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1. 发明申请

US20090085182A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090085182A1
公开(公告)日：2009-04-02
申请号：US12219382
申请日：2008-07-21
申请人： Shunpei Yamazaki , Jun Koyama , Kiyoshi Kato , Takaaki Koen , Yuto Yakubo , Makoto Yanagisawa , Hisashi Ohtani , Eiji Sugiyama , Nozomi Horikoshi
发明人： Shunpei Yamazaki , Jun Koyama , Kiyoshi Kato , Takaaki Koen , Yuto Yakubo , Makoto Yanagisawa , Hisashi Ohtani , Eiji Sugiyama , Nozomi Horikoshi
IPC分类号： H01L21/58 , H01L23/12
CPC分类号： G06K19/07735 , G06K19/07722 , G06K19/07794 , H01L23/295 , H01L23/3157 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.
摘要翻译：一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。其中一个结构体设置在片上天线和增强天线之间。在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω/ cm2的导电膜。

2. 发明授权

US07932589B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07932589B2
公开(公告)日：2011-04-26
申请号：US12219382
申请日：2008-07-21
申请人： Shunpei Yamazaki , Jun Koyama , Kiyoshi Kato , Takaaki Koen , Yuto Yakubo , Makoto Yanagisawa , Hisashi Ohtani , Eiji Sugiyama , Nozomi Horikoshi
发明人： Shunpei Yamazaki , Jun Koyama , Kiyoshi Kato , Takaaki Koen , Yuto Yakubo , Makoto Yanagisawa , Hisashi Ohtani , Eiji Sugiyama , Nozomi Horikoshi
IPC分类号： H01L23/06
CPC分类号： G06K19/07735 , G06K19/07722 , G06K19/07794 , H01L23/295 , H01L23/3157 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.
摘要翻译：一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。其中一个结构体设置在片上天线和增强天线之间。在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω·cm 2 / cm 2的导电膜。

3. 发明授权

US08872331B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08872331B2
公开(公告)日：2014-10-28
申请号：US13084996
申请日：2011-04-12
申请人： Shunpei Yamazaki , Jun Koyama , Kiyoshi Kato , Takaaki Koen , Yuto Yakubo , Makoto Yanagisawa , Hisashi Ohtani , Eiji Sugiyama , Nozomi Horikoshi
发明人： Shunpei Yamazaki , Jun Koyama , Kiyoshi Kato , Takaaki Koen , Yuto Yakubo , Makoto Yanagisawa , Hisashi Ohtani , Eiji Sugiyama , Nozomi Horikoshi
IPC分类号： H01L23/10 , H01L23/31 , H01L23/29
CPC分类号： G06K19/07735 , G06K19/07722 , G06K19/07794 , H01L23/295 , H01L23/3157 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.
摘要翻译：一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。其中一个结构体设置在片上天线和增强天线之间。在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω·cm 2 / cm 2的导电膜。

4. 发明申请

US20080158092A1 Antenna and semiconductor device having the same 审中-公开
标题翻译：天线和具有相同的半导体器件
公开(公告)号：US20080158092A1
公开(公告)日：2008-07-03
申请号：US12000825
申请日：2007-12-18
申请人： Yuto Yakubo , Takaaki Koen
发明人： Yuto Yakubo , Takaaki Koen
IPC分类号： H01Q7/00
CPC分类号： H01Q7/00 , H01Q1/2283 , H01Q1/38
摘要： An antenna for an electromagnetic induction method, in which unevenness in current density distribution is suppressed so that a magnetic field with reduced distortion is generated. In addition, a semiconductor device with less variation in response frequency and communication distance is also provided. The antenna has a loop-like shaped conductive structure with a cut portion in a part thereof and cross-sectional surfaces of the conductive structure face each other in the cut portion. In addition, the conductive structure of the antenna is electrically coupled to have capacity in the cut portion. The semiconductor device has the antenna and an integrated circuit which is connected to the antenna in a power feeding portion.
摘要翻译：一种用于电磁感应方法的天线，其中电流密度分布的不均匀被抑制，从而产生具有减小的失真的磁场。此外，还提供了响应频率和通信距离的变化较小的半导体器件。天线具有环状导电结构，其一部分具有切割部分，并且导电结构的横截面在切割部分中彼此面对。此外，天线的导电结构电耦合以具有切割部分的容量。半导体器件具有天线和集成电路，其在馈电部分中连接到天线。

5. 发明授权

US07605761B2 Antenna and semiconductor device having the same 有权
标题翻译：天线和具有相同的半导体器件
公开(公告)号：US07605761B2
公开(公告)日：2009-10-20
申请号：US11979990
申请日：2007-11-13
申请人： Makoto Yanagisawa , Takaaki Koen
发明人： Makoto Yanagisawa , Takaaki Koen
IPC分类号： H01Q1/38 , H01Q5/00 , H01Q9/04
CPC分类号： H01Q7/00 , H01Q1/2225 , H01Q23/00
摘要： An antenna capable of receiving circularly polarized waves and performing impedance matching between the antenna and an IC (integrated circuit) of a semiconductor device, and a semiconductor device having such an antenna. The antenna has a first conductor pattern with a loop configuration having a cut section, a second conductor pattern, a third conductor pattern, and a feeding section. A first end portion of the second conductor pattern and a first end portion of the third conductor pattern are connected to the first conductor pattern. A second end portion of the second conductor pattern and a second end portion of the third conductor pattern are connected to the feeding section. The total length of the second conductor pattern is longer than the total length of the third conductor pattern, and the second conductor pattern is placed closer to the cut section than the third conductor pattern is.
摘要翻译：能够接收圆偏振波并且在天线与半导体器件的IC（集成电路）之间进行阻抗匹配的天线以及具有这种天线的半导体器件。天线具有第一导体图案，其具有切割部分，第二导体图案，第三导体图案和馈送部分的环形结构。第二导体图案的第一端部和第三导体图案的第一端部连接到第一导体图案。第二导体图案的第二端部和第三导体图案的第二端部连接到馈送部。第二导体图案的总长度比第三导体图案的总长度长，并且第二导体图案比第三导体图案更靠近切割部分。

6. 发明申请

US20080129606A1 Antenna and semiconductor device having the same 有权
标题翻译：天线和具有相同的半导体器件
公开(公告)号：US20080129606A1
公开(公告)日：2008-06-05
申请号：US11979990
申请日：2007-11-13
申请人： Makoto Yanagisawa , Takaaki Koen
发明人： Makoto Yanagisawa , Takaaki Koen
IPC分类号： H01Q9/04 , H01Q1/38
CPC分类号： H01Q7/00 , H01Q1/2225 , H01Q23/00
摘要： An antenna capable of receiving circularly polarized waves and performing impedance matching between the antenna and an IC (integrated circuit) of a semiconductor device, and a semiconductor device having such an antenna. The antenna has a first conductor pattern with a loop configuration having a cut section, a second conductor pattern, a third conductor pattern, and a feeding section. A first end portion of the second conductor pattern and a first end portion of the third conductor pattern are connected to the first conductor pattern. A second end portion of the second conductor pattern and a second end portion of the third conductor pattern are connected to the feeding section. The total length of the second conductor pattern is longer than the total length of the third conductor pattern, and the second conductor pattern is placed closer to the cut section than the third conductor pattern is.
摘要翻译：能够接收圆偏振波并且在天线与半导体器件的IC（集成电路）之间进行阻抗匹配的天线以及具有这种天线的半导体器件。天线具有第一导体图案，其具有切割部分，第二导体图案，第三导体图案和馈送部分的环形结构。第二导体图案的第一端部和第三导体图案的第一端部连接到第一导体图案。第二导体图案的第二端部和第三导体图案的第二端部连接到馈送部。第二导体图案的总长度比第三导体图案的总长度长，并且第二导体图案比第三导体图案更靠近切割部分。

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