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1. 发明授权

US07179504B2 Substrate processing method and substrate processing system 失效
标题翻译：基板加工方法和基板处理系统
公开(公告)号：US07179504B2
公开(公告)日：2007-02-20
申请号：US10964684
申请日：2004-10-15
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： B05D3/02 , B05D3/12
CPC分类号： H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
摘要： The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.
摘要翻译：本发明涉及一种处理基板的处理方法，包括在使涂布液排出喷嘴和基板相对移动并将涂布溶液从喷嘴排出到基板上的同时在基板的表面上涂布涂布液的步骤。此后，将基板暴露于涂布溶液的溶剂气氛中，或者将压力暂时施加到容器中。此后，将容纳基板的容器内部的压力减小，以使基材上的涂布溶液干燥。根据本发明，可以缩小位于基板的周边部分并且不商业化的所谓的边缘切割宽度，并且保持涂膜的面内均匀性。

2. 发明授权

US07205025B2 Apparatus and method for drying under reduced pressure, and coating film forming apparatus 失效
标题翻译：减压干燥装置及方法，以及涂膜成膜装置
公开(公告)号：US07205025B2
公开(公告)日：2007-04-17
申请号：US11212725
申请日：2005-08-29
申请人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
发明人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
IPC分类号： B05D3/00
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译：在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。然后，溶剂从涂布液中主动蒸发。这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。

3. 发明申请

US20060003105A1 Apparatus and method for drying under reduced pressure, and coating film forming apparatus 失效
标题翻译：减压干燥装置及方法，以及涂膜成膜装置
公开(公告)号：US20060003105A1
公开(公告)日：2006-01-05
申请号：US11212725
申请日：2005-08-29
申请人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
发明人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
IPC分类号： B05D3/02
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译：在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。然后，溶剂从涂布液中主动蒸发。这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。

4. 发明授权

US06966949B2 Apparatus and method for drying under reduced pressure, and coating film forming apparatus 失效
标题翻译：减压干燥装置及方法，以及涂膜成膜装置
公开(公告)号：US06966949B2
公开(公告)日：2005-11-22
申请号：US10615800
申请日：2003-07-10
申请人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
发明人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
IPC分类号： B05D1/40 , B05C9/12 , B05C11/08 , B05D3/02 , B05D3/04 , B05D3/12 , H01L21/00 , H01L21/027 , B05C11/02
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译：在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。然后，溶剂从涂布液中主动蒸发。这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。

5. 发明授权

US06824616B2 Substrate processing method and substrate processing system 失效
标题翻译：基板加工方法和基板处理系统
公开(公告)号：US06824616B2
公开(公告)日：2004-11-30
申请号：US10121612
申请日：2002-04-15
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： C23C1400
CPC分类号： H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
摘要： The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.
摘要翻译：本发明涉及一种处理基板的处理方法，包括在使涂布液排出喷嘴和基板相对移动并将涂布溶液从喷嘴排出到基板上的同时在基板的表面上涂布涂布液的步骤。此后，将基板暴露于涂布溶液的溶剂气氛中，或者将压力暂时施加到容器中。此后，将容纳基板的容器内部的压力减小，以使基材上的涂布溶液干燥。根据本发明，可以缩小位于基板的周边部分并且不商业化的所谓的边缘切割宽度，并且保持涂膜的面内均匀性。

6. 发明授权

US06773510B2 Substrate processing unit 失效
标题翻译：基板处理单元
公开(公告)号：US06773510B2
公开(公告)日：2004-08-10
申请号：US10122389
申请日：2002-04-16
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： B05C1102
CPC分类号： H01L21/67178 , G03F7/162 , G03F7/3021 , H01L21/67069
摘要： The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate. According to the present invention, the speed of an atmospheric current flowing between the current plate and the substrate becomes uniform within the surface of the substrate, and consequently when a coating film on the substrate is dried, the film is planarized to have a uniform thickness.
摘要翻译：本发明涉及一种用于处理基板的处理单元，其包括用于容纳基板并形成密封处理室的室，以及用于从室的上部排出处理室中的气氛的排气器，以减少处理室压力。本发明的处理单元包括用于当压力降低时控制在处理室中形成的大气电流的电流板，并且该腔室具有用于将基板安装在其上的安装台，其下表面打开的几乎圆柱形的盖体用于从上方覆盖安装板上的基板并与安装台一体地形成处理室;以及支撑构件，用于支撑当前板，使得当前板平行于安装板。根据本发明，在基板表面之间流动的当前板和基板之间的大气电流的速度变得均匀，因此当基板上的涂膜被干燥时，该膜被平坦化以具有均匀的厚度。

7. 发明申请

US20050100679A1 Substrate processing method and substrate processing system 失效
标题翻译：基板加工方法和基板处理系统
公开(公告)号：US20050100679A1
公开(公告)日：2005-05-12
申请号：US10964684
申请日：2004-10-15
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： H01L21/027 , B05D3/04 , G03F7/16 , H01L21/00 , B05C5/00
CPC分类号： H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
摘要： The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.
摘要翻译：本发明涉及一种处理基板的处理方法，包括在使涂布液排出喷嘴和基板相对移动并将涂布溶液从喷嘴排出到基板上的同时在基板的表面上涂布涂布液的步骤。此后，将基板暴露于涂布溶液的溶剂气氛中，或者将压力暂时施加到容器中。此后，将容纳基板的容器内部的压力减小，以使基材上的涂布溶液干燥。根据本发明，可以缩小位于基板的周边部分并且不商业化的所谓的边缘切割宽度，并且保持涂膜的面内均匀性。

8. 发明授权

US07534467B2 Reduced-pressure drying unit and coating film forming method 失效
标题翻译：减压干燥装置和涂膜成型方法
公开(公告)号：US07534467B2
公开(公告)日：2009-05-19
申请号：US10932042
申请日：2004-09-02
申请人： Takahiro Kitano , Manabu Hama , Shinichi Sugimoto , Naoya Hirakawa
发明人： Takahiro Kitano , Manabu Hama , Shinichi Sugimoto , Naoya Hirakawa
IPC分类号： B05D3/00 , B05D3/12
CPC分类号： H01L21/67034 , B05D3/0493
摘要： The invention includes a hermetic container provided with a substrate mount; a vacuum exhauster connected to the hermetic container; a current member; and a current member raising and lowering mechanism. When the current member is raised and lowered as a function of the pressure inside the hermetic container, a liquid flow of the coating solution on the substrate is controlled, thereby controlling the uniformity of the film thickness of the coating solution.
摘要翻译：本发明包括设置有基板安装件的密封容器; 连接到密封容器的真空排气器; 现任会员和当前成员升降机制。当根据密封容器内部的压力升高和降低当前构件时，控制基底上的涂布液的液体流动，从而控制涂布溶液的膜厚均匀性。

9. 发明申请

US20050170087A1 Coating film forming method and apparatus 有权
公开(公告)号：US20050170087A1
公开(公告)日：2005-08-04
申请号：US11091760
申请日：2005-03-29
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05D1/00 , B05D1/02 , H01L21/00 , B05D3/12
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

10. 发明授权

US07488505B2 Coating film forming method and system 失效
公开(公告)号：US07488505B2
公开(公告)日：2009-02-10
申请号：US10885577
申请日：2004-07-08
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05D3/12
CPC分类号： H01L21/67253 , B05D1/005 , B05D1/26 , H01L21/6715
摘要： When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.

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