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1. 发明授权

US08458454B2 Conditional access apparatus 有权
标题翻译：条件访问装置
公开(公告)号：US08458454B2
公开(公告)日：2013-06-04
申请号：US12674817
申请日：2007-08-24
申请人： Shu Murayama , Masahiro Abukawa , Nobuyoshi Okumura , Kenji Sakata
发明人： Shu Murayama , Masahiro Abukawa , Nobuyoshi Okumura , Kenji Sakata
IPC分类号： H04L29/06
CPC分类号： H04N21/4623 , H04N7/163 , H04N21/41407 , H04N21/4405 , H04N21/44231 , H04N21/4627
摘要： A conditional access apparatus receives a filter condition from another conditional access apparatus to set the filter condition to a filter unit 1 thereof. When key information meeting the above-mentioned filter condition is outputted from the filter unit 1, the conditional access apparatus informs the key information to the other conditional access apparatus, and also informs the filter condition set to the filter unit 1 by the key information control unit 3 to the other conditional access apparatus and acquires key information meeting the above-mentioned filter condition from the other conditional access apparatus.
摘要翻译：条件访问装置从另一个条件访问装置接收过滤条件以将过滤条件设置为其过滤器单元1。当从滤波器单元1输出满足上述滤波条件的密钥信息时，条件访问装置向另一个条件访问装置通知密钥信息，并通过密钥信息控制通知设置到滤波器单元1的滤波条件单元3到另一个条件访问装置，并且从另一条件访问装置获取满足上述过滤条件的密钥信息。

2. 发明申请

US20110060911A1 CONDITIONAL ACCESS APPARATUS 有权
标题翻译：条件访问装置
公开(公告)号：US20110060911A1
公开(公告)日：2011-03-10
申请号：US12674817
申请日：2007-08-24
申请人： Shu Murayama , Masahiro Abukawa , Nobuyoshi Okumura , Kenji Sakata
发明人： Shu Murayama , Masahiro Abukawa , Nobuyoshi Okumura , Kenji Sakata
IPC分类号： G06F21/24
CPC分类号： H04N21/4623 , H04N7/163 , H04N21/41407 , H04N21/4405 , H04N21/44231 , H04N21/4627
摘要： A conditional access apparatus receives a filter condition from another conditional access apparatus to set the filter condition to a filter unit 1 thereof. When key information meeting the above-mentioned filter condition is outputted from the filter unit 1, the conditional access apparatus informs the key information to the other conditional access apparatus, and also informs the filter condition set to the filter unit 1 by the key information control unit 3 to the other conditional access apparatus and acquires key information meeting the above-mentioned filter condition from the other conditional access apparatus.
摘要翻译：条件访问装置从另一个条件访问装置接收过滤条件以将过滤条件设置为其过滤器单元1。当从滤波器单元1输出满足上述滤波条件的密钥信息时，条件访问装置向另一个条件访问装置通知密钥信息，并通过密钥信息控制通知设置到滤波器单元1的滤波条件单元3到另一个条件访问装置，并且从另一条件访问装置获取满足上述过滤条件的密钥信息。

3. 发明授权

US08423531B2 Non-transitory storage medium storing management program, management apparatus, and management method 有权
标题翻译：存储管理程序，管理装置和管理方法的非暂时性存储介质
公开(公告)号：US08423531B2
公开(公告)日：2013-04-16
申请号：US13043237
申请日：2011-03-08
申请人： Kazuo Yamakawa , Isao Sumito , Kazuma Takahashi , Kenji Sakata , Hitoshi Kamura
发明人： Kazuo Yamakawa , Isao Sumito , Kazuma Takahashi , Kenji Sakata , Hitoshi Kamura
IPC分类号： G06F7/00 , G06F17/30
CPC分类号： G06F19/321 , G06F19/00
摘要： A non-transitory storage medium storing a management program, the management program causing a computer to execute first receiving case data related to a result of a clinical trial; referring to a definition table storing a first criterion and a second criterion; determining whether or not the case data satisfies the first criterion or second criterion; first transmitting a first inquiry to a terminal; second transmitting a second inquiry to the terminal; second receiving a first answer to the first inquiry from the terminal, the first answer including other case data that is the case data at least a part of which is modified; third determining whether or not the other case data satisfies the second criterion; and making a second answer to the second inquiry on the basis of a result of the third determination.
摘要翻译：存储管理程序的非暂时性存储介质，所述管理程序使计算机执行与临床试验结果相关的第一接收案例数据; 参考存储第一标准和第二标准的定义表; 确定所述情况数据是否满足所述第一标准或所述第二标准; 首先向终端发送第一询问; 第二次向终端发送第二个询问; 第二个接收来自终端的第一个询问的第一个答案，第一个答案包括其中至少一部分被修改的案例数据的其他案例数据; 第三确定其他情况数据是否满足第二标准; 并基于第三次确定的结果对第二次查询作出第二个回答。

4. 发明申请

US20110198954A1 Electric motor and reduction motor 有权
标题翻译：电机和还原电机
公开(公告)号：US20110198954A1
公开(公告)日：2011-08-18
申请号：US12998316
申请日：2009-10-07
申请人： Tatsuyuki Saito , Ryuichi Takakusagi , Toshiyuki Kimura , Yoshichika Kawashima , Kenji Sakata
发明人： Tatsuyuki Saito , Ryuichi Takakusagi , Toshiyuki Kimura , Yoshichika Kawashima , Kenji Sakata
IPC分类号： H01R39/32 , H02K7/116
CPC分类号： H02K3/28 , H02K7/1166 , H02K13/10 , H02K23/04 , H02K23/34
摘要： Disclosed is a motor in which a commutator (10) is provided with connecting wires which short-circuit equipotential segments; brushes (21) are constituted by a low-speed brush (21a), a high-speed brush (21b), and a common brush (21c) used in common by the low-speed and high-speed brushes, and are juxtaposed along the circumferential direction. The circumferential brush width (W2) of the high-speed brush is set to be smaller than the circumferential brush width (W1) of the low-speed brush. The high-speed brush and the low-speed brush are formed so that simultaneous sliding contact with equipotential segments (15) can be avoided. Additionally, armature cores (8) are provided such that a plurality of teeth (12) is point-symmetrical about a rotary shaft (3) at equal intervals in the circumferential direction, and the teeth and slots (13) are formed so as to exist alternately at intervals of 90 degrees in the circumferential direction. By virtue of the above configuration, vibration and noise can be reduced while achieving miniaturization and high performance of a motor.
摘要翻译：公开了一种电动机，其中换向器（10）设置有短路等电位段的连接线; 刷子（21）由低速和高速刷子共同使用的低速刷子（21a），高速刷子（21b）和普通刷子（21c）构成，并且并排圆周方向。高速刷的圆周刷宽度（W2）设定为小于低速刷的周向刷宽（W1）。形成高速电刷和低速电刷，可以避免与等电位段（15）的同时滑动接触。另外，电枢铁芯（8）设置成使得多个齿（12）在圆周方向上以相等的间隔围绕旋转轴（3）点对称，并且形成齿和槽（13），以便在圆周方向以90度的间隔交替地存在。通过上述结构，可以在实现电动机的小型化和高性能的同时降低振动和噪音。

5. 发明申请

US20110095638A1 Hybrid electric automobile 有权
标题翻译：混合电动汽车
公开(公告)号：US20110095638A1
公开(公告)日：2011-04-28
申请号：US12737308
申请日：2009-06-30
申请人： Kenji Sakata , Yoshichika Kawashima
发明人： Kenji Sakata , Yoshichika Kawashima
IPC分类号： H02K3/28
CPC分类号： H02K23/20 , H02K23/30 , Y02T10/641
摘要： In an electric motor, magnets (4) have two pairs of poles, the number of teeth (9) is 18, and the number of segments (14) of a commutator is 18. Winding wires (12, 25) for forming an armature coil (7) are formed by a first conductive wire (110) or a second conductive wire (120). The winding wire (25) has a first coil winding wire (7A) and a second coil winding wire (7B). The coil winding wires are each wound around four teeth (9) adjacent to each other. An end (31) of the second coil winding wire is connected to a segment (14) adjacent to a segment arranged at a position which is point symmetric with respect to a segment to which an end (30) of the first coil winding wire is connected. According to the invention, in the electric motor capable of changing the rotational speed of the armature by switching application of an electric current among three brushes, vibration and operating noise can be reduced, and mounting of the connecting wires and the winding wires can be facilitated.
摘要翻译：在电动机中，磁体（4）具有两对磁极，齿数（9）为18，换向器的分段（14）的数量为18.用于形成电枢的绕线（12,25）线圈（7）由第一导线（110）或第二导线（120）形成。绕组线（25）具有第一线圈绕组（7A）和第二线圈绕组（7B）。线圈绕组线分别围绕彼此相邻的四个齿（9）缠绕。第二线圈绕组线的端部（31）连接到与布置在相对于第一线圈绕组的端部（30）的点对称的位置处的段相邻的段（14）连接的。根据本发明，通过在三个电刷之间切换施加电流而能够改变电枢的转速的电动机中，可以减少振动和操作噪音，并且可以容易地安装连接线和绕组线。

6. 发明申请

US20120238060A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120238060A1
公开(公告)日：2012-09-20
申请号：US13485729
申请日：2012-05-31
申请人： Kenji Sakata , Tsuyoshi Kida
发明人： Kenji Sakata , Tsuyoshi Kida
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/32 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/3511 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method of manufacturing a semiconductor device, includes mounting a semiconductor chip on a wiring substrate such that one surface of the semiconductor chip is faced to one surface of the wiring substrate, and filling a first resin in a gap between the surface of the wiring substrate and the surface of the semiconductor chip such that part of the first resin protrudes from the gap. In the filling of the first resin, the first resin is injected into the gap by use of a first resin injection nozzle while the first resin injection nozzle is being moved along any one of sides of the semiconductor chip or along two sides of the semiconductor chip which are adjacent to each other.
摘要翻译：一种制造半导体器件的方法，包括将半导体芯片安装在布线基板上，使得半导体芯片的一个表面面对布线基板的一个表面，并且在布线基板的表面之间的间隙中填充第一树脂以及半导体芯片的表面使得第一树脂的一部分从间隙突出。在第一树脂的填充中，通过使用第一树脂注入喷嘴将第一树脂注入到间隙中，同时第一树脂注入喷嘴沿着半导体芯片的任一侧移动或沿着半导体芯片的两侧移动它们彼此相邻。

7. 发明授权

US4323600A Process for metallic coat finishing 失效
标题翻译：金属涂层整理工艺
公开(公告)号：US4323600A
公开(公告)日：1982-04-06
申请号：US176155
申请日：1980-08-07
申请人： Kenji Sakata , Toshiaki Yamada , Kenji Uchiyama , Yugo Hasegawa
发明人： Kenji Sakata , Toshiaki Yamada , Kenji Uchiyama , Yugo Hasegawa
IPC分类号： B05D7/14 , B05D1/36 , B05D5/06 , B05D7/00 , C09D5/38 , C09D201/02
CPC分类号： B05D7/532 , B05D5/068 , Y10T428/31692 , Y10T428/31931
摘要： Metallic coat finishing with good gloss vividness is provided by undercoating a liquid coating containing a specified thermosetting vinyl copolymer and a metallic appearance imparting pigment, overcoating a thermosetting, clear powder paint and then baking the two coated film together. The specified thermosetting vinyl copolymer is obtained by copolymerizing N-alkoxymethyl(metha)-acrylic amide, a hydroxyl group containing vinyl monomer, a carboxyl group containing vinyl monomer and copolymerizable other vinyl monomers in specified amounts.
摘要翻译：通过底漆涂布含有特定热固性乙烯基共聚物和金属外观赋予颜料的液体涂料，再涂覆热固性，透明粉末涂料，然后将两个涂布膜一起烘烤，提供具有良好光泽鲜艳度的金属涂层。指定的热固性乙烯基共聚物通过N-烷氧基甲基（甲基） - 丙烯酰胺，含羟基的乙烯基单体，含羧基的乙烯基单体和可共聚的其它乙烯基单体以规定的量共聚而获得。

8. 发明申请

US20150236003A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：US20150236003A1
公开(公告)日：2015-08-20
申请号：US14404099
申请日：2012-09-14
申请人： Jumpei Konno , Takafumi Nishita , Kenji Sakata , Nobuhiro Kinoshita , Michiaki Sugiyama , Tsuyoshi Kida , Yoshihiro Ono
发明人： Jumpei Konno , Takafumi Nishita , Kenji Sakata , Nobuhiro Kinoshita , Michiaki Sugiyama , Tsuyoshi Kida , Yoshihiro Ono
IPC分类号： H01L25/00 , H01L23/498 , H01L25/065 , H01L21/56 , H01L23/00
CPC分类号： H01L21/486 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/538 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/065 , H01L25/0657 , H01L25/07 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2224/03002 , H01L2224/0401 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/27312 , H01L2224/27334 , H01L2224/2741 , H01L2224/29006 , H01L2224/29007 , H01L2224/29012 , H01L2224/29015 , H01L2224/2919 , H01L2224/32013 , H01L2224/32014 , H01L2224/32058 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/753 , H01L2224/75315 , H01L2224/81001 , H01L2224/81191 , H01L2224/81203 , H01L2224/81447 , H01L2224/81815 , H01L2224/81907 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/8385 , H01L2224/83862 , H01L2224/83906 , H01L2224/83907 , H01L2224/92 , H01L2224/9211 , H01L2224/92242 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/06568 , H01L2924/07802 , H01L2924/07811 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2224/11 , H01L21/304 , H01L2224/03 , H01L21/78 , H01L2221/68381 , H01L21/4825 , H01L2224/27 , H01L2924/01047
摘要： A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin. Here, before sealing with the resin, a gap between the second semiconductor chip and the wiring board is previously sealed with the adhesive material used when the first and second semiconductor chips are mounted.
摘要翻译：一种制造半导体器件的方法，所述半导体器件通过层叠具有不同平面尺寸的第一半导体芯片和第二半导体芯片的方法，所述半导体器件和第二半导体芯片在通过粘合材料在布线板上的平面图中看到，其中具有相对较大的平面尺寸以相对较小的平面尺寸安装在第一半导体芯片上。此外，在安装第一和第二半导体芯片之后，用树脂密封第一和第二半导体芯片。这里，在用树脂密封之前，当安装第一和第二半导体芯片时，使用所使用的粘合剂材料预先密封第二半导体芯片和布线板之间的间隙。

9. 发明授权

US08710651B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08710651B2
公开(公告)日：2014-04-29
申请号：US12904680
申请日：2010-10-14
申请人： Kenji Sakata , Tsuyoshi Kida
发明人： Kenji Sakata , Tsuyoshi Kida
IPC分类号： H01L29/66
CPC分类号： H01L21/563 , H01L23/3135 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/49173 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75743 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/83104 , H01L2224/83192 , H01L2224/83951 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： A semiconductor device includes a substrate, a semiconductor chip that is bonded to one of the faces of the substrate via bumps, and has a device formation face facing the one of the faces, and a resin that fills the space between the device formation face of the semiconductor chip and the one of the faces of the substrate. The resin includes: a first resin that is formed in a formation region of bumps placed on the outermost circumference of the bumps, and is formed inside the formation region, and a second resin that is formed outside the first resin. The thermal expansion coefficient of the substrate is higher than the thermal expansion coefficient of the first resin. The thermal expansion coefficient of the second resin is higher than the thermal expansion coefficient of the first resin.
摘要翻译：半导体器件包括：衬底，通过凸块接合到衬底的一个面的半导体芯片，并且具有面向该一个面的器件形成面;以及树脂，其填充器件形成面之间的空间半导体芯片和基板的一个面。树脂包括：第一树脂，其形成在凸起的最外周上的凸起的形成区域中，并且形成在形成区域内部;以及第二树脂，形成在第一树脂的外部。基板的热膨胀系数高于第一树脂的热膨胀系数。第二树脂的热膨胀系数高于第一树脂的热膨胀系数。

10. 发明授权

US08436505B2 Electric motor and reduction motor 有权
标题翻译：电机和还原电机
公开(公告)号：US08436505B2
公开(公告)日：2013-05-07
申请号：US12998316
申请日：2009-10-07
申请人： Tatsuyuki Saito , Ryuichi Takakusagi , Toshiyuki Kimura , Yoshichika Kawashima , Kenji Sakata
发明人： Tatsuyuki Saito , Ryuichi Takakusagi , Toshiyuki Kimura , Yoshichika Kawashima , Kenji Sakata
IPC分类号： H02K13/00
CPC分类号： H02K3/28 , H02K7/1166 , H02K13/10 , H02K23/04 , H02K23/34
摘要： Disclosed is a motor in which a commutator (10) is provided with connecting wires which short-circuit equipotential segments; brushes (21) are constituted by a low-speed brush (21a), a high-speed brush (21b), and a common brush (21c) used in common by the low-speed and high-speed brushes, and are juxtaposed along the circumferential direction. The circumferential brush width (W2) of the high-speed brush is set to be smaller than the circumferential brush width (W1) of the low-speed brush. The high-speed brush and the low-speed brush are formed so that simultaneous sliding contact with equipotential segments (15) can be avoided. Additionally, armature cores (8) are provided such that a plurality of teeth (12) is point-symmetrical about a rotary shaft (3) at equal intervals in the circumferential direction, and the teeth and slots (13) are formed so as to exist alternately at intervals of 90 degrees in the circumferential direction. By virtue of the above configuration, vibration and noise can be reduced while achieving miniaturization and high performance of a motor.
摘要翻译：公开了一种电动机，其中换向器（10）设置有短路等电位段的连接线; 刷子（21）由低速和高速刷子共同使用的低速刷子（21a），高速刷子（21b）和普通刷子（21c）构成，并且并排圆周方向。高速刷的圆周刷宽度（W2）设定为小于低速刷的周向刷宽（W1）。形成高速电刷和低速电刷，可以避免与等电位段（15）的同时滑动接触。另外，电枢铁芯（8）设置成使得多个齿（12）在圆周方向上以相等的间隔围绕旋转轴（3）点对称，并且形成齿和槽（13），以便在圆周方向以90度的间隔交替地存在。通过上述结构，可以在实现电动机的小型化和高性能的同时降低振动和噪音。

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