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    • 4. 发明申请
    • SRAM CELL AND SRAM DEVICE
    • SRAM单元和SRAM器件
    • US20100315861A1
    • 2010-12-16
    • US12521408
    • 2007-12-20
    • Shinichi OuchiYongxun LiuMeishoku MasaharaTakashi MatsukawaKazuhiko Endo
    • Shinichi OuchiYongxun LiuMeishoku MasaharaTakashi MatsukawaKazuhiko Endo
    • G11C11/00
    • H01L27/1104H01L21/845H01L27/11H01L27/1211H01L29/785H01L29/7856
    • In an SRAM cell including a first to a fourth semiconductor thin plates which stand on a substrate and are arranged in parallel to each other, on each of the four semiconductor thin plates being formed a first four-terminal double-gate FET with a first conductivity type; a second and a third four-terminal double-gate FETs which are connected in series with each other and have a second conductivity type; a fourth and a fifth four-terminal double-gate FETs which are connected in series with each other and have the second conductivity type; a sixth four-terminal double-gate FET with the first conductivity type, wherein the third and the fourth four-terminal double-gate FETs form select transistors, and the first, the second, the fifth and the sixth four-terminal double-gate FETs form a CMOS inverter, logic signal input gates of the first and the sixth four-terminal double-gate FETs are arranged on the side facing the second and the third semiconductor thin plates, respectively, while threshold voltage control gates of the second to the fifth four-terminal double-gate FETs are arranged on the sides facing each other and are commonly connected to a first bias line. Threshold voltage control gates of the first and the sixth four-terminal double-gate FETs are commonly connected to a second bias line. A word line, the first bias line and the second bias line are arranged orthogonally to the direction of arrangement of the first to the fourth semiconductor thin plates.
    • 在包括站立在基板上并彼此平行布置的第一至第四半导体薄板的SRAM单元中,在四个半导体薄板中的每一个上形成具有第一导电性的第一四端子双栅极FET 类型; 第二和第三四端子双栅极FET,它们彼此串联并具有第二导电类型; 第四和第五四端子双栅极FET,它们彼此串联并具有第二导电类型; 具有第一导电类型的第六个四端子双栅极FET,其中第三和第四四端子双栅极FET形成选择晶体管,并且第一,第二,第五和第六四端子双栅极 FET形成CMOS反相器,第一和第六四端子双栅极FET的逻辑信号输入栅极分别布置在面向第二和第三半导体薄板的一侧,而第二至第四半导体FET的阈值电压控制栅极 第五四端子双栅FET被布置在彼此面对的侧面上,并且共同连接到第一偏置线。 第一和第六四端子双栅极FET的阈值电压控制栅极共同连接到第二偏置线。 字线,第一偏置线和第二偏置线与第一至第四半导体薄板的排列方向垂直。
    • 10. 发明授权
    • SRAM cell and SRAM device
    • SRAM单元和SRAM器件
    • US08040717B2
    • 2011-10-18
    • US12521408
    • 2007-12-20
    • Shinichi OuchiYongxun LiuMeishoku MasaharaTakashi MatsukawaKazuhiko Endo
    • Shinichi OuchiYongxun LiuMeishoku MasaharaTakashi MatsukawaKazuhiko Endo
    • G11C11/00
    • H01L27/1104H01L21/845H01L27/11H01L27/1211H01L29/785H01L29/7856
    • A static random access memory (SRAM) cell includes a first to a fourth semiconductor thin plate that are provided on a substrate and are arranged parallel to each other. On respective semiconductor thin plates, there is formed a first four-terminal double-gate field effect transistor (FET) with a first conductivity type, a second and a third four-terminal double-gate FET which are connected in series with each other and have a second conductivity type, a fourth and a fifth four-terminal double-gate FET which are connected in series with each other and have the second conductivity type, and a sixth four-terminal double-gate FET with the first conductivity type. The third and the fourth four-terminal double-gate FETs form select transistors, and the first, second, fifth and sixth four-terminal double-gate FETs form a complementary metal-oxide-semiconductor (CMOS) inverter.
    • 静态随机存取存储器(SRAM)单元包括设置在基板上并且彼此平行布置的第一至第四半导体薄板。 在相应的半导体薄板上形成具有第一导电类型的第一四端双栅场效应晶体管(FET),彼此串联连接的第二和第三四端双栅FET 具有彼此串联并具有第二导电类型的第二导电类型,第四和第五四端子双栅极FET以及具有第一导电类型的第六四端子双栅极FET。 第三和第四四端子双栅极FET形成选择晶体管,第一,第二,第五和第六四端子双栅极FET形成互补的金属氧化物半导体(CMOS)反相器。