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1. 发明授权

US07633366B2 Wire-wound coil 有权
标题翻译：绕线线圈
公开(公告)号：US07633366B2
公开(公告)日：2009-12-15
申请号：US12124314
申请日：2008-05-21
申请人： Shinya Hirai , Takaomi Toi
发明人： Shinya Hirai , Takaomi Toi
IPC分类号： H01F27/02
CPC分类号： H01F17/045 , H01F3/12 , H01F27/263
摘要： A wire-wound coil includes a ferrite core having a winding core portion and flange portions, a wire wound around the winding core portion, electrodes connected to the wire on lower surfaces of the flange portions, and a ferrite plate attached to upper surfaces of both of the end flange portions so as to extend over the winding core portion. The flange portions and the ferrite plate are provided with corresponding recessed and projecting portions and, and the flange portions and the ferrite plate are integrated through the recessed and projecting portions. Joint sections between the flange portions and the ferrite plate include contact sections that are in direct contact with each other, and adhesion sections arranged to receive an adhesive.
摘要翻译：线绕线圈包括具有绕组芯部分和凸缘部分的铁氧体磁芯，缠绕在绕组芯部分上的电线，连接到凸缘部分的下表面上的电线的电极和连接到两个的上表面的铁氧体板的端部凸缘部分，以便在绕组芯部分上延伸。凸缘部分和铁氧体板设置有相应的凹凸部分，并且凸缘部分和铁氧体板通过凹入和突出部分一体化。凸缘部和铁氧体板之间的接合部分包括彼此直接接触的接触部分和布置成接收粘合剂的粘合部分。

2. 发明申请

US20060033603A1 Wire-wound type chip coil and method of adjusting a characteristic thereof 有权
标题翻译：线绕型芯片线圈及其特性的调整方法
公开(公告)号：US20060033603A1
公开(公告)日：2006-02-16
申请号：US11232802
申请日：2005-09-21
申请人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
发明人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
IPC分类号： H01F5/00
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49076
摘要： A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specific fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
摘要翻译：线绕型芯片线圈可以采用各种电感值，同时保持其外部尺寸在特定的固定值。通过在由磁性材料制成的芯周围的单层中规则地缠绕至少两根导线并将每根导线的两端牢固地连接到设置在芯的相应凸缘上的端子电极而形成芯片线圈。这使得可以获得大的电流容量。此外，由于磁路长度的增加，电感减小。通过适当地选择包括基本平行的导线的数量，每个导线的直径和匝数的参数，可以容易地获得大量不同的电感值。

3. 发明申请

US20050146409A1 Wire-wound type chip coil and method of adjusting a characteristic thereof 有权
标题翻译：线绕型芯片线圈及其特性的调整方法
公开(公告)号：US20050146409A1
公开(公告)日：2005-07-07
申请号：US11062270
申请日：2005-02-18
申请人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
发明人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
IPC分类号： H01F41/00 , H01F17/04 , H01F27/29 , H01F27/02
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49076
摘要： A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specified fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
摘要翻译：线绕型芯片线圈可以采用各种电感值，同时将其外形尺寸保持在规定的固定值。通过在由磁性材料制成的芯周围的单层中规则地缠绕至少两根导线并将每根导线的两端牢固地连接到设置在芯的相应凸缘上的端子电极而形成芯片线圈。这使得可以获得大的电流容量。此外，由于磁路长度的增加，电感减小。通过适当地选择包括基本平行的导线的数量，每个导线的直径和匝数的参数，可以容易地获得大量不同的电感值。

4. 发明申请

US20080224813A1 WIRE-WOUND COIL 有权
标题翻译：电线圈
公开(公告)号：US20080224813A1
公开(公告)日：2008-09-18
申请号：US12124314
申请日：2008-05-21
申请人： Shinya Hirai , Takaomi Toi
发明人： Shinya Hirai , Takaomi Toi
IPC分类号： H01F27/26
CPC分类号： H01F17/045 , H01F3/12 , H01F27/263
摘要： A wire-wound coil includes a ferrite core having a winding core portion and flange portions, a wire wound around the winding core portion, electrodes connected to the wire on lower surfaces of the flange portions, and a ferrite plate attached to upper surfaces of both of the end flange portions so as to extend over the winding core portion. The flange portions and the ferrite plate are provided with corresponding recessed and projecting portions and, and the flange portions and the ferrite plate are integrated through the recessed and projecting portions. Joint sections between the flange portions and the ferrite plate include contact sections that are in direct contact with each other, and adhesion sections arranged to receive an adhesive.
摘要翻译：线绕线圈包括具有绕组芯部分和凸缘部分的铁氧体磁芯，缠绕在绕组芯部分上的电线，连接到凸缘部分的下表面上的电线的电极和连接到两个的上表面的铁氧体板的端部凸缘部分，以便在绕组芯部分上延伸。凸缘部分和铁氧体板设置有相应的凹凸部分，并且凸缘部分和铁氧体板通过凹入和突出部分一体化。凸缘部和铁氧体板之间的接合部分包括彼此直接接触的接触部分和布置成接收粘合剂的粘合部分。

5. 发明授权

US07196608B2 Wire-wound type chip coil and method of adjusting a characteristic thereof 有权
标题翻译：线绕型芯片线圈及其特性的调整方法
公开(公告)号：US07196608B2
公开(公告)日：2007-03-27
申请号：US11232802
申请日：2005-09-21
申请人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
发明人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
IPC分类号： H01F5/00
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49076
摘要： A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specific fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
摘要翻译：线绕型芯片线圈可以采用各种电感值，同时保持其外部尺寸在特定的固定值。通过在由磁性材料制成的芯周围的单层中规则地缠绕至少两根导线并将每根导线的两端牢固地连接到设置在芯的相应凸缘上的端子电极而形成芯片线圈。这使得可以获得大的电流容量。此外，由于磁路长度的增加，电感减小。通过适当地选择包括基本平行的导线的数量，每个导线的直径和匝数的参数，可以容易地获得大量不同的电感值。

6. 发明授权

US07373715B2 Method of adjusting a characteristic of wire-wound type chip coil by adjusting the space between conductive wires 有权
标题翻译：通过调节导线之间的空间来调整绕线式芯片线圈的特性的方法
公开(公告)号：US07373715B2
公开(公告)日：2008-05-20
申请号：US11062270
申请日：2005-02-18
申请人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
发明人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
IPC分类号： H01F7/06
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49076
摘要： A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specified fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
摘要翻译：线绕型芯片线圈可以采用各种电感值，同时将其外形尺寸保持在规定的固定值。通过在由磁性材料制成的芯周围的单层中规则地缠绕至少两根导线并将每根导线的两端牢固地连接到设置在芯的相应凸缘上的端子电极而形成芯片线圈。这使得可以获得大的电流容量。此外，由于磁路长度的增加，电感减小。通过适当地选择包括基本平行的导线的数量，每个导线的直径和匝数的参数，可以容易地获得大量不同的电感值。

7. 发明授权

US06965289B2 Common-mode choke coil 有权
标题翻译：共模扼流线圈
公开(公告)号：US06965289B2
公开(公告)日：2005-11-15
申请号：US10244759
申请日：2002-09-17
申请人： Takaomi Toi , Yoshio Hanato , Tatsuyuki Yamada
发明人： Takaomi Toi , Yoshio Hanato , Tatsuyuki Yamada
IPC分类号： H01F1/37 , H01F3/10 , H01F3/12 , H01F17/04 , H01F27/29 , H01F27/36 , H03H1/00 , H01F27/02
CPC分类号： H01F27/365 , H01F3/10 , H01F3/12 , H01F17/045 , H01F27/292
摘要： A common-mode choke coil includes a core having flanges disposed at both ends and a winding section arranged between the flanges. Electrodes are disposed in the flanges, while two pieces of wire are wound around the winding section and ends of the pieces of wire are connected to the electrodes. A ferrite plate with a relative magnetic permeability that is smaller than that of the core is attached on the upper surface of the flanges with an adhesive so as to cover the wire.
摘要翻译：共模扼流线圈包括具有布置在两端的凸缘的芯体和布置在凸缘之间的绕组部分。电极设置在凸缘中，而两根电线缠绕在绕组部分上，并且电线片的端部连接到电极。具有小于芯的相对导磁率的铁氧体板用粘合剂附着在法兰的上表面上以覆盖电线。

8. 发明授权

US06552642B1 Electronic device having electric wires and method of producing same 有权
标题翻译：具有电线的电子装置及其制造方法
公开(公告)号：US06552642B1
公开(公告)日：2003-04-22
申请号：US09317665
申请日：1999-05-24
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： H01F2729
CPC分类号： B23K20/023 , B23K2101/40 , H01F17/045 , H01F27/292 , H01F41/10 , H01L2924/0002 , H01L2924/00
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
摘要翻译：包括以高度可靠的方式牢固地连接到电极的电线的芯片线圈等电子装置被构造成以稳定可靠的方式安装在印刷电路板或基板上。在芯片线圈的芯的两端，设置有包括由Ag，Ag-Pd或类似材料制成的高导电层的多层结构的电极; 由Ni制成的阻焊层; 以及由Sn或焊料制成的易焊层。电线的端部埋设在易焊接层中，使得所得的电极结构具有基本平坦的表面。进行热压处理，使得电线的端部通过固体焊接与阻焊层连接，并通过钎焊与易焊接层连接。

9. 发明授权

US6119924A Electronic device having electric wires and method of producing same 有权
公开(公告)号：US6119924A
公开(公告)日：2000-09-19
申请号：US432979
申请日：1999-11-03
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , B23K20/00
CPC分类号： B23K20/023 , B23K2201/40
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

10. 发明授权

US06027008A Electronic device having electric wires and method of producing same 失效
公开(公告)号：US06027008A
公开(公告)日：2000-02-22
申请号：US076549
申请日：1998-05-12
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , H01F17/04 , H01F27/29 , H01F41/10 , H05K3/34 , H01L21/603 , H01L21/607
CPC分类号： B23K20/023 , H01F27/292 , H01F41/10 , B23K2201/40 , H01F17/045 , H01L2924/0002
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

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