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    • 4. 发明授权
    • Disk drive device
    • 磁盘驱动器
    • US07872836B2
    • 2011-01-18
    • US12008275
    • 2008-01-09
    • Hitoshi ShindoTeruhiro NakamiyaKouki UefumeTakako Hayakawa
    • Hitoshi ShindoTeruhiro NakamiyaKouki UefumeTakako Hayakawa
    • G11B33/14
    • G11B33/1466G11B25/043G11B33/122
    • In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.
    • 在其中密封低密度气体的盘驱动装置中,本发明的实施例有助于提高馈通和外壳之间的焊接部分处的关节可靠性,这是由于由于使用中的温度环境变化而引起的变形而施加的应力 。 根据一个实施例,氦气密封在HDD的内部空间中。 馈通焊接到基座的馈通安装表面。 在具有相对较大的热应力的部分,馈通安装面的宽度增加,并且在热应力相对较小的部分,馈通安装面的宽度减小。 这防止由于热应力而在焊接部分产生裂纹穿透路径,并且防止焊接部分接触销。
    • 5. 发明授权
    • Data storage device
    • 数据存储设备
    • US08035923B2
    • 2011-10-11
    • US12287467
    • 2008-10-08
    • Hiroyuki SuzukiTeruhiro NakamiyaTakashi Kouno
    • Hiroyuki SuzukiTeruhiro NakamiyaTakashi Kouno
    • G11B5/48
    • G11B25/043G11B33/1466
    • Embodiments of the present invention help to provide a sealed hard disk drive (HDD) with high reliability. According to one embodiment, a HDD is a hermetically sealed HDD. A base has an opening of a through-hole on its bottom; a feedthrough is provided so as to close the opening. A flange of the feedthrough has a larger outline than the opening, and its rim is joined to the base with solder at the solder joint. The solder at the solder joint is mainly composed of Sn and contains 15 atomic percent to 27 atomic percent of indium. This solder reaches the γ phase from −150° C. to 120° C. Accordingly, even if the HDD has been exposed at low temperature for a long time, the solder joint is not broken so that helium gas does not leak.
    • 本发明的实施例有助于提供高可靠性的密封硬盘驱动器(HDD)。 根据一个实施例,HDD是气密密封的HDD。 基底在其底部具有通孔的开口; 提供馈通以便关闭开口。 馈通的凸缘具有比开口更大的轮廓,并且其边缘在焊接点处与焊料接合到基部。 焊点处的焊料主要由Sn构成,含有15原子%〜27原子%的铟。 该焊料从-150℃到120℃达到γ相。因此,即使HDD在低温下长期暴露,焊接接头也不会断裂,因此氦气不会泄漏。
    • 7. 发明申请
    • Disk drive device and manufacturing method thereof
    • 磁盘驱动装置及其制造方法
    • US20090097375A1
    • 2009-04-16
    • US12287595
    • 2008-10-10
    • Kouki UefuneTakako HayakawaTeruhiro NakamiyaKazuhide Ichikawa
    • Kouki UefuneTakako HayakawaTeruhiro NakamiyaKazuhide Ichikawa
    • G11B33/02G11B5/127
    • G11B25/043G11B33/122Y10T29/49025
    • Embodiments of the present invention provide a simpler, miniaturizable, and highly reliable hermetically sealed enclosure structure in a disk drive device. According to one embodiment, a hard disk drive (HDD) comprises an HDD main unit, a case for housing the HDD main unit, a lid with a feedthrough function for closing an opening of the case, and an FPC connector for interconnecting the HDD main unit and a plurality of pins fixed to the lid. The lid is joined to the case and completely closes the opening of the case. The case and the lid form a sealed enclosure; the internal HDD main unit is housed in the sealed space. Housing the HDD main unit in a sealed space may increase resistance of the HDD to external environmental changes. Sealing low density gas like helium in the sealed space may improve the performance of the HDD.
    • 本发明的实施例提供了一种在盘驱动装置中更简单,可微型化和高度可靠的气密密封结构。 根据一个实施例,硬盘驱动器(HDD)包括HDD主单元,用于容纳HDD主单元的壳体,具有用于关闭壳体的开口的馈通功能的盖以及用于将HDD主体互连的FPC连接器 单元和固定到盖的多个销。 盖子连接到壳体并完全关闭壳体的开口。 外壳和盖子形成密封的外壳; 内部HDD主机容纳在密封空间中。 将HDD主机安装在密封空间中可能会增加HDD对外部环境变化的阻力。 在密封空间中密封低密度气体如氦可以提高HDD的性能。
    • 8. 发明授权
    • Disk-enclosure base configured to inhibit formation of adherent solder-flux residue
    • 配置为防止粘附焊剂残留物形成的盘形外壳基座
    • US08749914B2
    • 2014-06-10
    • US13228363
    • 2011-09-08
    • Noritaka OtakeTakako HayakawaKazuhide IchikawaTeruhiro Nakamiya
    • Noritaka OtakeTakako HayakawaKazuhide IchikawaTeruhiro Nakamiya
    • G11B5/127
    • G11B33/1446G11B25/043G11B33/122
    • A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interior surface of the casting. The E-coat-free zone is adjacent to and surrounds the solder channel. The E-coat-free zone also includes a second portion of the interior surface of the casting lying between the solder channel and the E-coated first portion of the interior surface of the casting. The E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, and a hard-disk drive (HDD) including the disk-enclosure-base/electrical-feedthrough assembly are also provided.
    • 配置为抑制粘附焊剂残留物形成的盘形外壳基座。 圆盘外壳底座包括铸件,在铸件中制造的通孔,焊接通道,E涂层和无E涂层区域。 将E涂层施加到铸件的内表面的第一部分。 电镀无区域与焊料通道相邻并围绕。 无涂层区域还包括位于焊料通道和铸件内表面的E涂覆的第一部分之间的铸件的内表面的第二部分。 无涂层区域被配置为抑制粘附焊剂残留物的形成。 还提供了被配置为抑制粘附焊料残余物的形成的盘形外壳 - 基座/电气馈通组件,以及包括盘 - 外壳 - 电 - 馈电组件的硬盘驱动器(HDD)。
    • 9. 发明申请
    • DISK-ENCLOSURE BASE CONFIGURED TO INHIBIT FORMATION OF ADHERENT SOLDER-FLUX RESIDUE
    • 配置禁止形成附加焊剂通道残留物的封装基板
    • US20130063838A1
    • 2013-03-14
    • US13228363
    • 2011-09-08
    • Noritaka OtakeTakako HayakawaKazuhide IchikawaTeruhiro Nakamiya
    • Noritaka OtakeTakako HayakawaKazuhide IchikawaTeruhiro Nakamiya
    • G11B5/012H05K5/02
    • G11B33/1446G11B25/043G11B33/122
    • A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interior surface of the casting. The E-coat-free zone is adjacent to and surrounds the solder channel. The E-coat-free zone also includes a second portion of the interior surface of the casting lying between the solder channel and the E-coated first portion of the interior surface of the casting. The E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, and a hard-disk drive (HDD) including the disk-enclosure-base/electrical-feedthrough assembly are also provided.
    • 配置为抑制粘附焊剂残留物形成的盘形外壳基座。 圆盘外壳底座包括铸件,在铸件中制造的通孔,焊接通道,E涂层和无E涂层区域。 将E涂层施加到铸件的内表面的第一部分。 电镀无区域与焊料通道相邻并围绕。 无涂层区域还包括位于焊料通道和铸件内表面的E涂覆的第一部分之间的铸件的内表面的第二部分。 无涂层区域被配置为抑制粘附焊剂残留物的形成。 还提供了被配置为抑制粘附焊料残余物的形成的盘形外壳 - 基座/电气馈通组件,以及包括盘 - 外壳 - 电 - 馈电组件的硬盘驱动器(HDD)。