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    • 5. 发明授权
    • Display device manufacturing method
    • 显示器件制造方法
    • US06705912B2
    • 2004-03-16
    • US10378079
    • 2003-03-04
    • Toru SasataniTetsuji Omura
    • Toru SasataniTetsuji Omura
    • H01J162
    • H01L51/5246H01L27/3244H01L2251/558
    • A display device manufacturing method includes providing a device substrate having a display element, providing a sealing substrate, and forming a layer of a sealing resin on the sealing substrate. The viscosity of the sealing resin is between 40000 cp and 170000 cp when the layer of the sealing resin is formed. The method also includes placing the sealing substrate on the device substrate so that the layer of the sealing resin is disposed between the sealing substrate and the device substrate, and heating the layer of the sealing resin to harden the sealing resin so that the sealing substrate and the device substrate are attached together by the sealing resin.
    • 显示装置制造方法包括提供具有显示元件的装置基板,提供密封基板,以及在密封基板上形成密封树脂层。 当形成密封树脂层时,密封树脂的粘度为40000cp至170000cp。 该方法还包括将密封基板放置在器件基板上,使得密封树脂层设置在密封基板和器件基板之间,并且加热密封树脂层以硬化密封树脂,使得密封基板和 装置基板通过密封树脂附着在一起。