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1. 发明授权

US08597755B2 Resin welded body and manufacturing method thereof 有权
标题翻译：树脂焊接体及其制造方法
公开(公告)号：US08597755B2
公开(公告)日：2013-12-03
申请号：US11892039
申请日：2007-08-20
申请人： Seizo Fujimoto , Takafumi Hara , Shinsuke Asada , Hiroshi Kobayashi , Masaaki Taruya
发明人： Seizo Fujimoto , Takafumi Hara , Shinsuke Asada , Hiroshi Kobayashi , Masaaki Taruya
IPC分类号： B32B9/00 , B29C65/16
CPC分类号： B29C65/1635 , B29C65/7829 , B29C66/112 , B29C66/114 , B29C66/24221 , B29C66/54 , B29C66/542 , B29C66/55 , B29C66/7392 , B29C66/7394 , B29C66/8322 , B29C66/836 , B29K2995/0027 , B29L2031/3481 , Y10T428/17 , Y10T428/19 , Y10T428/8305
摘要： A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.
摘要翻译：一种树脂焊接体，其中相对于激光吸收的第一树脂部分和相对于激光透明的第二树脂部分被装配在一起，并且激光从第二树脂的侧面发射到预定位置将第一和第二树脂部分接合在一起并形成两个树脂部分之间的接合部分，其中在第一或第二树脂部分上设置有在焊接期间与另一个树脂部分接触的突起并调节在接合部处的下沉量。

2. 发明授权

US08110062B2 Welding method and welding apparatus for resin member 有权
标题翻译：用于树脂构件的焊接方法和焊接装置
公开(公告)号：US08110062B2
公开(公告)日：2012-02-07
申请号：US12100086
申请日：2008-04-09
申请人： Shinsuke Asada , Takafumi Hara , Seizo Fujimoto , Masaaki Taruya
发明人： Shinsuke Asada , Takafumi Hara , Seizo Fujimoto , Masaaki Taruya
IPC分类号： B32B37/06
CPC分类号： B29C65/7829 , B29C65/1612 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/1674 , B29C65/1677 , B29C65/1687 , B29C65/1696 , B29C65/7802 , B29C65/7841 , B29C66/112 , B29C66/114 , B29C66/24221 , B29C66/32 , B29C66/53461 , B29C66/542 , B29C66/71 , B29C66/7332 , B29C66/73921 , B29C66/81267 , B29C66/81427 , B29C66/8322 , B29C66/9231 , B29C66/92611 , B29C66/92651 , B29C66/932 , B29C66/93441 , B29C66/9392 , B29C66/961 , B29K2067/00 , B29K2995/0027 , B65B7/28 , B65B51/10 , B29C65/00 , B29K2081/04 , B29K2077/00 , B29K2071/00 , B29K2069/00 , B29K2067/006 , B29K2067/003 , B29K2023/06
摘要： A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.
摘要翻译：提供了一种用于树脂构件的焊接方法和焊接装置，其中可以确保两个树脂构件在焊接之后的尺寸精度，并且可以防止由于过度的激光照射导致的接合强度的降低。在叠加具有激光透射性的树脂和具有激光吸收性的树脂的方法中，并且用激光束从激光透射树脂构件侧照射树脂构件以将树脂构件彼此沉积，根据在激光束照射期间两个树脂构件的接近速度的降低，激光束结束。

3. 发明授权

US07862874B2 Welded resin material 有权
标题翻译：焊接树脂材料
公开(公告)号：US07862874B2
公开(公告)日：2011-01-04
申请号：US11867979
申请日：2007-10-05
申请人： Shinsuke Asada , Takafumi Hara , Seizo Fujimoto , Masaaki Taruya
发明人： Shinsuke Asada , Takafumi Hara , Seizo Fujimoto , Masaaki Taruya
IPC分类号： B32B3/02 , B29C65/16
CPC分类号： B29C66/3242 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/1674 , B29C65/1696 , B29C65/7829 , B29C66/112 , B29C66/114 , B29C66/322 , B29C66/326 , B29C66/3282 , B29C66/542 , B29C66/71 , B29C66/7332 , B29C66/7392 , B29C66/81267 , B29C66/8322 , B29K2023/06 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2081/04 , B29K2995/0027 , Y10T428/195 , Y10T428/8305 , B29C65/00 , B29K2071/00 , B29K2067/003
摘要： A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.
摘要翻译：一种焊接树脂材料的制造方法，包括以下步骤：将具有透光性的树脂构件与激光重叠，对具有对激光具有吸收性的树脂构件形成树脂构件彼此接触的接触部; 形成与所述接触部相邻的面向所述接触部的一端的封闭空间; 并且在通过接触部分将树脂构件相互挤压的同时，从具有透光性的树脂构件照射激光，从而加热接触部分以熔化接触部分处的树脂，通过熔化将不接触接触部分的树脂在封闭空间中固化在接触部分熔化的树脂以熔化树脂构件。

4. 发明申请

US20080261065A1 Resin welded body and manufacturing method thereof 有权
标题翻译：树脂焊接体及其制造方法
公开(公告)号：US20080261065A1
公开(公告)日：2008-10-23
申请号：US11892039
申请日：2007-08-20
申请人： Seizo Fujimoto , Takafumi Hara , Shinsuke Asada , Hiroshi Kobayashi , Masaaki Taruya
发明人： Seizo Fujimoto , Takafumi Hara , Shinsuke Asada , Hiroshi Kobayashi , Masaaki Taruya
IPC分类号： B32B9/00 , B29C65/16
CPC分类号： B29C65/1635 , B29C65/7829 , B29C66/112 , B29C66/114 , B29C66/24221 , B29C66/54 , B29C66/542 , B29C66/55 , B29C66/7392 , B29C66/7394 , B29C66/8322 , B29C66/836 , B29K2995/0027 , B29L2031/3481 , Y10T428/17 , Y10T428/19 , Y10T428/8305
摘要： A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.
摘要翻译：一种树脂焊接体，其中相对于激光吸收的第一树脂部分和相对于激光透明的第二树脂部分被装配在一起，并且激光从第二树脂的侧面发射到预定位置将第一和第二树脂部分接合在一起并形成两个树脂部分之间的接合部分，其中在第一或第二树脂部分上设置有在焊接期间与另一个树脂部分接触的突起并调节在接合部处的下沉量。

5. 发明申请

US20080254242A1 METHOD FOR PRODUCING WELDED RESIN MATERIAL AND WELDED RESIN MATERIAL 有权
标题翻译：生产焊接树脂材料和焊接树脂材料的方法
公开(公告)号：US20080254242A1
公开(公告)日：2008-10-16
申请号：US11867979
申请日：2007-10-05
申请人： Shinsuke ASADA , Takafumi Hara , Seizo Fujimoto , Masaaki Taruya
发明人： Shinsuke ASADA , Takafumi Hara , Seizo Fujimoto , Masaaki Taruya
IPC分类号： B32B27/00
CPC分类号： B29C66/3242 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/1674 , B29C65/1696 , B29C65/7829 , B29C66/112 , B29C66/114 , B29C66/322 , B29C66/326 , B29C66/3282 , B29C66/542 , B29C66/71 , B29C66/7332 , B29C66/7392 , B29C66/81267 , B29C66/8322 , B29K2023/06 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2081/04 , B29K2995/0027 , Y10T428/195 , Y10T428/8305 , B29C65/00 , B29K2071/00 , B29K2067/003
摘要： A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.
摘要翻译：一种焊接树脂材料的制造方法，包括以下步骤：将具有透光性的树脂构件与激光重叠，对具有对激光具有吸收性的树脂构件形成树脂构件彼此接触的接触部; 形成与所述接触部相邻的面向所述接触部的一端的封闭空间; 并且在通过接触部分将树脂构件相互挤压的同时，从具有透光性的树脂构件照射激光，从而加热接触部分以熔化接触部分处的树脂，通过熔化将不接触接触部分的树脂在封闭空间中固化在接触部分熔化的树脂以熔化树脂构件。

6. 发明授权

US07219554B2 Semiconductor pressure sensor 有权
标题翻译：半导体压力传感器
公开(公告)号：US07219554B2
公开(公告)日：2007-05-22
申请号：US11225019
申请日：2005-09-14
申请人： Seizo Fujimoto , Takafumi Hara , Masaaki Taruya
发明人： Seizo Fujimoto , Takafumi Hara , Masaaki Taruya
IPC分类号： G01L9/00
CPC分类号： G01L9/0055 , G01L19/069
摘要： A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.
摘要翻译：半导体压力传感器不受受测流体中的带电物体或来自外部的电场的影响，因此可以确保令人满意的灵敏度和精度。半导体压力传感器设置有响应待测流体的压力的隔膜4。隔膜包括具有压阻元件的硅衬底，它们共同构成嵌入其中的桥接电路，以及形成在硅衬底的表面上的用于电磁屏蔽的屏蔽膜，在该表面上，被测量流体接触与硅衬底。屏蔽膜与硅衬底电连接以具有与硅衬底相同的电位。

7. 发明申请

US20060278012A1 Semiconductor pressure sensor 有权
标题翻译：半导体压力传感器
公开(公告)号：US20060278012A1
公开(公告)日：2006-12-14
申请号：US11225019
申请日：2005-09-14
申请人： Seizo Fujimoto , Takafumi Hara , Masaaki Taruya
发明人： Seizo Fujimoto , Takafumi Hara , Masaaki Taruya
IPC分类号： G01L9/00
CPC分类号： G01L9/0055 , G01L19/069
摘要： A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.
摘要翻译：半导体压力传感器不受受测流体中的带电物体或来自外部的电场的影响，因此可以确保令人满意的灵敏度和精度。半导体压力传感器设置有响应待测流体的压力的隔膜4。隔膜包括具有压阻元件的硅衬底，它们共同构成嵌入其中的桥接电路，以及形成在硅衬底的表面上的用于电磁屏蔽的屏蔽膜，在该表面上，被测量流体接触与硅衬底。屏蔽膜与硅衬底电连接以具有与硅衬底相同的电位。

8. 发明授权

US06003372A Semiconductor angular velocity determining device 失效
标题翻译：半导体角速度测定装置
公开(公告)号：US06003372A
公开(公告)日：1999-12-21
申请号：US742490
申请日：1996-11-01
申请人： Yuji Kawakami , Takafumi Hara , Masaaki Taruya
发明人： Yuji Kawakami , Takafumi Hara , Masaaki Taruya
IPC分类号： G01C19/56 , G01C19/5663 , G01D9/04
CPC分类号： G01C19/5642
摘要： A semiconductor angular velocity determining device includes a piezoelectric substance, a first substrate 21 disposed on the piezoelectric substance, a detector main body disposed on the first substrate 21 and a second substrate for holding the detector main body in cooperation with the first substrate 21 therebetween. The detector main body includes an oscillator 27 having a linear beam portion 26 with a one end 26a of the beam portion 26 being directly fixed to the first substrate 21. Further, the other end 26b of the beam portion 26 draws an elliptical locus in response to the combined force resulting from a force from the piezoelectric substance for producing oscillation along the plane of the first substrate 21 and a Coriolis force acting on the first substrate 21 in a perpendicular direction. With this arrangement, there can be obtained the semiconductor angular velocity determining device capable of improving a determining sensitivity and a determining accuracy.
摘要翻译：半导体角速度确定装置包括压电体，设置在压电体上的第一基板21，设置在第一基板21上的检测器主体和与第一基板21配合保持检测器主体的第二基板。检测器主体包括具有直线束部分26的振荡器27，其中梁部分26的一端26a直接固定到第一基板21.此外，梁部分26的另一端26b响应地绘制椭圆轨迹与来自用于产生沿着第一基板21的平面的振荡的压电体的力产生的合力，以及沿垂直方向作用在第一基板21上的科里奥利力。利用这种布置，可以获得能够提高确定灵敏度和确定精度的半导体角速度确定装置。

9. 发明授权

US6023974A Angular velocity sensor device 失效
标题翻译：角速度传感器装置
公开(公告)号：US6023974A
公开(公告)日：2000-02-15
申请号：US935085
申请日：1997-09-26
申请人： Takafumi Hara , Masaaki Taruya
发明人： Takafumi Hara , Masaaki Taruya
IPC分类号： G01C19/56 , G01C19/5663 , G01P9/00
CPC分类号： G01C19/56
摘要： An angular velocity sensor device that is produced in a simplified manufacturing process and at a reduced manufacturing cost. The angular velocity sensor device includes a first beam which extends along the surface of the substrate and to which a vibration driving source imparts a vibration in an X-axis direction along the surface of the substrate, and a second beam which follows an elliptical trajectory along the surface of the substrate in response to the resultant force of the force in the X-axis direction and a Coriolis force acting in an Y-axis direction perpendicular to the X-axis direction along the surface of the substrate.
摘要翻译：角速度传感器装置，其以简化的制造过程和降低的制造成本制造。角速度传感器装置包括沿着基板的表面延伸的第一光束，振动驱动源沿着基板的表面在X轴方向上施加振动，沿着椭圆轨迹沿第二光束响应于在X轴方向上的力的合力的基板的表面和沿着与基板的表面垂直于X轴方向的Y轴方向作用的科里奥利力。

10. 发明授权

US08790857B2 Toner and process for production thereof 有权
标题翻译：调色剂及其生产方法
公开(公告)号：US08790857B2
公开(公告)日：2014-07-29
申请号：US13537387
申请日：2012-06-29
申请人： Tsuyoshi Itou , Motonari Udo , Kazuhisa Takeda , Takayasu Aoki , Masahiro Ikuta , Takafumi Hara
发明人： Tsuyoshi Itou , Motonari Udo , Kazuhisa Takeda , Takayasu Aoki , Masahiro Ikuta , Takafumi Hara
IPC分类号： G03G9/00
CPC分类号： G03G9/09371 , G03G9/09307 , G03G9/09321 , G03G9/0935 , G03G9/09392
摘要： Disclosed is a toner obtained by coating surfaces of core particles including at least a binder resin having a carboxyl group and a coloring agent with successive coatings of a water-soluble crosslinking agent capable of crosslinking with a carboxyl group and a water-soluble polymer having a carboxyl group, which have been successively applied on the core particles and crosslinked with each other. The thus-formed toner is provided with a good harmony of favorable fixability represented by a low lowest fixable temperature and favorable storage stability represented by little aggregation after standing at 50° C. for 8 hours.
摘要翻译：公开了一种调色剂，其通过将至少包含具有羧基的粘合剂树脂和着色剂的核心颗粒的表面涂覆到能够与羧基交联的水溶性交联剂的连续涂层和具有羧基的水溶性聚合物羧基，其已经连续地施加在核心颗粒上并彼此交联。这样形成的调色剂具有以低最低定影温度表示的良好的定影性和由在50℃下放置8小时后几乎没有聚集性而获得的有利的储存稳定性的良好的调和性。

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