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1. 发明授权

US4975471A Photo-curable epoxy resin type composition 失效
标题翻译：光固化型环氧树脂型组合物
公开(公告)号：US4975471A
公开(公告)日：1990-12-04
申请号：US240378
申请日：1988-08-29
申请人： Shuzi Hayase , Shuichi Suzuki , Moriyasu Wada
发明人： Shuzi Hayase , Shuichi Suzuki , Moriyasu Wada
IPC分类号： C08G59/00 , C08G59/40 , C08G59/50 , C08G59/56 , C08G59/68 , C08G65/12 , C08G65/26 , C08L63/00 , C08L77/00 , G03F7/038
CPC分类号： C08G65/269 , C08G59/40 , C08G59/50 , C08G59/56 , C08G59/68 , C08G65/12 , C08G65/2681 , G03F7/0385
摘要： A photo-curable epoxy resin type composition which comprises (a) an epoxy resin, (b) at least one compound selected from the group consisting of (i) a compound having a group, other than an imido group, which is represented by the formula --CONH and (ii) an aromatic amine, (c) an organic metal compound, where said metal is selected from the group consisting of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, aluminum and zirconium; and (d) an organic silicon compound having at least one group selected from the group consisting of a peroxysilyl group and an o-nitrobenzyloxy group capable of forming a silanol group by irradiation with light. The photo-curable epoxy resin type composition according to this invention is capable of readily curing by light (ultraviolet ray in particular) and also capable of heat curing at a temperature of 150.degree. C. or more, and yet provides a cured product that is free of ionic impurities, does not corrode metallic materials which may be in contact with the composition, and displays excellent electrical properties.
摘要翻译：一种光固化型环氧树脂型组合物，其包含（a）环氧树脂，（b）至少一种选自（i）除了亚氨基以外的基团的化合物的化合物，所述化合物由式（Ⅷ）和（ⅱ）芳族胺，（c）有机金属化合物，其中所述金属选自钛，钒，铬，锰，铁，钴，镍，铜，锌，铝和锆 ; 和（d）具有至少一个选自由光照射形成硅烷醇基的过氧甲硅烷基和邻硝基苄氧基的基团的有机硅化合物。本发明的光固化型环氧树脂类组合物能够容易地通过光（特别是紫外线）固化，也能够在150℃以上的温度下进行热固化，还可以提供固化物不含离子杂质，不会腐蚀可能与组合物接触的金属材料，并且显示出优异的电性能。

2. 发明授权

US4322513A Epoxy resin-based compositions 失效
标题翻译：环氧树脂基组合物
公开(公告)号：US4322513A
公开(公告)日：1982-03-30
申请号：US160290
申请日：1980-06-17
申请人： Moriyasu Wada , Shuichi Suzuki , Takeo Ito , Shuzi Hayase
发明人： Moriyasu Wada , Shuichi Suzuki , Takeo Ito , Shuzi Hayase
IPC分类号： C08G59/00 , C08G59/40 , C08G59/68 , C08G59/70 , C08J5/24 , C08L63/00 , H01B3/40
CPC分类号： C08G59/4085 , C08G59/68
摘要： An epoxy resin-based composition contains epoxy resins and a catalytic amount of latent curing catalysts which comprise organosilicon compounds having hydrolyzable groups and aluminum compound having organic groups.
摘要翻译：基于环氧树脂的组合物包含环氧树脂和催化量的潜在固化催化剂，其包含具有可水解基团的有机硅化合物和具有有机基团的铝化合物。

3. 发明授权

US4831063A Photocurable composition 失效
标题翻译：可光固化组合物
公开(公告)号：US4831063A
公开(公告)日：1989-05-16
申请号：US18834
申请日：1987-02-24
申请人： Shuichi Suzuki , Moriyasu Wada , Shuzi Hayase
发明人： Shuichi Suzuki , Moriyasu Wada , Shuzi Hayase
IPC分类号： C08G59/00 , C08F2/48 , C08F2/50 , C08F210/06 , C08F299/02 , C08G59/18 , C08G59/20 , C08G59/40 , C08G59/68 , C08G65/14 , C08G65/22 , C08G65/26 , C08K3/00 , C08K5/00 , C08L23/14 , C09D11/00 , C09D11/10 , C09D163/00 , C09J163/00 , G03F7/004 , G03F7/027 , G03F7/038 , G03F7/075
CPC分类号： G03F7/0045 , C08F299/028 , C08G59/68 , C08G65/14 , C08G65/22 , C08G65/2681 , C08G65/269 , G03F7/027 , G03F7/038 , G03F7/0755 , Y10S428/913 , Y10S525/922
摘要： A photocurable composition comprising (1) an epoxy compound having at least one epoxy group and at least one unsaturated double bond in the same molecule; (2) a metal compound present in an amount ranging from 0.001 to 10 wt. %, based on the epoxy compound; and (3) a silicon compound which is capable of forming a silanol group when irradiated with light and which is present in an amount ranging from 0.1 to 20 wt. %, based on the epoxy compound, is characterized by a particularly rapid curing rate.
摘要翻译：一种光固化性组合物，其包含（1）在同一分子中具有至少一个环氧基和至少一个不饱和双键的环氧化合物; （2）金属化合物的存在量为0.001至10重量％。％，基于环氧化合物; 和（3）当用光照射时能够形成硅烷醇基并且以0.1-20重量％的量存在的硅化合物。基于环氧化合物的％的特征在于特别快的固化速率。

4. 发明授权

US4835193A Photopolymerizable epoxy resin composition 失效
标题翻译：光聚合环氧树脂组合物
公开(公告)号：US4835193A
公开(公告)日：1989-05-30
申请号：US47501
申请日：1987-05-07
申请人： Shuzi Hayase , Yasunobu Onishi , Shuichi Suzuki , Moriyasu Wada
发明人： Shuzi Hayase , Yasunobu Onishi , Shuichi Suzuki , Moriyasu Wada
IPC分类号： C08G59/00 , C08G59/68 , G03F7/004 , G03F7/029 , G03F7/038 , H01B3/40
CPC分类号： G03F7/038 , C08G59/68 , C08G59/687 , G03F7/0045 , G03F7/029
摘要： A photopolymerizable epoxy resin composition comprising (a) an epoxy resin and (b) a heteropoly-acid aromatic sulfonium salt or a heteropoly-acid aromatic iodonium salt as a photocuring catalyst exhibits rapid photopolymerization, with the cured product being great in hardness, the corrosive action being weak, and the electrical properties being excellent. The industrial utility of the composition is therefore substantial.
摘要翻译：包含（a）环氧树脂和（b）作为光固化催化剂的杂多酸芳族锍盐或杂多酸芳族碘鎓盐的光聚合性环氧树脂组合物显示快速光聚合，固化产物硬度大，腐蚀性作用弱，电性能优异。因此，组合物的工业实用性是巨大的。

5. 发明授权

US4816496A Photocurable composition 失效
标题翻译：可光固化组合物
公开(公告)号：US4816496A
公开(公告)日：1989-03-28
申请号：US739119
申请日：1985-05-30
申请人： Moriyasu Wada , Shuichi Suzuki , Yuusuke Wada , Shuzi Hayase , Yukihiro Mikogami
发明人： Moriyasu Wada , Shuichi Suzuki , Yuusuke Wada , Shuzi Hayase , Yukihiro Mikogami
IPC分类号： C08G59/14 , C08G59/68 , C08G65/14 , G03F7/075 , C08F283/10 , C08L63/10
CPC分类号： C08G65/14 , C08G59/14 , C08G59/1433 , C08G59/68 , G03F7/0755 , Y10S525/922
摘要： Disclosed are photocurable compositions which comprise(A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule;(B) an organometallic compound and(C) a silicon compound capable of generating silanol group by irradiation of light, or comprise(A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule;(E) an epoxy compound;(F) an organic phosphorus compound; and(G) a photosensitizer.The compositions of the present invention have excellent film characteristics such as good adhesion property, light resistance, heat resistance and weathering resistance.

6. 发明授权

US4599155A Resin composition 失效
标题翻译：树脂组成
公开(公告)号：US4599155A
公开(公告)日：1986-07-08
申请号：US653089
申请日：1984-09-21
申请人： Shuichi Suzuki , Moriyasu Wada , Shuzi Hayase
发明人： Shuichi Suzuki , Moriyasu Wada , Shuzi Hayase
IPC分类号： C08G75/00 , C08F2/46 , C08G59/62 , C08G65/02 , C08G65/16 , C08G77/04 , C08G77/50 , C08K5/56 , C08L83/04 , G03F7/075 , H01B3/46
CPC分类号： G03F7/0755 , C08G59/625 , C08G59/626 , C08G77/50 , H01B3/46
摘要： There is disclosed a resin composition comprising(A) a spiro ortho ester compound and/or a spiro ortho carbonate compound;(B) an aluminum compound; and(C) a silanol compound or a silicon compound which is capable of generating a silanol group;the amounts of components (B) and (C) being within the range of 0.001 to 10% by weight and 0.1 to 20% by weiht, based on the amount of component (A), respectively.The resin composition of this invention is excellent in volumetric shrinkage performance at curing operation and is good in storability. Therefore, the cured product can be used for a wide variety of industrially valuable applications, such as an ink, a coating, an adhesive, a surface coating, an encapsulation and an electrical insulating material.
摘要翻译：公开了包含（A）螺原酸酯化合物和/或原碳酸酯化合物的树脂组合物; （B）铝化合物; 和（C）能够产生硅烷醇基团的硅烷醇化合物或硅化合物; 基于组分（A）的量，组分（B）和（C）的量分别在0.001至10重量％和0.1至20重量％的范围内。本发明的树脂组合物在固化操作时的体积收缩性能优异，保存性良好。因此，固化产物可用于各种工业上有价值的应用，例如油墨，涂层，粘合剂，表面涂层，封装和电绝缘材料。

7. 发明授权

US4324873A Organosilicon-organometal compositions as epoxy curing catalysts 失效
标题翻译：有机硅 - 有机金属组合物作为环氧固化催化剂
公开(公告)号：US4324873A
公开(公告)日：1982-04-13
申请号：US158456
申请日：1980-06-11
申请人： Moriyasu Wada , Shuichi Suzuki , Shinichi Sanada , Shuzi Hayase
发明人： Moriyasu Wada , Shuichi Suzuki , Shinichi Sanada , Shuzi Hayase
IPC分类号： C08G59/00 , C08G59/40 , C08G59/68 , C08G59/70 , C08J5/24 , C08L63/00 , H01B3/40
CPC分类号： C08G59/68 , C08G59/4085
摘要： An epoxy resin-based compositions contain epoxy resins and a catalytic amount of curing catalysts which comprise organosilicon compounds having at least one hydroxyl group directly bonded to silicon atom and a compound having organic groups of aluminum, iron or vanadium.
摘要翻译：基于环氧树脂的组合物包含环氧树脂和催化量的固化催化剂，其包含具有至少一个与硅原子键合的羟基的有机硅化合物和具有铝，铁或钒的有机基团的化合物。

8. 发明授权

US4173592A Heat-resistant resin composition 失效
标题翻译：耐热树脂组合物
公开(公告)号：US4173592A
公开(公告)日：1979-11-06
申请号：US898673
申请日：1978-04-21
申请人： Shuichi Suzuki , Moriyasu Wada , Sadao Kajiura , Takeo Ito
发明人： Shuichi Suzuki , Moriyasu Wada , Sadao Kajiura , Takeo Ito
IPC分类号： C08F12/00 , C08F16/00 , C08F16/16 , C08F16/32 , C08F222/40 , C08F290/00 , C08F299/00 , C08G14/00 , C08G14/06 , C08G59/00 , C08G59/40 , C08G73/12 , C08L79/08 , C08K5/15 , C08L63/00
CPC分类号： C08F222/40 , C08G73/12 , C08L79/085
摘要： A heat-resistant resin composition having for its essential components (A) at least one maleimide compound obtained by reacting a condensation product of aniline, a phenolic compound and formaldehyde with an acid anhydride reactant containing at least 40 mole percent of maleic anhydride and (B) at least one compound selected from the group consisting of polyallyl phenyl ether compounds and polyallylphenolic compounds each having at least two allyl radicals.
摘要翻译：一种耐热树脂组合物，其主要组分（A）至少一种马来酰亚胺化合物，其通过使苯胺，酚类化合物和甲醛的缩合产物与含有至少40摩尔％马来酸酐的酸酐反应物和（B ）至少一种选自聚烯丙基苯基醚化合物和各自具有至少两个烯丙基的聚烯丙基酚化合物的化合物。

9. 发明授权

US4666951A Photo-curable epoxy resin composition 失效
标题翻译：光固化环氧树脂组合物
公开(公告)号：US4666951A
公开(公告)日：1987-05-19
申请号：US590874
申请日：1984-03-19
申请人： Yasunobu Onishi , Shuzi Havase , Shuichi Suzuki , Moriyasu Wada
发明人： Yasunobu Onishi , Shuzi Havase , Shuichi Suzuki , Moriyasu Wada
IPC分类号： C08G59/00 , C08F2/50 , C08F4/12 , C08G59/68 , G03F7/004 , G03F7/038 , G03F7/075 , H01B3/40 , C08F4/18 , C08F4/34
CPC分类号： G03F7/0045 , C08G59/68 , G03F7/0755 , G03F7/038
摘要： There is disclosed a photo-curable epoxy resin type composition comprising an epoxy resin, an aluminum compound, a silicon compound having a peroxysilyl group and a photosensitizer.The compositions of the present invention can suitably be used for wide varieties of electrical applications.
摘要翻译：公开了包含环氧树脂，铝化合物，具有过氧甲硅烷基的硅化合物和光敏剂的光固化环氧树脂类组合物。本发明的组合物可适用于各种电气应用。

10. 发明授权

US4131632A Heat-resistant resin compositions 失效
标题翻译：耐热树脂组合物
公开(公告)号：US4131632A
公开(公告)日：1978-12-26
申请号：US837203
申请日：1977-09-27
申请人： Shuichi Suzuki , Moriyasu Wada
发明人： Shuichi Suzuki , Moriyasu Wada
IPC分类号： C08G73/12 , C08G69/02 , C08L63/00
CPC分类号： C08G73/121
摘要： Resin compositions comprising maleimide compounds obtained by reacting maleic anhydride with mixed polyamines produced by reaction between aniline and formaldehyde; diallylbisphenol compounds; and epoxy resins. The compositions display prominent heat resistance when hardened.
摘要翻译：包含马来酰亚胺化合物的树脂组合物，其通过马来酸酐与通过苯胺和甲醛之间的反应制备的混合多胺反应获得二烯丙基双酚化合物; 和环氧树脂。组合物在硬化时显示出显着的耐热性。

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