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    • 5. 发明授权
    • High-voltage tolerance input buffer and ESD protection circuit
    • 高压容差输入缓冲器和ESD保护电路
    • US06542346B1
    • 2003-04-01
    • US09586568
    • 2000-06-02
    • Wei-Fan ChenShu-Chuan LeeTa-Lee YuShi-Tron Lin
    • Wei-Fan ChenShu-Chuan LeeTa-Lee YuShi-Tron Lin
    • H02H322
    • H01L27/0251H01L29/7436H01L29/87
    • A high-voltage tolerance input buffer and a high-voltage ESD protection circuit connected to a pad of an integrated circuit for preventing rapid gate oxide aging. The high-voltage tolerance input buffer of the present invention comprises a voltage-sharing circuit and a switch circuit, wherein the voltage-sharing circuit is connected between the pad and a power rail and generates a reference voltage not higher than the voltage of the pad. The switch circuit is connected to the voltage-sharing circuit and comprises a control gate to control the switching operation of the switch circuit according to the reference voltage. The present invention can be implemented to solve the rapid gate oxide aging problem without incurring any change in the original process flow by employing a voltage-sharing circuit.
    • 连接到集成电路的焊盘的高压公差输入缓冲器和高压ESD保护电路,用于防止快速栅极氧化物老化。 本发明的高电压公差输入缓冲器包括电压共享电路和开关电路,其中电压共享电路连接在焊盘和电源轨之间,并产生不高于焊盘电压的参考电压 。 开关电路连接到分压电路,并包括控制栅极,以根据参考电压来控制开关电路的开关操作。 本发明可以实现以解决快速栅极氧化物老化问题,而不会通过采用电压共享电路而引起原始工艺流程的任何变化。
    • 6. 发明授权
    • ESD damage immunity buffer
    • ESD损伤免疫缓冲液
    • US06229183B1
    • 2001-05-08
    • US09460590
    • 1999-12-14
    • Shu-Chuan Lee
    • Shu-Chuan Lee
    • H01L2362
    • H01L27/0266H01L27/0259H01L27/0288
    • The present invention discloses an ESD damage immunity buffer, comprising: a gate, a first doped region, a second doped region, a third doped region, and a resist layer. The ESD damage immunity buffer, which is in parallel with an ESD protection circuit, is connected to a pad and the circuit grounding node. The gate is formed on the semiconductor substrate, and the first doped region and the second doped region are formed adjacent to the region below the gate in the semiconductor substrate and electrically coupled to the ground. The third doped region is formed in the semiconductor substrate and electrically coupled to the pad. Further, a resist layer is formed upon the semiconductor substrate and connects the third doped region to the second doped region, wherein said resist layer ensures a triggering of the ESD protection circuit prior to the ESD damage immunity buffer during an ESD event.
    • 本发明公开了一种ESD损伤抗扰度缓冲器,包括:栅极,第一掺杂区域,第二掺杂区域,第三掺杂区域和抗蚀剂层。 与ESD保护电路并联的ESD损伤抗扰度缓冲器连接到焊盘和电路接地节点。 栅极形成在半导体衬底上,并且第一掺杂区域和第二掺杂区域形成在半导体衬底中与栅极下方的区域相邻并且电耦合到地面。 第三掺杂区域形成在半导体衬底中并电耦合到焊盘。 此外,在半导体衬底上形成抗蚀剂层并且将第三掺杂区域连接到第二掺杂区域,其中所述抗蚀剂层确保在ESD事件期间在ESD损坏抗扰度缓冲器之前触发ESD保护电路。