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    • 3. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08648343B2
    • 2014-02-11
    • US12839519
    • 2010-07-20
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki KuwabaraIkuko Kawamata
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki KuwabaraIkuko Kawamata
    • H01L27/12
    • H01L27/1225H01L27/124
    • An object is to increase the aperture ratio of a semiconductor device. The semiconductor device includes a driver circuit portion and a display portion (also referred to as a pixel portion) over the same substrate. The driver circuit portion includes a channel-etched thin film transistor for a driver circuit, in which a source electrode and a drain electrode are formed using a metal and a channel layer is formed using an oxide semiconductor, and a driver circuit wiring formed using a metal. The display portion includes a channel protection thin film transistor for a pixel, in which a source electrode and a drain electrode are formed using an oxide conductor and a semiconductor layer is formed using an oxide semiconductor, and a display portion wiring formed using an oxide conductor. The thin film transistors provided in the semiconductor device are formed with a resist mask formed using a multi-tone mask.
    • 目的是提高半导体器件的开口率。 半导体器件包括驱动器电路部分和在同一衬底上的显示部分(也称为像素部分)。 驱动器电路部分包括用于驱动电路的沟道蚀刻薄膜晶体管,其中使用金属形成源电极和漏电极,并且使用氧化物半导体形成沟道层,以及使用 金属。 显示部分包括用于像素的沟道保护薄膜晶体管,其中使用氧化物导体形成源电极和漏电极,并且使用氧化物半导体形成半导体层,以及使用氧化物导体形成的显示部分布线 。 设置在半导体器件中的薄膜晶体管形成有使用多色调掩模形成的抗蚀剂掩模。
    • 4. 发明授权
    • Semiconductor device comprising a pixel portion and a driver circuit
    • 半导体器件包括像素部分和驱动器电路
    • US08643018B2
    • 2014-02-04
    • US13616019
    • 2012-09-14
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki KuwabaraHideki Uochi
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki KuwabaraHideki Uochi
    • H01L29/04H01L29/10H01L27/14H01L27/12
    • H01L27/1225H01L27/124H01L29/45
    • An object is to improve the aperture ratio of a semiconductor device. The semiconductor device includes a driver circuit portion and a display portion (also referred to as a pixel portion) over the same substrate. The driver circuit includes a channel-etched thin film transistor for driver circuit and a driver circuit wiring formed using metal. Source and drain electrodes of the thin film transistor for the driver circuit are formed using a metal. A channel layer of the thin film transistor for the driver circuit is formed using an oxide semiconductor. The display portion includes a bottom-contact thin film transistor for a pixel and a display portion wiring formed using an oxide conductor. Source and drain electrode layers of the thin film transistor for the pixel are formed using an oxide conductor. A semiconductor layer of the thin film transistor for the pixel is formed using an oxide semiconductor.
    • 目的是提高半导体器件的开口率。 半导体器件包括驱动器电路部分和在同一衬底上的显示部分(也称为像素部分)。 驱动器电路包括用于驱动电路的通道蚀刻薄膜晶体管和使用金属形成的驱动电路布线。 用于驱动电路的薄膜晶体管的源极和漏极由金属形成。 使用氧化物半导体形成用于驱动电路的薄膜晶体管的沟道层。 显示部分包括用于像素的底接触薄膜晶体管和使用氧化物导体形成的显示部分布线。 用于像素的薄膜晶体管的源极和漏极电极层使用氧化物导体形成。 使用氧化物半导体形成用于像素的薄膜晶体管的半导体层。
    • 5. 发明授权
    • Method for manufacturing a display device having oxide semiconductor layer
    • 具有氧化物半导体层的显示装置的制造方法
    • US08293594B2
    • 2012-10-23
    • US12835907
    • 2010-07-14
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki KuwabaraHideki Uochi
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki KuwabaraHideki Uochi
    • H01L21/84
    • H01L27/1225H01L27/124H01L29/45
    • An object is to improve the aperture ratio of a semiconductor device. The semiconductor device includes a driver circuit portion and a display portion (also referred to as a pixel portion) over the same substrate. The driver circuit includes a channel-etched thin film transistor for driver circuit and a driver circuit wiring formed using metal. Source and drain electrodes of the thin film transistor for the driver circuit are formed using a metal. A channel layer of the thin film transistor for the driver circuit is formed using an oxide semiconductor. The display portion includes a bottom-contact thin film transistor for a pixel and a display portion wiring formed using an oxide conductor. Source and drain electrode layers of the thin film transistor for the pixel are formed using an oxide conductor. A semiconductor layer of the thin film transistor for the pixel is formed using an oxide semiconductor.
    • 目的是提高半导体器件的开口率。 半导体器件包括驱动器电路部分和在同一衬底上的显示部分(也称为像素部分)。 驱动器电路包括用于驱动电路的通道蚀刻薄膜晶体管和使用金属形成的驱动电路布线。 用于驱动电路的薄膜晶体管的源极和漏极由金属形成。 使用氧化物半导体形成用于驱动电路的薄膜晶体管的沟道层。 显示部分包括用于像素的底接触薄膜晶体管和使用氧化物导体形成的显示部分布线。 用于像素的薄膜晶体管的源极和漏极电极层使用氧化物导体形成。 使用氧化物半导体形成用于像素的薄膜晶体管的半导体层。
    • 8. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08994024B2
    • 2015-03-31
    • US12835905
    • 2010-07-14
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki Kuwabara
    • Shunpei YamazakiJunichiro SakataHiroyuki MiyakeHideaki Kuwabara
    • H01L29/04H01L27/12H01L29/45
    • H01L27/124H01L27/1225H01L29/45
    • A highly reliable display device which has high aperture ratio and includes a transistor with stable electrical characteristics is manufactured. The display device includes a driver circuit portion and a display portion over the same substrate. The driver circuit portion includes a driver circuit transistor and a driver circuit wiring. A source electrode and a drain electrode of the driver circuit transistor are formed using a metal. A channel layer of the driver circuit transistor is formed using an oxide semiconductor. The driver circuit wiring is formed using a metal. The display portion includes a pixel transistor and a display portion wiring. A source electrode and a drain electrode of the pixel transistor are formed using a transparent oxide conductor. A semiconductor layer of the pixel transistor is formed using the oxide semiconductor. The display portion wiring is formed using a transparent oxide conductor.
    • 制造具有高开口率并且包括具有稳定电特性的晶体管的高度可靠的显示装置。 显示装置包括在同一基板上的驱动电路部分和显示部分。 驱动器电路部分包括驱动电路晶体管和驱动电路布线。 使用金属形成驱动电路晶体管的源电极和漏电极。 使用氧化物半导体形成驱动电路晶体管的沟道层。 驱动电路布线使用金属形成。 显示部分包括像素晶体管和显示部分布线。 使用透明氧化物导体形成像素晶体管的源电极和漏电极。 使用氧化物半导体形成像素晶体管的半导体层。 显示部分布线使用透明氧化物导体形成。