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    • 6. 发明授权
    • Method of making a semiconductor memory device
    • 制造半导体存储器件的方法
    • US5183774A
    • 1993-02-02
    • US807659
    • 1991-12-16
    • Shinichi Satoh
    • Shinichi Satoh
    • H01L21/334H01L27/108
    • H01L29/66181H01L27/10841
    • A semiconductor memory device comprises a semiconductor substrate (10), a trench (12) formed on a main surface (11) of the semiconductor substrate, a gate region (15) formed on a main surface portion in the trench, a passive element region (16) formed on a bottom side portion of the trench and a source/drain region (20) formed on the main surface of the semiconductor substrate. The method for manufacturing the semiconductor memory device comprises the steps of forming a wide first trench (31) on a portion of the main surface of the semiconductor substrate, forming a narrow second trench (32) on the bottom portion of the first trench, forming a passive element region in the second trench, forming a gate region in the first trench, and forming a source/drain region on the main surface portion of the semiconductor substrate.
    • 半导体存储器件包括半导体衬底(10),形成在半导体衬底的主表面(11)上的沟槽(12),形成在沟槽中的主表面部分上的栅极区域(15),无源元件区域 (16),形成在所述沟槽的底侧部分上,以及形成在所述半导体衬底的主表面上的源/漏区(20)。 半导体存储器件的制造方法包括以下步骤:在半导体衬底的主表面的一部分上形成宽的第一沟槽(31),在第一沟槽的底部形成窄的第二沟槽(32),形成 在所述第二沟槽中的无源元件区域,在所述第一沟槽中形成栅极区域,以及在所述半导体衬底的所述主表面部分上形成源极/漏极区域。
    • 8. 发明授权
    • Complementary semiconductor device having improved device isolating
region
    • 具有改进的器件隔离区域的补充半导体器件
    • US5097310A
    • 1992-03-17
    • US409379
    • 1989-09-19
    • Takahisa EimoriWataru WakamiyaHiroji OzakiYoshinori TanakaShinichi Satoh
    • Takahisa EimoriWataru WakamiyaHiroji OzakiYoshinori TanakaShinichi Satoh
    • H01L21/761H01L21/76H01L27/08H01L27/092H01L29/78
    • H01L27/0928
    • A complementary semiconductor device having an improved capability of isolating devices comprises a P well 3 and an N well 2 both formed adjacent to each other on a main surface of a substrate 1, an N type impurity layer formed in the P well 8 on the main surface of the substrate, a P type impurity layer formed in the N well 9 on the main surface of the substrate, an N type region formed at the junction of the N well and the P well 71 on the main surface of the substrate, a first shield electrode 52 formed between the N type impurity layer 8 and the N type region 71 on the main surface of the substrate through an insulating film and a second shield electrode 51 formed between the N type region 71 and the P type impurity layer 9 on the main surface of the substrate through an insulating film. The first shield electrode 52 is connected to a potential V.sub.SS and the second shield electrode 51 and the N type region 71 are connected to a potential V.sub.CC, so that an N channel MOS transistor 101 comprising the first shield electrode 52 does not turn on and a device comprising the second shield electrode does not form a field effect transistor.
    • 具有改进的隔离装置能力的互补半导体器件包括在衬底1的主表面上彼此相邻形成的P阱3和N阱2,形成在主衬底1上的P阱8中的N型杂质层 在基板的主表面上形成在N阱9中的P型杂质层,形成在基板主表面上的N阱和P阱71的接合部的N型区域, 第一屏蔽电极52,其通过绝缘膜形成在基板的主表面上的N型杂质层8和N型区域71之间,形成在N型区域71和P型杂质层9之间的第二屏蔽电极51, 基板的主表面通过绝缘膜。 第一屏蔽电极52连接到电位VSS,第二屏蔽电极51和N型区域71连接到电位VCC,使得包括第一屏蔽电极52的N沟道MOS晶体管101不导通, 包括第二屏蔽电极的装置不形成场效应晶体管。
    • 10. 发明授权
    • Semiconductor memory device with two separate gates per block
    • 半导体存储器件,每个块具有两个独立的栅极
    • US5027173A
    • 1991-06-25
    • US261022
    • 1988-10-20
    • Shinichi Satoh
    • Shinichi Satoh
    • H01L27/10H01L21/334H01L21/822H01L21/8242H01L27/04H01L27/108
    • H01L29/66181H01L27/10841
    • A semiconductor memory device comprises a semiconductor substrate (10), a trench (12) formed on a main surface (11) of the semiconductor substrate, a gate region (15) formed on a main surface portion in the trench, a passive element region (16) formed on a bottom side portion of the trench and a source/drain region (20) formed on the main surface of the semiconductor substrate. The method for manufacturing the semiconductor memory device comprises the steps of forming a wide first trench (31) on a portion of the main surface of the semiconductor substrate, forming a narrow second trench (32) on the bottom portion of the first trench, forming a passive element region in the second trench, forming a gate region in the first trench, and forming a source/drain region on the main surface portion of the semiconductor substrate.
    • 半导体存储器件包括半导体衬底(10),形成在半导体衬底的主表面(11)上的沟槽(12),形成在沟槽中的主表面部分上的栅极区域(15),无源元件区域 (16),形成在所述沟槽的底侧部分上,以及形成在所述半导体衬底的主表面上的源/漏区(20)。 半导体存储器件的制造方法包括以下步骤:在半导体衬底的主表面的一部分上形成宽的第一沟槽(31),在第一沟槽的底部形成窄的第二沟槽(32),形成 在所述第二沟槽中的无源元件区域,在所述第一沟槽中形成栅极区域,以及在所述半导体衬底的所述主表面部分上形成源极/漏极区域。