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1. 发明专利

JP2004170381A Method and device of measuring osmotic pressure of active water 审中-公开
公开(公告)号：JP2004170381A
公开(公告)日：2004-06-17
申请号：JP2002375503
申请日：2002-11-20
申请人： Shinko Kogyo Kk , 信光工業株式会社
发明人： MINAMI MASAYOSHI , YAMAZAKI SUMIE , ARAI RYOJI
IPC分类号： G01N13/04
摘要： PROBLEM TO BE SOLVED: To provide a simple method and device for evaluating the function of active water.
SOLUTION: The osmotic pressure measuring device has L-shaped glass tubes with scales arranged at both the ends and a semi-permeable membrane interposed therebetween. An electrolytic solution having a concentration of 0.5 to 2.0 mol/l is charged into one glass tube, while active water is charged into the other glass tube to measure the head difference when the active water osmoses toward the electrolytic solution through the semi-permeable membrane.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2008155362A Electrodeposited diamond tool and manufacturing method for the same 审中-公开
标题翻译：电沉积金刚石工具及其制造方法
公开(公告)号：JP2008155362A
公开(公告)日：2008-07-10
申请号：JP2007305873
申请日：2007-11-27
申请人： Shinko Kogyo Kk , Shinshu Univ , 信光工業株式会社 , 国立大学法人信州大学
发明人： SHIMIZU YASUO , SATSUMABAYASHI MAKOTO , MINAMI MASAYOSHI , ARAI RYOJI
IPC分类号： B24D3/06 , B24D3/00 , C23C18/16 , C23C28/02 , C25D15/02
摘要： PROBLEM TO BE SOLVED: To provide an electrodeposited diamond tool that prevents abrasive grains from dropping out and achieves a long service life.
SOLUTION: In the electrodeposited diamond tool, a plurality of diamond particles 14 is firmly fixed on a surface of a base material 11 by an electrolytic nickel deposit film 15, and additionally an electroless nickel deposit film 16 is formed over the electrolytic nickel deposit film 15. The electroless nickel deposit film 16 is preferably set to have higher hardness than the electrolytic nickel deposit film 15 by heat treatment.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电沉积金刚石工具，其防止磨粒掉落并实现长的使用寿命。解决方案：在电沉积金刚石工具中，多个金刚石颗粒14通过电解镍沉积膜15牢固地固定在基材11的表面上，另外在电解镍上形成化学镀镍沉积膜16 无电解镍沉积膜16优选通过热处理设定为具有比电解镍沉积膜15更高的硬度。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006305407A Denitrification method and denitrification apparatus 审中-公开
标题翻译：脱色方法和脱色装置
公开(公告)号：JP2006305407A
公开(公告)日：2006-11-09
申请号：JP2005127738
申请日：2005-04-26
申请人： Es Adviser:Kk , Hideo Hayakawa , Shinko Kogyo Kk , 信光工業株式会社 , 英雄早川 , 有限会社Esアドバイザー
发明人： MACHIDA TETSUO , MINAMI MASAYOSHI , YOKOYAMA MASAO , HAYAKAWA HIDEO
IPC分类号： C02F1/461
摘要： PROBLEM TO BE SOLVED: To provide a denitrification method which can electrochemically and efficiently denitrify water to be treated containing nitrate ions and nitrite ions.
SOLUTION: When water to be treated containing at least one kind of a nitrate ion and a nitrite ion is subjected to electrochemical denitrification treatment, alternating voltage is impressed to two electrodes 14a, 14b among three electrodes 14a, 14b, 14c inserted into a treatment tank 10 receiving the supply of the water to be treated, and dipped in a solution stored in the treatment tank 10, one electrode is grounded to act as an ground electrode 14c, and direct current is generated between the AC electrodes 14a, 14b impressed with the alternating voltage and the ground electrode 14c to decompose the nitrate ions and nitrite ions in the water to be treated, by electrolytic reduction.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以电化学和有效地使含硝酸根离子和亚硝酸根离子的被处理水反硝化的脱氮方法。解决方案：当将含有至少一种硝酸根离子和亚硝酸根离子的待处理水进行电化学脱氮处理时，将三个电极14a，14b，14c中插入的两个电极14a，14b施加交流电压接收待处理水的处理槽10，浸渍在贮存在处理槽10中的溶液中，一个电极接地以作为接地电极14c，并且在AC电极14a，14b之间产生直流电施加交流电压和接地电极14c，通过电解还原分解待处理的水中的硝酸根离子和亚硝酸根离子。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006341213A APPARATUS AND METHOD FOR ELECTROLYZING WASTE ELECTROLESS COPPER PLATING LIQUID 审中-公开
公开(公告)号：JP2006341213A
公开(公告)日：2006-12-21
申请号：JP2005170428
申请日：2005-06-10
申请人： ES ADVISER KK , SHINKO KOGYO KK , PERMELEC ELECTRODE LTD
发明人： TANABE KENJI , YOKOYAMA MASAO , MINAMI MASAYOSHI , FURUTA TSUNETO
IPC分类号： C02F1/461 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a method for treating a waste electroless copper plating liquid, by which the waste electroless copper plating liquid can be easily treated in equipment simpler than usual. SOLUTION: When the chelating agent-containing waste electroless copper plating liquid 12a stored in an electrolytic cell 10 in which an anode 16 and a cathode 14 are arranged is electrolyzed, a conductive diamond electrode is used at least as the anode 16 and a DC current is made to flow between the anode 16 and the cathode 14 to oxidize a chelating agent electrolytically on the side of the anode 16 and deposit a copper ion in the waste liquid 12a on the side of the cathode 14 as metal copper. COPYRIGHT: (C)2007,JPO&INPIT

5. 发明专利

JP2002043639A CHEMICAL NICKEL PLATING METHOD FOR THERMOELECTRIC SEMICONDUCTOR 失效
公开(公告)号：JP2002043639A
公开(公告)日：2002-02-08
申请号：JP2000254666
申请日：2000-07-22
申请人： SHINKO KOGYO KK , NAGANO PREFECTURE , ORION MACHINERY CO LTD , CERATEC JAPAN CO LTD
发明人： YAJIMA YOICHI , YAMAMOTO JUNICHI , FURUHATA HAJIME , ARAI RYOJI , MINAMI MASAYOSHI , TSUBOI HIRAKI , NAKAMURA YUMIO , YOKOCHI HARUYUKI , SAKAI TOSHIHISA , NISHINOIRI TAKASHI , NAKAMURA HIROKO
IPC分类号： C23C18/18 , C23C18/31 , C23F1/30 , H01L35/16 , H01L35/34
摘要： PROBLEM TO BE SOLVED: To provide a chemical nickel plating method for a thermoelectric element module including P type elements and N type elements mixedly in which P type elements and N type elements are plated simultaneously through one processing. SOLUTION: A thermoelectric element is subjected to alkaline defatting and cleaned with hydrofluoric acid. Subsequently, N type elements are subjected to surface conditioning using CPL based polishing liquid in a first stage etching followed by second stage etching using an etching liquid of nitric acid/acid ammonium fluoride/hydrogen peroxide added with a trace of propylalchol and lauryl sodium sulfate as a countermeasure against gas generation. The N type elements are subjected to removal of oxide film and chemical polishing in the second half of etching process. The P type elements are subjected to dissolution of formed oxide film and chemical polishing. Subsequently, black oxide film formed immediately after etching is cleaned ultrasonically in alkaline solution and removed in desmut process. Finally, chemical nickel plating is performed following to sensitizing/activating process.

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