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1. 发明申请

US20090301771A1 CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME 审中-公开
标题翻译：导电布，其形成方法和使用其的电子元件安装结构
公开(公告)号：US20090301771A1
公开(公告)日：2009-12-10
申请号：US12477227
申请日：2009-06-03
申请人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
发明人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
IPC分类号： H05K1/16 , H05K1/11 , H01R43/02
CPC分类号： H05K3/4007 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/90 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/1132 , H01L2224/114 , H01L2224/11552 , H01L2224/11554 , H01L2224/116 , H01L2224/11901 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83192 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/095 , H05K2201/0367 , H05K2201/0373 , H05K2201/09827 , H05K2203/0514 , H05K2203/1476 , Y10T29/49213 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.
摘要翻译：形成在电子部件的电极上的导电凸块。导电凸块由在电极上形成有一层或多层的第一凸块组成，并且包括至少包含球形导电填料的树脂和形成在第一凸块的上表面上的第二凸块，并且包括含有鳞片状导电填料。

2. 发明授权

US08663383B2 Expansive material and its preparation process 有权
标题翻译：膨胀材料及其制备工艺
公开(公告)号：US08663383B2
公开(公告)日：2014-03-04
申请号：US13261027
申请日：2010-05-20
申请人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
发明人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
IPC分类号： C04B2/02
CPC分类号： C04B40/0039 , C04B38/02 , Y02P40/18 , C04B7/02 , C04B22/064 , C04B22/143 , C04B40/0082 , C04B40/0231
摘要： The invention provides an expansive material that allows for large expansion of concrete at a material age of 2 to 7 days after pouring and permits concrete to have higher initial compressive strength and makes sure good storage stability, and a process for preparing that expansive material.The invention provides an expansive material and a process for preparing that expansive material, characterized in that clinker or pulverized clinker containing free lime, a hydraulic compound and calcium sulfate anhydrite is heat treated in a carbon dioxide gas atmosphere to form calcium carbonate in it. Preferably, the expansive material contains a particle in which the free lime, hydraulic compound, calcium sulfate anhydrite and calcium carbonate are all present; the content of calcium carbonate is 0.5 to 10% by mass; and the expansive material has a Blaine's specific surface area of 1,500 to 90,000 cm2/g. The expansive material is blended with cement into a cement composition. The preparation conditions are preferably a carbon dioxide gas flow rate of 0.01 to 0.1 L/min. and a temperature of 200 to 800° C., under which conditions there is calcium carbonate formed.
摘要翻译：本发明提供了一种膨胀材料，其允许混凝土在浇筑后2至7天的时间内大量膨胀，并允许混凝土具有较高的初始抗压强度并确保良好的储存稳定性，以及制备该膨胀材料的方法。本发明提供了一种膨胀材料和一种制备膨胀材料的方法，其特征在于，在二氧化碳气氛中对含有游离石灰的熟料或粉碎熟料，水硬性化合物和硫酸钙无水石膏进行热处理，以形成碳酸钙。优选地，膨胀材料包含其中存在游离石灰，水硬性化合物，硬脂酸钙和碳酸钙的颗粒; 碳酸钙的含量为0.5〜10质量％膨胀材料的Blaine比表面积为1500〜90,000cm2 / g。膨胀材料与水泥混合成水泥组合物。制备条件优选为0.01〜0.1L / min的二氧化碳气体流量。温度为200〜800℃，在此条件下形成碳酸钙。

3. 发明授权

US08540903B2 Electrically conductive paste, and electrical and electronic device comprising the same 有权
标题翻译：导电膏，以及包含该导电膏的电气和电子设备
公开(公告)号：US08540903B2
公开(公告)日：2013-09-24
申请号：US12744994
申请日：2008-11-21
申请人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
发明人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
IPC分类号： H01B1/02 , H01B1/22 , H01B1/12 , H05K3/20 , H05K3/30 , H05K1/00 , H05K1/18 , H05K7/00
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译：公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低，其含有减少量的粘度调节/触变性添加剂。选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

4. 发明授权

US08436253B2 Method of manufacturing mounting structure and mounting structure 有权
标题翻译：制造安装结构和安装结构的方法
公开(公告)号：US08436253B2
公开(公告)日：2013-05-07
申请号：US12992306
申请日：2009-03-23
申请人： Takayuki Higuchi , Yoshihiro Tomura , Kazuhiro Nobori , Kentaro Kumazawa
发明人： Takayuki Higuchi , Yoshihiro Tomura , Kazuhiro Nobori , Kentaro Kumazawa
IPC分类号： H05K1/00
CPC分类号： H05K3/305 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/32225 , H01L2224/731 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3011 , H05K2201/0187 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.
摘要翻译：提供一种安装结构，其包括电子部件; 电路板; 第一绝缘树脂和第二绝缘树脂，其被放置在电子部件和电路板之间用于密封; 在电子部件或电路基板上形成多个凸块; 连接到所述多个凸块的所述电路板或所述电子部件的多个对置电极; 和多个接合区域。多个连接区域由第二绝缘树脂形成，多个第一绝缘树脂区域设置在接合区域周围，使得接合区域被多个第一绝缘树脂区域夹持，第一绝缘树脂和第二绝缘树脂区域树脂各自含有填料，第二绝缘树脂的固化温度比第一绝缘树脂的固化温度高。

5. 发明授权

US08163599B2 Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus 失效
标题翻译：倒装芯片安装方法，倒装芯片安装装置和倒装芯片安装装置中使用的工具保护片
公开(公告)号：US08163599B2
公开(公告)日：2012-04-24
申请号：US12933819
申请日：2009-03-30
申请人： Yoshihiro Tomura , Kentaro Kumazawa , Takayuki Higuchi , Koujiro Nakamura
发明人： Yoshihiro Tomura , Kentaro Kumazawa , Takayuki Higuchi , Koujiro Nakamura
IPC分类号： H01L21/44
CPC分类号： H01L24/75 , H01L21/563 , H01L21/568 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75304 , H01L2224/75315 , H01L2224/75317 , H01L2224/75501 , H01L2224/81005 , H01L2224/81203 , H01L2224/81209 , H01L2224/81801 , H01L2224/81907 , H01L2224/83102 , H01L2224/83192 , H01L2224/83203 , H01L2224/83209 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2224/9205 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/15787 , H01L2924/15788 , H01L2924/3025 , Y10T428/249954 , H01L2924/00
摘要： A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.
摘要翻译：倒装芯片安装装置在工具保护片（10）的加压膜（10b）侧具有屏蔽膜（18）。当通过工具保护片（10）对半导体芯片（1）加热加压时，加压膜（10b）通过片材固定夹具（9）从模具中释放，并通过加压/加热工具 11）抵靠从半导体芯片（1）的周围突出的绝缘树脂膜（5），并施加外部压力使绝缘树脂膜（5）固化。

6. 发明授权

US07527689B2 Cement admixture, cement composition, and method for suppressing carbonation using the same 有权
标题翻译：水泥外加剂，水泥组合物及使用其的碳酸化抑制方法
公开(公告)号：US07527689B2
公开(公告)日：2009-05-05
申请号：US11923010
申请日：2007-10-24
申请人： Minoru Morioka , Takayuki Higuchi , Hiroyuki Ohashi , Yasuhiro Nakashima
发明人： Minoru Morioka , Takayuki Higuchi , Hiroyuki Ohashi , Yasuhiro Nakashima
IPC分类号： C04B7/14 , C04B7/153
CPC分类号： C04B14/042 , C04B14/043 , C04B28/08 , C04B28/082 , C04B2111/10 , C04B2111/1068 , C04B2111/22 , C04B20/008 , C04B2103/0089 , C04B7/02
摘要： A cement admixture and a cement composition having a carbonation suppressing effect and a heat-of-hydration suppressing effect are provided. A cement admixture containing one or more non-hydraulic compounds selected from the group consisting of γ-2CaO.SiO2, α-CaO.SiO2 and calcium magnesium silicate, a cement composition containing said admixture, and a carbonation suppressing method by use of said cement admixture or cement composition. According to the present invention, a remarkable carbonation suppressing effect can be obtained particularly when used in portland blast-furnace slag cement. This leads to an effective use of steelmaking slag and the like, and the load of clinker can be reduced, so that a cement composition of a low environmental load type can be attained. Further, this is suitable for cements in conformity with the EN standards, which are used in civil engineering and building industries.
摘要翻译：提供了具有碳酸化抑制效果和水合热抑制效果的水泥混合物和水泥组合物。一种含有一种或多种选自γ-2CaO.SiO2，α-CaO.SiO2和硅酸镁镁的非水力化合物的水泥混合物，含有所述混合物的水泥组合物和使用所述水泥的碳酸化抑制方法外加剂或水泥组合物。根据本发明，特别是当用于波特兰高炉矿渣水泥时，可以获得显着的碳酸化抑制效果。这导致有效地利用炼钢炉渣等，并且可以减少熟料的负荷，从而可以获得低环境负荷型的水泥组合物。此外，这适用于符合在土木工程和建筑行业使用的EN标准的水泥。

7. 发明授权

US08663384B2 Cement admixture and cement composition 有权
标题翻译：水泥外加剂和水泥组成
公开(公告)号：US08663384B2
公开(公告)日：2014-03-04
申请号：US13991524
申请日：2011-10-24
申请人： Takayuki Higuchi , Tsutomu Kida , Ryoetsu Yoshino
发明人： Takayuki Higuchi , Tsutomu Kida , Ryoetsu Yoshino
IPC分类号： C04B22/14 , C04B28/16
CPC分类号： C04B7/28 , C04B28/02 , C04B28/04 , C04B40/0039 , C04B2111/00025 , Y02W30/92 , C04B7/02 , C04B22/008 , C04B22/064 , C04B22/142 , C04B22/143 , C04B2103/58 , C04B18/105 , C04B14/06 , C04B14/28
摘要： The invention provides a cement admixture that improves the ability of concrete to bring about high initial strength, works in favor of enhancing the effect on hexavalent chromium reductions, and is less likely to decrease in the effect on hexavalent chromium reductions even upon storage as well as a method for reducing hexavalent chromium. The invention is embodied as (1) A cement admixture, characterized by comprising an expanding material containing free lime, a hydraulic compound and calcium sulfate anhydrite, and a tin sulfate-containing substance; (2) The cement admixture according to (1), characterized in that the tin sulfate-containing substance is contained in an amount of 0.2 to 8 parts by mass—as calculated on a tin sulfate basis—in a total of 100 parts by mass of the expanding material and the tin sulfate-containing substance; (3) The cement admixture according to (1) or (2), characterized in that the expanding material has been treated with carbon dioxide gas to form calcium carbonate therein; (4) The cement admixture according to any one of (1) to (3), characterized in that the expanding material has been surface treated with a shrinkage reducer; (5) A cement composition, characterized by containing cement, and the cement admixture according to any one of (1) to (4); and (6) A method for reducing hexavalent chromium, characterized by use of the cement composition according to (5).
摘要翻译：本发明提供了一种提高混凝土产生高初始强度的能力的水泥混合物，有利于增加对六价铬还原的影响，并且即使在储存时也不太可能降低对六价铬还原的影响，以及一种降低六价铬的方法。本发明体现为：（1）一种水泥混合物，其特征在于包含含有游离石灰的膨胀材料，水硬性化合物和无水硫酸钙，以及含硫酸锡物质; （2）根据（1）所述的水泥混合物，其特征在于，所述含硫酸锡物质的含量为0.2〜8质量份（以硫酸锡为基准），总计为100质量份的膨胀材料和含硫酸锡物质; （3）根据（1）或（2）所述的水泥外加剂，其特征在于，所述膨胀材料已经用二氧化碳气体处理以在其中形成碳酸钙; （4）如（1）〜（3）中任一项所述的水泥外加剂，其特征在于，所述膨胀材料用减缩剂进行表面处理; （5）一种水泥组合物，其特征在于含有水泥，和（1）〜（4）中任一项所述的水泥混合物; （6）一种减少六价铬的方法，其特征在于使用（5）所述的水泥组合物。

8. 发明授权

US08273816B2 Alumina fiber aggregate, process for producing the same, and use thereof 有权
标题翻译：氧化铝纤维聚集体，其制造方法及其用途
公开(公告)号：US08273816B2
公开(公告)日：2012-09-25
申请号：US12682471
申请日：2008-09-29
申请人： Yasutaka Ohshima , Isamu Hirano , Takayuki Higuchi
发明人： Yasutaka Ohshima , Isamu Hirano , Takayuki Higuchi
IPC分类号： C08K3/18
CPC分类号： C08J5/041 , C04B35/62236 , C04B35/62245 , C04B35/6261 , C04B2235/526 , C04B2235/5264
摘要： An object of the invention is to provide an alumina fiber aggregate which, when used as a filler in various materials such as, e.g., resins, coating materials, metals, and ceramics, enables the mixtures to have reduced viscosity and thereby heightens the productivity of products containing alumina fibers, and which enables cured thermosetting resins to have a sufficiently heightened thermal conductivity.This alumina fiber aggregate, when examined by the electron microscope method, gives a frequency distribution regarding number of fibers, wherein the number of fibers having a fiber length of 50-200 μm is 70% or more (including 100%), the number of fibers having a fiber length smaller than 50 μm is 30% or less (including 0), the number of fibers of 50-100 μm is 30-50%, the number of fibers longer than 100 μm but not longer than 200 μm is 30-50%, and the number of fibers longer than 200 μm is 20% or less (including 0). The fibrous mass comprises 70-100% by mass of Al2O3 and 0-30% by mass of SiO2.
摘要翻译：本发明的目的是提供一种氧化铝纤维聚集体，当用作诸如树脂，涂料，金属和陶瓷的各种材料中的填料时，使得混合物具有降低的粘度，从而提高生产率含有氧化铝纤维的产品，并且使固化的热固性树脂具有足够高的导热性。当通过电子显微镜方法检查时，该氧化铝纤维聚集体给出了关于纤维数量的频率分布，其中纤维长度为50-200μm的纤维的数量为70％以上（包括100％），数量纤维长度小于50μm的纤维为30％以下（包括0），50〜100μm的纤维数为30〜50％，长于100μm且不超过200μm的纤维数为30根 -50％，长于200μm的纤维数为20％以下（包括0）。纤维质量包含70-100质量％的Al 2 O 3和0〜30质量％的SiO 2。

9. 发明授权

US08182923B2 Conductive paste and mounting structure using the same 有权
标题翻译：导电胶和使用其的安装结构
公开(公告)号：US08182923B2
公开(公告)日：2012-05-22
申请号：US12427275
申请日：2009-04-21
申请人： Naomichi Ohashi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Takayuki Higuchi
发明人： Naomichi Ohashi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Takayuki Higuchi
IPC分类号： H01B1/22 , B32B15/08
CPC分类号： H01B1/22 , B23K35/025 , B23K35/262 , B23K2101/36 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K3/3484 , H05K2201/0272 , Y10T428/31681 , H01L2224/05599
摘要： A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
摘要翻译：导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点第二导电填料15℃至45℃。并且第二通量的熔点等于或小于第二导电填料的熔点。

10. 发明授权

US08012379B2 Electroconductive bonding material and electric/electronic device using the same 失效
标题翻译：导电接合材料和使用其的电气/电子设备
公开(公告)号：US08012379B2
公开(公告)日：2011-09-06
申请号：US12870275
申请日：2010-08-27
申请人： Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
发明人： Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
IPC分类号： H01B1/02 , B05D7/00
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译：提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。导电接合材料可能含有香料。

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