H04B1/005
摘要： An electronic module that operates at various radio frequency standards is provided. The module includes a first integrated circuit die formed in a first semiconductor substrate and manufactured using a first semiconductor process. Disposed within the first integrated circuit is the first signal conditioning circuit for performing a function and the first and second ancillary circuits. The first ancillary circuit electrically coupled to the first signal conditioning circuit for use by the first signal conditioning circuit during operation thereof. The second ancillary circuit is for other than being used by the first signal conditioning circuit during operation thereof since the second integrated circuit die is electrically coupled to the second ancillary circuit and formed in the second semiconductor substrate and co-located with the first integrated circuit within the module. The second integrated circuit die benefits from the operation of the second ancillary circuit for functioning thereof for performing a similar function to the first signal conditioning circuit.

6. 发明公开

EP1774590A1 MODULE INTEGRATION INTEGRATED CIRCUITS 有权转让
标题翻译：与集成模块集成电路
公开(公告)号：EP1774590A1
公开(公告)日：2007-04-18
申请号：EP05745367.2
申请日：2005-05-27
申请人： SiGe Semiconductor Inc.
发明人： DERBYSHIRE, James, H. , TRAINOR, Alan, J.A.
IPC分类号： H01L23/538 , H01L27/02 , H01L21/58 , H03F3/195
摘要： A first signal conditioning circuit is formed from a first portion, a second portion and a third portion. Signal conditioning functions of each of these portions are facilitated by a predetermined type of integrated semiconductor die within which they are formed. Two different semiconductor dies are thus provided for facilitating integration of the first through third signal conditioning portions therein. Wire bonds are provided between the two different semiconductor dies in order to form circuit paths between the different first through third portions. The signal routing using between the two different semiconductor dies provides for completing of the first signal conditioning circuit having a first signal conditioning function. For example, circuits such as interstage matching circuits are disposed on a different semiconductor die than power amplifier circuits.

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