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    • 7. 发明申请
    • METHOD AND APPARATUS FOR DESIGNING A THREE-DIMENSIONAL INTEGRATED CIRCUIT
    • 用于设计三维集成电路的方法和装置
    • US20080244489A1
    • 2008-10-02
    • US12047547
    • 2008-03-13
    • Tetsufumi TanamotoShinichi YasudaShinobu Fujita
    • Tetsufumi TanamotoShinichi YasudaShinobu Fujita
    • G06F17/50
    • G06F17/5077G06F17/5068
    • A method of designing a three-dimensional integrated circuit includes dividing two-dimensional layout data of a circuit formed on a semiconductor substrate into a plurality of layout block data in order to re-arrange in different layers, generating layout block data reversing one of the layout block data of two folded layers arranged vertically adjacent to each other, alternately arranging the reversed layout block data and non-reverse block layout data to form a plurality of layers vertically overlapped, selecting at least one from interconnects included in a plurality of layout block data of the circuit and ranging over plural layers so as to be mutually and functionally collected together with respect to at least one of time delay, interconnect length and block configuration, and re-arranging the selected interconnect using a via connecting an upper layer and an under layer of the folded interconnect.
    • 一种设计三维集成电路的方法包括将形成在半导体衬底上的电路的二维布局数据划分成多个布局块数据,以便重新排列在不同的层中,生成布局块数据, 交替布置反向布局块数据和非反向块布局数据以形成垂直重叠的多个层的两个折叠层的布局块数据,从包括在多个布局块中的互连中选择至少一个层 电路的数据并且跨越多个层,以便相对于时间延迟,互连长度和块配置中的至少一个而相互和功能地收集在一起,并且使用连接上层和第二层的通孔重新布置所选择的互连 折叠互连的下层。
    • 8. 发明授权
    • Method and apparatus for designing a three-dimensional integrated circuit
    • 用于设计三维集成电路的方法和装置
    • US07949984B2
    • 2011-05-24
    • US12047547
    • 2008-03-13
    • Tetsufumi TanamotoShinichi YasudaShinobu Fujita
    • Tetsufumi TanamotoShinichi YasudaShinobu Fujita
    • G06F17/50
    • G06F17/5077G06F17/5068
    • A method of designing a three-dimensional integrated circuit includes dividing two-dimensional layout data of a circuit formed on a semiconductor substrate into a plurality of layout block data in order to re-arrange in different layers, generating layout block data reversing one of the layout block data of two folded layers arranged vertically adjacent to each other, alternately arranging the reversed layout block data and non-reverse block layout data to form a plurality of layers vertically overlapped, selecting at least one from interconnects included in a plurality of layout block data of the circuit and ranging over plural layers so as to be mutually and functionally collected together with respect to at least one of time delay, interconnect length and block configuration, and re-arranging the selected interconnect using a via connecting an upper layer and an under layer of the folded interconnect.
    • 一种设计三维集成电路的方法包括将形成在半导体衬底上的电路的二维布局数据划分成多个布局块数据,以便重新排列在不同的层中,生成布局块数据, 交替布置反向布局块数据和非反向块布局数据以形成垂直重叠的多个层的两个折叠层的布局块数据,从包括在多个布局块中的互连中选择至少一个层 电路的数据并且跨越多个层,以便相对于时间延迟,互连长度和块配置中的至少一个而相互和功能地收集在一起,并且使用连接上层和第二层的通孔重新布置所选择的互连 折叠互连的下层。