专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06417327B1 Peptide capable of regulating physiological function of FGF-5 and pharmaceutical composition containing the peptide 失效
标题翻译：能够调节FGF-5的生理功能的肽和含有肽的药物组合物
公开(公告)号：US06417327B1
公开(公告)日：2002-07-09
申请号：US09537817
申请日：2000-03-22
申请人： Shuichi Oka , Yoshimitsu Yamazaki , Toru Imamura , Yasuko Fujita , Saori Yamamoto , Yukiko Okita , Kazuo Ozawa , Reiko Akakura , Chikako Ito
发明人： Shuichi Oka , Yoshimitsu Yamazaki , Toru Imamura , Yasuko Fujita , Saori Yamamoto , Yukiko Okita , Kazuo Ozawa , Reiko Akakura , Chikako Ito
IPC分类号： C07K1450
CPC分类号： C07K14/50
摘要： The present invention provides a peptide partially comprising an amino acid sequence of FGF-5 or FGF-5S (i.e., the alternatively spliced form of FGF-5), the peptide being capable of controlling physiological function(s) of FGF-5. A pharmaceutical composition containing the peptide of the invention as an active component may regulate the physiological function(s) of FGF-5 such as regulation of development or growth of a head or body hair, regulation of nutrition or function of a cranial nerve system, regulation of platelets, and/or promotion or inhibition of proliferation or differentiation of a vascular endothelial cell.
摘要翻译：本发明提供了部分包含FGF-5或FGF-5S的氨基酸序列（即FGF-5的可变剪接形式）的肽，该肽能够控制FGF-5的生理功能。含有作为活性成分的本发明的肽的药物组合物可以调节FGF-5的生理功能，例如调节头部或体毛的发育或生长，调节营养或颅神经系统的功能，调节血小板，和/或促进或抑制血管内皮细胞的增殖或分化。

2. 发明授权

US08482107B2 Circular shield of a circuit-substrate laminated module and electronic apparatus 有权
标题翻译：电路基板层叠模块和电子设备的圆形屏蔽
公开(公告)号：US08482107B2
公开(公告)日：2013-07-09
申请号：US12926288
申请日：2010-11-08
申请人： Shinji Rokuhara , Shuichi Oka , Katsuji Matsumoto , Shusaku Yanagawa
发明人： Shinji Rokuhara , Shuichi Oka , Katsuji Matsumoto , Shusaku Yanagawa
IPC分类号： H01L23/552
CPC分类号： H01L25/162 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/48 , H01L25/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A device that comprises a plurality of circuit elements on a substrate; a shielding element between at least two of the plurality of circuit elements; and a bonding element that electrically connects the shielding element to a grounding circuit of a semiconductor chip that is on the substrate.
摘要翻译：一种在基板上包括多个电路元件的装置; 在所述多个电路元件中的至少两个之间的屏蔽元件; 以及将屏蔽元件电连接到基板上的半导体芯片的接地电路的接合元件。

3. 发明申请

US20100156565A1 FILM BULK ACOUSTIC RESONATOR 有权
标题翻译：电影大音量谐振器
公开(公告)号：US20100156565A1
公开(公告)日：2010-06-24
申请号：US12066317
申请日：2006-07-05
申请人： Shuichi Oka , Terukazu Ohno
发明人： Shuichi Oka , Terukazu Ohno
IPC分类号： H03H9/15
CPC分类号： H03H9/132 , H03H9/02102 , H03H9/02118 , H03H9/02133 , H03H9/173
摘要： An object is to provide a film bulk acoustic resonator capable of improving resonant characteristics by reducing the generation of a standing wave to be caused by a transverse-mode acoustic wave to a minimum. In a film bulk acoustic resonator including a resonant portion A having a piezoelectric material layer 3 sandwiched between a first electrode 2 and a second electrode 4, the resonant portion A is configured to have a planar shape that is an ellipse having a part thereof cut off along a straight line L. The straight line L intersects at least one of a minor axis and a major axis of the ellipse, and preferably intersects both the minor axis and the major axis, and passes through the center of the ellipse.
摘要翻译：本发明的目的是提供一种能够通过将由横模式的声波引起的驻波的产生降低到最小来提高谐振特性的膜体声波谐振器。在包括夹在第一电极2和第二电极4之间的具有压电体层3的谐振部分A的薄膜体声波谐振器中，谐振部分A被构造成具有截面的椭圆形的平面形状直线L与椭圆的短轴和长轴中的至少一个相交，并且优选地与短轴和长轴相交，并且穿过椭圆的中心。

4. 发明授权

US06960790B2 Fingerprint detection device and method of its manufacture, and apparatus for forming a protective film 失效
公开(公告)号：US06960790B2
公开(公告)日：2005-11-01
申请号：US10222469
申请日：2002-08-16
申请人： Seiichi Miyai , Shuichi Oka
发明人： Seiichi Miyai , Shuichi Oka
IPC分类号： G01B7/28 , C23C16/27 , G06K9/00 , G06T1/00 , H01L31/0312
CPC分类号： G06K9/00053 , Y10S257/914 , Y10S438/931
摘要： A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.

5. 发明授权

US08338912B2 Inductor module, silicon tuner module and semiconductor device 有权
标题翻译：电感模块，硅调谐模块和半导体器件
公开(公告)号：US08338912B2
公开(公告)日：2012-12-25
申请号：US12482022
申请日：2009-06-10
申请人： Shuichi Oka , Katsuji Matsumoto , Shusaku Yanagawa
发明人： Shuichi Oka , Katsuji Matsumoto , Shusaku Yanagawa
IPC分类号： H01F27/06 , H01F27/30 , H01L21/12
CPC分类号： H01L23/645 , H01L23/552 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2224/45147 , H01L2224/48091 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2924/00011
摘要： Disclosed herein is an inductor module including a substrate functioning as a printed wiring board or an interposer; an IC mounting part formed on a surface of the substrate; an inductor which is formed in the substrate at such a position as to overlap with the IC mounting part on a plan-view basis and which is connected to an IC mounted on the IC mounting part; and a magnetic body including a magnetic material selected from among a NiZn ferrite, a NiZnCu ferrite and a Ba ferrite, the magnetic body being disposed intermediately between the IC mounting part and the inductor.
摘要翻译：这里公开了一种电感器模块，其包括用作印刷线路板或插入件的基板; 形成在所述基板的表面上的IC安装部; 电感器，其形成在基板上，在与IC安装部重叠的位置上，并且与安装在IC安装部上的IC连接，以及包括选自NiZn铁氧体，NiZnCu铁氧体和Ba铁氧体的磁性材料的磁体，所述磁体设置在IC安装部和电感之间。

6. 发明申请

US20120307469A1 MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE 有权
标题翻译：多层接线板及其制造方法及半导体器件
公开(公告)号：US20120307469A1
公开(公告)日：2012-12-06
申请号：US13480925
申请日：2012-05-25
申请人： Shuichi Oka , Shusaku Yanagawa , Kiwamu Adachi
发明人： Shuichi Oka , Shusaku Yanagawa , Kiwamu Adachi
IPC分类号： H05K1/16 , H05K3/00 , H05K7/06
CPC分类号： H01G4/005 , H01G4/33 , H01L21/4857 , H01L23/49805 , H01L23/49822 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/30107 , H01L2924/3011 , H05K1/162 , H05K3/4652 , Y10T156/10 , H01L2924/00014 , H01L2924/00
摘要： A multilayer wiring board includes: a functional area which includes a thin film capacitor having a dielectric layer between an upper electrode and a lower electrode; and a peripheral area other than the functional area, wherein a mooring portion in which the dielectric layer and a conductive layer are laminated is provided in at least a portion of the peripheral area, and a roughness of a surface of the conductive layer which contacts the dielectric layer is greater than a roughness of a surface of the upper electrode or the lower electrode which contacts the dielectric layer.
摘要翻译：多层布线基板包括：功能区域，其包括在上电极和下电极之间具有介电层的薄膜电容器; 以及除了功能区域以外的周边区域，其中在周边区域的至少一部分中设置有其中层叠有电介质层和导电层的系泊部分，并且导电层的表面的粗糙度与电介质层大于与电介质层接触的上电极或下电极的表面的粗糙度。

7. 发明申请

US20110157857A1 Circuit board laminated module and electronic equipment 失效
标题翻译：电路板层压模块和电子设备
公开(公告)号：US20110157857A1
公开(公告)日：2011-06-30
申请号：US12926901
申请日：2010-12-16
申请人： Katsuji Matsumoto , Shusaku Yanagawa , Shuichi Oka , Shinji Rokuhara
发明人： Katsuji Matsumoto , Shusaku Yanagawa , Shuichi Oka , Shinji Rokuhara
IPC分类号： H05K1/14
CPC分类号： H05K1/0224 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0243 , H05K1/141 , H05K1/165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A circuit board laminated module includes: a first circuit board having a multi-layer structure in which ground layers are provided in a plurality of layers; a second circuit board mounted on the first circuit board; and a semiconductor chip mounted on the second circuit board, wherein in the first circuit board, a noise guiding through via which guides an electromagnetic noise generated in the semiconductor chip to a lower layer side is provided on a side different from a circuit portion or a circuit element desired to be protected against influence of the electromagnetic noise in a surrounding direction of an occurrence place of the electromagnetic noise.
摘要翻译：电路板层压模块包括：具有多层结构的第一电路板，其中在多层中设置接地层; 安装在第一电路板上的第二电路板; 以及安装在所述第二电路板上的半导体芯片，其中在所述第一电路板中，在与所述第一电路板或所述第二电路板不同的一侧上设置有将半导体芯片中产生的电磁噪声引导到下层侧的噪声引导通孔电路元件希望受到电磁噪声的发生位置的周围方向的电磁噪声的影响。

8. 发明申请

US20070269922A1 Fingerprint detection device and method of its manufacture, and apparatus for forming a protective film 失效
标题翻译：指纹检测装置及其制造方法，以及形成保护膜的装置
公开(公告)号：US20070269922A1
公开(公告)日：2007-11-22
申请号：US11725284
申请日：2007-03-19
申请人： Seiichi Miyai , Shuichi Oka
发明人： Seiichi Miyai , Shuichi Oka
IPC分类号： H01L21/56
CPC分类号： G06K9/00053 , Y10S257/914 , Y10S438/931
摘要： A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
摘要翻译：指纹检测装置具有覆盖传感器芯片的最外表面的指纹传感器芯片和类金刚石碳（DLC）膜。 DLC膜为指纹传感器芯片提供足够的强度和增强的静电放电耐受电压。因此，DLC胶片保护指纹传感器芯片，而无需任何传统的保护盖。 DLC膜不易刮伤，染色较少。由于指纹检测装置没有保护罩，所以可以以薄而紧凑的形式提供装置。此外，该设备具有高可靠性。

9. 发明授权

US07250774B2 Fingerprint sensor 有权
标题翻译：指纹传感器
公开(公告)号：US07250774B2
公开(公告)日：2007-07-31
申请号：US10450146
申请日：2002-09-11
申请人： Shuichi Oka
发明人： Shuichi Oka
IPC分类号： G01R27/26 , G06K9/24
CPC分类号： G06K9/0002
摘要： The present invention relates to a fingerprints detection apparatus by a capacitance detection method. The fingerprints detection apparatus of the present invention includes a sensor portion in which an insulating protection film is formed so as to cover detection electrodes arranged like an array, and the detection electrodes and the wiring beneath the detection electrodes are formed of a refractory metal or a compound of the refractory metal. This structure heightens the Vickers hardness of the detection electrodes and the wiring. This makes it possible to provide a highly reliable fingerprints detection apparatus in which a tolerance to cracks of the insulating protection film in the sensor portion is improved.
摘要翻译：本发明涉及通过电容检测方法的指纹检测装置。本发明的指纹检测装置包括：传感器部，其中形成绝缘保护膜以覆盖排列成阵列的检测电极，并且检测电极和检测电极下方的布线由难熔金属或难熔金属的化合物。这种结构提高了检测电极和布线的维氏硬度。这使得可以提供高度可靠的指纹检测装置，其中提高了传感器部分中的绝缘保护膜的裂纹的公差。

10. 发明授权

US07235853B2 Fingerprint detection device and method of its manufacture, and apparatus for forming a protective film 有权
公开(公告)号：US07235853B2
公开(公告)日：2007-06-26
申请号：US11145036
申请日：2005-06-03
申请人： Seiichi Miyai , Shuichi Oka
发明人： Seiichi Miyai , Shuichi Oka
IPC分类号： H01L31/06
CPC分类号： G06K9/00053 , Y10S257/914 , Y10S438/931
摘要： A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式