专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5288843A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5288843A
公开(公告)日：1994-02-22
申请号：US608727
申请日：1990-11-05
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26 , C08G8/02
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

2. 发明授权

US5157085A Polyimide resin composition 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：US5157085A
公开(公告)日：1992-10-20
申请号：US321107
申请日：1989-03-09
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10S525/906 , Y10S525/928
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: ##STR1##

3. 发明授权

US5041520A Process for preparing polyimide having excellent high temperature stability 失效
标题翻译：制备具有优异的高温稳定性的聚酰亚胺的方法
公开(公告)号：US5041520A
公开(公告)日：1991-08-20
申请号：US371072
申请日：1989-06-26
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G73/14
CPC分类号： C08G73/14 , C08G73/1003 , C08G73/1014 , C08G73/1042 , C08G73/1078
摘要： Disclosed is a process for preparing a polyimide by reacting certain reactants. The reactants include an aromatic diamine which is 3,3'-diaminobenzophenone and/or bis(3-aminophenyl)sulfone, a tetrocarboxylic dianhydride and a dicarboxylic anhydride. A thermally stable polyimide can be obtained which displays excellent processability.

4. 发明授权

US4987197A Polyimide/polyamideimide resin composition 失效
标题翻译：聚酰亚胺/聚酰胺酰亚胺树脂组合物
公开(公告)号：US4987197A
公开(公告)日：1991-01-22
申请号：US341810
申请日：1989-04-24
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide. The polyimide consists essentially of recurring units of the following formula: ##STR1## wherein X is ##STR2## and R is, for example, ##STR3##

5. 发明授权

US4937316A Process for preparing polyimides 失效
标题翻译：聚酰亚胺的制备方法
公开(公告)号：US4937316A
公开(公告)日：1990-06-26
申请号：US313732
申请日：1989-02-22
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G73/14
CPC分类号： C08G73/1014 , C08G73/14
摘要： A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.

6. 发明授权

US5380805A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5380805A
公开(公告)日：1995-01-10
申请号：US143105
申请日：1993-10-29
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

7. 发明授权

US5459233A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
公开(公告)号：US5459233A
公开(公告)日：1995-10-17
申请号：US143148
申请日：1993-12-07
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

8. 发明授权

US4931531A Polyimide and high-temperature adhesive thereof 失效
标题翻译：聚酰亚胺及其高温粘合剂
公开(公告)号：US4931531A
公开(公告)日：1990-06-05
申请号：US210789
申请日：1988-06-24
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： H01L21/265 , C08G73/10 , C08L79/08 , H01J37/317
CPC分类号： C08G73/1064 , C08G73/1071
摘要： This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide.The polyimide consists essentially of recurring units of the formula: ##STR1## where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member.The polyimide can be prepared by reacting bis[4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, bis(3,4-diarboxyphenyl) ether dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, and 4,4'-(p-phenylenedioxy)diphthalic dianhydride.
摘要翻译：本发明涉及一种耐高温且能够熔融融合的新型聚酰亚胺。本发明还涉及使用该聚酰亚胺的高温粘合剂。聚酰亚胺基本上由下式的重复单元组成：其中R是选自具有2个或更多个碳原子的脂族基团，脂环族基团，单芳族基团，稠合多芳族基团和非芳族基团的四价基团，其中芳族基团直接或通过桥连构件彼此连接。聚酰亚胺可以通过使双[4-（4-（4-（4-氨基苯氧基）苯氧基）苯基]砜与四羧酸二酐在有机溶剂中反应制备，并酰亚胺化得到的聚酰胺酸。可以使用各种四羧酸二酐，优选二酐是均苯四酸二酐，3,3分钟，4,4分钟 - 二苯甲酮四羧酸二酐，双（3,4-二羧基苯基）醚二酐，3,3分钟，4,4分钟 - 联苯四羧酸二酐，和4,4分钟 - （对亚苯基二氧基）二邻苯二甲酸二酐。

9. 发明授权

US5506311A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
公开(公告)号：US5506311A
公开(公告)日：1996-04-09
申请号：US335332
申请日：1994-11-03
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L79/08 , C08L81/04
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

10. 发明授权

US5086125A Polyimide resin composition 失效
公开(公告)号：US5086125A
公开(公告)日：1992-02-04
申请号：US574502
申请日：1990-08-24
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10S525/906 , Y10S525/928
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin composition of this invention comprises 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide has recurring units of the following formula: ##STR1## wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, ##STR2## The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: ##STR3## aromatic polysulfone consisting of recurring units of the formula: ##STR4## or aromatic polyetherimide consisting of recurring units of the formula: ##STR5##

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式