专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090049681A1 ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：US20090049681A1
公开(公告)日：2009-02-26
申请号：US12194262
申请日：2008-08-19
申请人： Shuzo Yagi , Masao Nakane , Noboru Furuta
发明人： Shuzo Yagi , Masao Nakane , Noboru Furuta
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , H05K13/0061 , H05K13/0495 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility.
摘要翻译：用于将电子部件安装在基板上的本发明的电子部件安装装置包括：基板定位单元，用于将单个大尺寸基板或两个小尺寸基板承载在各个安装作业位置中的安装输送机中，以及基板下侧支撑部布置在安装输送机下方并且包括第一下侧支撑部分和第二下侧支撑部分。因此，在处理大尺寸基板的情况下，可以将单个基板定位在安装工作位置，并且在处理小尺寸基板的情况下将多个基板单独定位在多个安装工作位置。这通过紧凑的设备确保了对多种类型的基板的灵活部件安装工作。

2. 发明申请

US20090049682A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20090049682A1
公开(公告)日：2009-02-26
申请号：US12194310
申请日：2008-08-19
申请人： Shuzo Yagi , Masao Nakane , Noboru Furuta
发明人： Shuzo Yagi , Masao Nakane , Noboru Furuta
IPC分类号： B23P19/00 , H05K3/30
CPC分类号： H05K13/0069 , H05K13/0452 , Y10T29/4913 , Y10T29/49131 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.
摘要翻译：在包括串联耦合的多个电子部件安装装置的电子部件安装系统中，将电子部件安装在基板上以制造安装的基板的系统，将承载在安装输送机中的基板暂时置于基板的待机状态备用区域由位于一个电子部件安装装置上游的另一个电子部件安装装置的一个电子部件安装装置的第一传送输送机（输入输送机）和第二输送机（搬出输送机）形成。这消除了由于基板转移引起的时间浪费，并且通过紧凑的设备提高了生产效率。

3. 发明授权

US08789265B2 Electronic component mounting method providing a substrate standby area 有权
标题翻译：提供基板待机区域的电子元件安装方法
公开(公告)号：US08789265B2
公开(公告)日：2014-07-29
申请号：US12194310
申请日：2008-08-19
申请人： Shuzo Yagi , Masao Nakane , Noboru Furuta
发明人： Shuzo Yagi , Masao Nakane , Noboru Furuta
IPC分类号： B23P19/00
CPC分类号： H05K13/0069 , H05K13/0452 , Y10T29/4913 , Y10T29/49131 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.
摘要翻译：在包括串联耦合的多个电子部件安装装置的电子部件安装系统中，将电子部件安装在基板上以制造安装的基板的系统，将承载在安装输送机中的基板暂时置于基板的待机状态备用区域由位于一个电子部件安装装置上游的另一个电子部件安装装置的一个电子部件安装装置的第一传送输送机（输入输送机）和第二输送机（搬出输送机）形成。

4. 发明授权

US09187813B2 Method and device for removing metal fumes inside snout in continuous hot-dip plating plant 有权
标题翻译：在连续热镀电镀厂内除去喷嘴内的金属烟雾的方法和装置
公开(公告)号：US09187813B2
公开(公告)日：2015-11-17
申请号：US13820915
申请日：2012-07-03
申请人： Yu Yamauchi , Mikio Kawamura , Kuniaki Yamamoto , Tokuhiro Mizuno , Noboru Furuta
发明人： Yu Yamauchi , Mikio Kawamura , Kuniaki Yamamoto , Tokuhiro Mizuno , Noboru Furuta
IPC分类号： B01D45/00 , C23C2/00 , B01D45/06 , C23C2/02
CPC分类号： C23C2/003 , C23C2/00 , C23C2/02 , C23C2/40
摘要： A method and device for removing metal fumes inside a snout in a continuous hot-dip plating plant are provided, which are capable of reliably removing metal fumes causing unplating from the snout without heating an outer wall of the snout. Heated inert gas is supplied to an inside of a snout which is formed between a continuous annealing furnace outlet and a hot-dip metal plating bath. Atmospheric temperature of the inside of the snout and temperature of an inner wall of the snout are maintained, gas having a flow rate greater than a gas supply flow rate is exhausted. A gas stream is formed which flows from the continuous annealing furnace to a surface of the hot-dip metal plating bath, which prevents quality defect from occurring caused by metal fumes generated from molten metal surface.
摘要翻译：提供一种用于在连续的热浸镀设备中去除喷嘴内的金属烟雾的方法和装置，其能够可靠地从不影响鼻孔的外壁的情况下去除从鼻孔中脱出的金属烟雾。加热的惰性气体被供给到形成在连续退火炉出口和热浸金属电镀浴之间的喷嘴的内部。保持鼻孔内部的大气温度和鼻孔内壁的温度，排出大于气体供给流量的流量的气体。形成从连续退火炉流到热浸金属镀液的表面的气流，防止由熔融金属表面产生的金属烟雾引起的质量缺陷。

5. 发明授权

US08623188B2 Gas sensor 有权
标题翻译：气体传感器
公开(公告)号：US08623188B2
公开(公告)日：2014-01-07
申请号：US13281314
申请日：2011-10-25
申请人： Ai Igarashi , Noboru Furuta
发明人： Ai Igarashi , Noboru Furuta
IPC分类号： G01N27/419
CPC分类号： G01N27/4071
摘要： A gas sensor including a plate-shaped laminate disposed in a housing and fixed thereto via an element passage member and formed by laminating a gas sensor element and a heating element. The gas sensor element includes a plate-shaped solid electrolyte member, and a pair of detection electrodes formed on front and back surfaces thereof and constituting, in cooperation with the solid electrolyte member, a detection section for detecting the concentration of a specific gas. Insulating substrates mainly composed of alumina are provided on opposite sides of the laminate in the laminating direction. Coating layers mainly composed of a first material higher in toughness than alumina are formed on at least portions of outer surfaces of the insulating substrates in the laminating direction, the portions facing the element passage member. The coating layers are not formed on surfaces of the laminate parallel to the laminating direction.
摘要翻译：一种气体传感器，包括设置在壳体中并经由元件通道构件固定到其上的板状叠层体，并通过层压气体传感器元件和加热元件形成。气体传感器元件包括板状固体电解质构件和形成在其前表面和后表面上的一对检测电极，并且与固体电解质构件协同地构成用于检测特定气体的浓度的检测部。主要由氧化铝构成的绝缘基板在层压方向的相对侧设置。在层叠方向的绝缘基板的外表面的至少一部分上，形成有主要由比氧化铝高的韧性的第一材料构成的涂层，面向元件通路部件的部分。涂层平行于层压方向不形成在层叠体的表面上。

6. 发明申请

US20090159216A1 PASTE TRANSFER DEVICE AND ELECTRONIC COMPONENT MOUNTING APPARATUS 失效
标题翻译：浆料转移装置和电子元件安装装置
公开(公告)号：US20090159216A1
公开(公告)日：2009-06-25
申请号：US12282527
申请日：2007-03-12
申请人： Noboru Furuta , Yuzuru Inaba , Akira Kabeshita
发明人： Noboru Furuta , Yuzuru Inaba , Akira Kabeshita
IPC分类号： B29B15/00
CPC分类号： H05K13/046 , B23K1/203 , B23K2101/40 , H05K3/3436 , H05K3/3489 , H05K2201/035 , Y10T156/1798
摘要： In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.
摘要翻译：在用于电子部件安装装置的磁通转移单元中，用于将磁通量从从部件供给单元拾取的电子部件传送，然后将电子部件安装在电路板上，具有第一叶片和第二叶片的刀片保持头用于成膜的刮板和通过驱动传动销由无杆缸往复驱动的助焊剂的刮擦用刀片由可动件保持，以便围绕摆动支承销摆动，并且可动件是用板簧构件以规定的制动力制动。因此，每当叶片的运动方向反转时，叶片保持头摆动，使得第一叶片和第二叶片可以自动切换而不提供任何排他的驱动机构。

7. 发明授权

US09068254B2 Flow regulating member of hot dip coating tank and continuous hot dip coating system 有权
标题翻译：热浸镀槽流量调节件和连续热浸镀系统
公开(公告)号：US09068254B2
公开(公告)日：2015-06-30
申请号：US13978750
申请日：2012-01-16
申请人： Mikio Kawamura , Yu Yamauchi , Tsukasa Oyama , Masaaki Omodaka , Noboru Furuta , Koichi Nishizawa
发明人： Mikio Kawamura , Yu Yamauchi , Tsukasa Oyama , Masaaki Omodaka , Noboru Furuta , Koichi Nishizawa
IPC分类号： B05C3/00 , B05C3/02 , C23C2/00 , C23C2/40 , C23C2/06
CPC分类号： C23C2/003 , C23C2/06 , C23C2/40
摘要： A flow regulating member of a hot dip coating tank which is able to suppress stir-up of bottom dross, characterized by being provided with flow regulating member horizontal plates which are respectively arranged horizontally from below two side end parts of a sink roll, which is arranged inside of a coating tank in a rotatable manner, toward outside directions of the sink roll and side members which are arranged at positions separated from the two ends of the sink roll, which extend upward from the end parts of the respective horizontal plates, and in which large numbers of dispersion holes are formed, the side members having an aperture ratio of 20 to 80%, and the dispersion holes having a hole diameter of 5 to 50 mm.
摘要翻译：一种能够抑制底部浮渣搅拌的热浸镀槽的流量调节构件，其特征在于，设置有流量调节构件，水平板分别从水槽的两个侧端部的下方水平布置，以可旋转的方式布置在涂布槽的内部，朝向下沉辊的外侧方向和侧部构件布置在与从各个水平板的端部向上延伸的下沉辊两端分开的位置处;以及其中形成有大量分散孔，侧面构件的孔径比为20％至80％，分散孔的孔径为5至50mm。

8. 发明授权

US07318516B2 Substrate transfer apparatus for component mounting machine 失效
标题翻译：元件安装机基板输送装置
公开(公告)号：US07318516B2
公开(公告)日：2008-01-15
申请号：US10521815
申请日：2003-08-04
申请人： Noriyuki Tani , Noboru Furuta
发明人： Noriyuki Tani , Noboru Furuta
IPC分类号： H05K13/00
CPC分类号： H05K13/0061
摘要： A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.
摘要翻译：用于使衬底转移到安装过程中的安装等待过程在安装过程之前等待; 以及用于使从安装过程转移的衬底的衬底放电等待处理在提供以下处理之前等待。当将未安装的基板转移到安装过程中并且将安装的基板从安装过程传送到基板放电等待处理时，通过基板到达检测传感器检测被传送到基板的安装基板基板放电等待处理和基板连续性检测传感器，用于检测在安装的基板之后连续转印的未安装的基板，多个基板已经被连续转移到放电等待处理中。

9. 发明授权

US07819300B2 Paste transfer device and electronic component mounting apparatus 失效
标题翻译：粘贴传送装置和电子部件安装装置
公开(公告)号：US07819300B2
公开(公告)日：2010-10-26
申请号：US12282527
申请日：2007-03-12
申请人： Noboru Furuta , Yuzuru Inaba , Akira Kabeshita
发明人： Noboru Furuta , Yuzuru Inaba , Akira Kabeshita
IPC分类号： B23K3/00
CPC分类号： H05K13/046 , B23K1/203 , B23K2101/40 , H05K3/3436 , H05K3/3489 , H05K2201/035 , Y10T156/1798
摘要： In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.
摘要翻译：在用于电子部件安装装置的磁通转移单元中，用于将磁通量从从部件供给单元拾取的电子部件传送，然后将电子部件安装在电路板上，具有第一叶片和第二叶片的刀片保持头用于成膜的刮板和通过驱动传动销由无杆缸往复驱动的助焊剂的刮擦用刀片由可动件保持，以便围绕摆动支承销摆动，并且可动件是用板簧构件以规定的制动力制动。因此，每当叶片的运动方向反转时，叶片保持头摆动，使得第一叶片和第二叶片可以自动切换而不提供任何排他驱动机构。

10. 发明授权

US06691400B1 High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board 失效
标题翻译：具有将组件交替地安装在印刷电路板上的安装头的高速电子部件安装装置
公开(公告)号：US06691400B1
公开(公告)日：2004-02-17
申请号：US08761226
申请日：1996-12-06
申请人： Shigetoshi Negishi , Takeshi Nishiguchi , Mikio Yasuda , Takashi Munezane , Manabu Morioka , Takayoshi Kado , Takaharu Fuji , Noboru Furuta
发明人： Shigetoshi Negishi , Takeshi Nishiguchi , Mikio Yasuda , Takashi Munezane , Manabu Morioka , Takayoshi Kado , Takaharu Fuji , Noboru Furuta
IPC分类号： H05K330
CPC分类号： H05K13/0452 , H05K13/0409 , H05K13/041 , Y10S29/044 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53052 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261
摘要： A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction. The controller controls the movement of the table and the first and second mounting heads so that the first and second mounting heads pick up the electronic parts from the cassettes of the first and second parts feeders, respectively, and mount them on a printed board held on the table in sequential mounting operations.
摘要翻译：提供一种紧凑型和高速的自动电子部件安装装置，其包括第一和第二部件馈送器，第一和第二安装头，印刷电路板保持台和控制器。第一和第二部件馈送器中的每一个包括多个存储有电子部件并具有拾取站的盒。第二部件供给器以第一方向布置在离开第一部件进给器的预选间隔处。第一安装头和第二安装头中的每一个可沿第一方向移动并且包括可在垂直方向上移动的多个拾取喷嘴，用于从盒的拾取站拾取电子部件。印刷板保持台设置在第一和第二部件馈送器之间的预选间隔内，以沿与第一方向垂直的第二方向移动。控制器控制桌子和第一和第二安装头的移动，使得第一和第二安装头分别从第一和第二部件馈送器的盒中拾取电子部件，并将它们安装在保持在表中顺序安装操作。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式