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    • 2. 发明授权
    • Semiconductor photodetector and optical transmitting device
    • 半导体光电检测器和光发射装置
    • US06822271B2
    • 2004-11-23
    • US09485852
    • 2000-02-17
    • Toshiyuki MogiKazumi KawamotoShinji TsujiHitoshi NakamuraMasato ShishikuraSatoru Kikuchi
    • Toshiyuki MogiKazumi KawamotoShinji TsujiHitoshi NakamuraMasato ShishikuraSatoru Kikuchi
    • H01L2980
    • G02B6/4224
    • In aiming at cost lowering of an optical module and an optical transmission apparatus and with the objective of providing a semiconductor light receiving element that has a good coherence with the other edge emitting/incidence type optical devices and is capable of performing the positioning easily and with a high accuracy, in the edge emitting/incidence type light receiving element in which the light absorbing layer 19 has been formed, the space region is formed so as to provide at least 100 &mgr;m2 of the marker detecting region 24, thereby facilitating detection of marker 23 on the optical device 26 and executing the positioning of the light receiving element with a high accuracy, the space region resulting from eliminating a part of the light absorbing layer 19 that absorbs the detection light of the light receiving element, the transmission amount of the detection light toward the marker detecting region that is parallel to a primary plane being equal to 30% or higher, the detection light having penetrated and transmitted the primary plane of the light receiving element.
    • 为了降低光学模块和光学传输装置的成本,并且为了提供与其它边缘发射/入射型光学装置具有良好相干性的半导体光接收元件,并且能够容易地执行定位 在其中形成有光吸收层19的边缘发射/入射型光接收元件中形成高精度,形成空间区域,以便提供标记检测区域24的至少100微米2,从而便于 检测光学装置26上的标记23,并且以高精度执行光接收元件的定位,由消除吸收光接收元件的检测光的光吸收层19的一部分而产生的空间区域,透射 检测光朝着与主平面平行的标记检测区域的检测光量等于30%以上 n光穿过并透射光接收元件的主平面。
    • 3. 发明授权
    • Optical module
    • 光模块
    • US06632027B1
    • 2003-10-14
    • US09363831
    • 1999-07-30
    • Kouji YoshidaMasato ShishikuraToshinori HiratakaShinji TsujiTakeshi Kato
    • Kouji YoshidaMasato ShishikuraToshinori HiratakaShinji TsujiTakeshi Kato
    • G02B636
    • G02B6/4277G02B6/4202
    • An optical module shown in FIG. 2 is disclosed having following components. (1) A substrate on which optical parts and an optical fiber are mounted. An optical fiber is fixed in the V-groove formed on the substrate so that the optic axis of the optical parts and the fiber is adjusted. (2) A bottom plastic package having a concave surface for the substrate mounted thereon and several leads pins being fixed to the first plastic package. (3) A upper plastic package for sealing optical parts and the fiber being fixed to the bottom plastic package, the outer surface of the upper plastic package being plated by metal, and the upper plastic package and at least one of the lead pins conducted. According to this, it is possible to provide optical transmission module or optical module having advantage of capable of using plastic package and electromagnetic interference free with simplified structure.
    • 图1所示的光模块。 公开了具有以下部件的 2 。(1)安装有光学部件和光纤的基板。 光纤被固定在形成在基板上的V形槽中,使得光学部件和光纤的光轴被调节。(2)一种底部塑料封装,其具有用于其上安装的基板的凹面, (3)用于密封光学部件的上部塑料封装件,并且固定在底部塑料封装件上的上述塑料封装件,上部塑料封装件的外表面被金属电镀, 并且上部塑料封装和至少一个引脚引脚传导。根据这一点,可以提供具有能够使用塑料封装和电磁干扰的具有简化结构的优点的光传输模块或光模块。
    • 4. 发明申请
    • Optoelectronic Integrated Circuit Device and Communications Equipment Using Same
    • 光电集成电路设备及通讯设备
    • US20090003761A1
    • 2009-01-01
    • US11658587
    • 2004-09-29
    • Yasunobu MatsuokaMasato Shishikura
    • Yasunobu MatsuokaMasato Shishikura
    • G02B6/12
    • G02B6/4214G02B6/42G02B6/421G02B6/4249G02B6/4292G02B6/43
    • A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board. A quadrilateral package substrate 11; an LSI package 13 mounted on the package substrate 11; photonic devices 12 mounted along two or more sides of the LSI package 13; first photonic devices electrically connected to I/O terminals disposed on one side of the LSI package 13; second photonic devices electrically connected to I/O terminals disposed on a different side of the LSI package 13; first optical waveguides for connecting between the optical signal I/O terminals of the first photonic devices and an external component or device; and second optical waveguides for connecting between the optical I/O terminals of the second photonic devices and an external component or device; wherein the first and second optical waveguides are terminated on the same side edge of the package substrate 11.
    • 可以防止其中设置在与LSI相同的基板上的光子器件沿着LSI的四侧密集布置的光电集成电路器件,并且可以防止由于发热而导致的激光二极管或光电检测器的特性劣化,此外,光布线 很容易在电路板上执行。 四边形封装基板11; 安装在封装基板11上的LSI封装13; 沿着LSI封装13的两侧或两侧安装的光子器件12; 电连接到设置在LSI封装13一侧的I / O端子的第一光子器件; 电连接到设置在LSI封装13的不同侧的I / O端子的第二光子器件; 用于连接第一光子器件的光信号I / O端子与外部元件或器件之间的第一光波导; 以及用于连接第二光子器件的光学I / O端子和外部部件或器件的第二光波导; 其中第一和第二光波导端接在封装基板11的同一侧边上。
    • 6. 发明授权
    • Optical device integrated head
    • 光器件集成头
    • US07921436B2
    • 2011-04-05
    • US12030890
    • 2008-02-14
    • Junichiro ShimizuMasato Shishikura
    • Junichiro ShimizuMasato Shishikura
    • G11B7/00G11B11/00
    • G11B5/314G11B7/1387G11B2005/0021
    • An optical device integrated head having high light utilizing efficiency by decreasing the propagation loss caused from an optical source to a recording medium, conducting by mounting according to compact active alignment method for efficiently guiding a light generated from a laser device to the top end of a head, in which a light source device mounted on a submount has a mirror portion having an inclinated surface to at least a portion of one edge thereof for reflecting an output light from the optical source device at the inclinated surface, a structural member including a lens structure for further allowing a light to pass through the submount, and an optical waveguide disposed passing through a slider for mounting the submount, and the optical source and the slider are positioned by using active alignment of light in a chip-on carrier structure having the optical source device mounted on the submount.
    • 一种光学器件集成头,其通过减少从光源到记录介质的传播损耗而具有高的光利用效率,通过根据紧凑的主动对准方法的安装进行传导,以有效地将从激光装置产生的光引导到 头部,其中安装在基座上的光源装置具有具有倾斜表面的镜部分到其一个边缘的至少一部分,用于在倾斜表面处反射来自光源装置的输出光;结构部件,包括透镜 用于进一步允许光通过所述基座的结构,以及通过用于安装所述基座的滑动件设置的光波导,并且所述光源和所述滑块通过在具有所述基座的芯片载体结构中的光的有源对准来定位 光源装置安装在底座上。