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    • 7. 发明申请
    • PNEUMATIC TIRE
    • 气动轮胎
    • US20120145295A1
    • 2012-06-14
    • US13323858
    • 2011-12-13
    • Hiroshi YAMADA
    • Hiroshi YAMADA
    • B60C11/11B60C11/12B60C11/13B60C11/117
    • B60C11/1369B60C11/0306B60C11/11B60C11/12B60C11/125B60C2011/133
    • A pneumatic tire comprises a tread portion divided into a crown land region, two middle land regions and two shoulder land regions. The crown land region and middle land regions are each divided into triangular blocks by axial grooves arranged in a zigzag fashion. The shoulder land regions are each divided into shoulder blocks by axial grooves extending at an angle of not less than 70 degrees. The shoulder block is subdivided into an axially inner part and an axially outer part by a secondary groove extending at an angle of not more than 10 degrees. The outer part is provided with sipes extending at an angle of not less than 70 degrees, each angle with respect the circumferential direction.
    • 充气轮胎包括分割成胎冠区域,两个中间区域区域和两个胎肩区域的胎面部分。 冠部陆地区域和中间陆地区域以锯齿形的方式被分成三角形块状的轴向凹槽。 肩部陆地区域通过以不小于70度的角度延伸的轴向凹槽分成肩部块。 肩部块通过以不大于10度的角度延伸的次级槽细分成轴向内部部分和轴向外部部分。 外侧部分设置有以不小于70度的角度延伸的刀槽花纹,每个角度相对于圆周方向。
    • 9. 发明申请
    • PROBE APPARATUS
    • 探测器
    • US20090315580A1
    • 2009-12-24
    • US12484518
    • 2009-06-15
    • Hiroshi YAMADA
    • Hiroshi YAMADA
    • G01R31/02
    • G01R31/2891
    • A probe apparatus includes a mounting table having a mounting table main body and a chuck top, cylinder mechanisms surrounding a mount of the chuck top, and a connecting mechanism to releasably connect the cylinder mechanisms to a head plate horizontally supporting a probe card. When a semiconductor wafer, mounted on the mount, comes into contact with probes of the probe card, a control unit operates the cylinder mechanisms and the connecting mechanism to connect the cylinder mechanisms to the head plate. Thereafter, the control unit further operates the cylinder mechanisms, to move the chuck top upward from the mounting table main body by a predetermined overdrive amount. Accordingly, the probe apparatus achieves an originally required contact load between the semiconductor wafer and the probes of the probe card while preventing the probe card from being displaced upward during overdriving of the semiconductor wafer, thereby enabling a highly reliable test.
    • 探针装置包括具有安装台主体和卡盘顶部的安装台,围绕卡盘顶部的安装件的气缸机构,以及将气缸机构可释放地连接到水平支撑探针卡的头板的连接机构。 当安装在安装件上的半导体晶片与探针卡的探针接触时,控制单元操作气缸机构和连接机构以将气缸机构连接到头板。 此后,控制单元进一步操作气缸机构,以使卡盘顶部从安装台主体向上移动预定的过驱动量。 因此,探针装置在半导体晶片和探针卡的探针之间达到最初所需的接触负载,同时防止探针卡在半导体晶片的过驱动期间向上移位,从而实现高度可靠的测试。