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    • 5. 发明授权
    • Parts of electronic devices made of ferritic free cutting stainless steel
    • 电子元器件由铁素体自由切削不锈钢制成
    • US6033625A
    • 2000-03-07
    • US187041
    • 1998-11-06
    • Tomotaka NagashimaMichio Okabe
    • Tomotaka NagashimaMichio Okabe
    • C22C38/00C22C38/18C22C38/22C22C38/60
    • C22C38/22C22C38/18C22C38/60
    • Improved parts of electronic apparatus made of ferritic free cutting steel, which enjoy high precision in size given by good machinability and free from trouble caused by corrosion of metal due to generation of sulfides. The material steel has an alloy composition consisting essentially of, by weight %, C: up to 0.1%, Si: up to 2.0%, Mn: up to 2.0%, Cr: 19-25% and S: 0.20-0.35% and the balance of Fe and impurities. The parts made by machining can be used without being passivated. The steel may contain, further to the above alloy components, one or more from the following groups: 1) Mo: up to 4.0%; 2) one or more of Pb: up to 0.4%, Bi: up to 0.3%, Te: up to 0.3%, Se: up to 0.4% and Ca: up to 0.3%; 3) one or both of B and Mg: 0.001-0.02%; 4) one or both of Cu and Ni: 0.1-4.0%; 5) one or more of Nb, Ta, Ti, V, W and Al: 0.01-0.50%; and 6) O: 0.01-0.04%.
    • 由铁素体自由切削钢制成的电子设备的改进部件,由于良好的机械加工性而具有高精度的尺寸,并且没有由于硫化物的产生而导致的金属腐蚀的麻烦。 材料钢具有基本上由C:至多0.1%,Si:至多2.0%,Mn:至多2.0%,Cr:19-25%和S:0.20-0.35%的重量%,以及 余量为Fe和杂质。 通过加工制成的零件可以在不被钝化的情况下使用。 钢可以进一步包含以下组合中的一种或多种:1)Mo:至多4.0%; 2)Pb中的一种或多种:高达0.4%,Bi:高达0.3%,Te:高达0.3%,Se:高达0.4%,Ca:高达0.3%; 3)B和Mg中的一种或两种:0.001-0.02%; 4)Cu和Ni中的一种或两种:0.1-4.0%; 5)Nb,Ta,Ti,V,W和Al中的一种或多种:0.01-0.50%; 和6)O:0.01-0.04%。