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1. 发明申请

US20130295407A1 SURFACE-TREATED COPPER FOIL 有权
标题翻译：表面处理铜箔
公开(公告)号：US20130295407A1
公开(公告)日：2013-11-07
申请号：US13988450
申请日：2011-11-22
申请人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
发明人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
IPC分类号： H01B1/02
CPC分类号： B32B15/01 , C23C2/02 , C23C28/00 , C23C28/30 , C23C28/321 , C23C28/324 , C23C28/3455 , C25D1/04 , C25D3/565 , C25D5/10 , C25D5/48 , C25D7/0614 , C25D11/38 , H01B1/026 , H05K1/09 , H05K2201/0355 , Y10T428/12438 , Y10T428/12472 , Y10T428/12792
摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
摘要翻译：本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔在由铜合金构成的防锈处理层的铜箔的两面上设有防锈处理层，防锈处理层为锌量为20mg / m 2的锌合金层至1,000 mg / m2; 铜箔含有一种或两种以上选自碳，硫，氯和氮的少量元素，其总量为100ppm以上。

2. 发明申请

US20130302635A1 SURFACE-TREATED COPPER FOIL 审中-公开
标题翻译：表面处理铜箔
公开(公告)号：US20130302635A1
公开(公告)日：2013-11-14
申请号：US13988236
申请日：2011-11-22
申请人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
发明人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
IPC分类号： B32B15/01
CPC分类号： B32B15/01 , C23C2/02 , C23C28/00 , C23C28/30 , C23C28/321 , C23C28/324 , C23C28/3455 , C25D1/04 , C25D3/565 , C25D5/10 , C25D5/48 , C25D7/0614 , C25D11/38 , H01B1/026 , H05K1/09 , H05K2201/0355 , Y10T428/12438 , Y10T428/12472 , Y10T428/12792
摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc, and the either rust-proofing treatment layer is a zinc layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
摘要翻译：本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔在由铜构成的防锈处理层的铜箔的两面上设有防锈处理层，任一防锈处理层为锌量为20mg / m 2〜1000的锌层 mg / m2; 铜箔含有一种或两种以上选自碳，硫，氯和氮的少量元素，其总量为100ppm以上。

3. 发明授权

US09138964B2 Surface-treated copper foil 有权
标题翻译：表面处理铜箔
公开(公告)号：US09138964B2
公开(公告)日：2015-09-22
申请号：US13988450
申请日：2011-11-22
申请人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
发明人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
IPC分类号： C23C2/02 , B32B15/01 , C23C28/00 , C25D5/10 , C25D7/06 , H05K1/09 , H01B1/02 , C25D1/04 , C25D3/56 , C25D5/48 , C25D11/38
CPC分类号： B32B15/01 , C23C2/02 , C23C28/00 , C23C28/30 , C23C28/321 , C23C28/324 , C23C28/3455 , C25D1/04 , C25D3/565 , C25D5/10 , C25D5/48 , C25D7/0614 , C25D11/38 , H01B1/026 , H05K1/09 , H05K2201/0355 , Y10T428/12438 , Y10T428/12472 , Y10T428/12792
摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
摘要翻译：本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔在由铜合金构成的防锈处理层的铜箔的两面上设有防锈处理层，防锈处理层为锌量为20mg / m 2的锌合金层至1,000 mg / m2; 铜箔含有一种或两种以上选自碳，硫，氯和氮的少量元素，其总量为100ppm以上。

4. 发明授权

US09066459B2 Manufacturing method of multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US09066459B2
公开(公告)日：2015-06-23
申请号：US14008038
申请日：2012-03-29
申请人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
发明人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
IPC分类号： H01B13/00 , H05K3/46 , H05K3/02
CPC分类号： H05K3/4611 , H05K3/022 , H05K3/4658 , H05K3/4682
摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
摘要翻译：使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

5. 发明申请

US20140054259A1 MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
标题翻译：制造方法由多层印刷线路板和制造方法获得的多层印刷线路板的制造方法
公开(公告)号：US20140054259A1
公开(公告)日：2014-02-27
申请号：US14008038
申请日：2012-03-29
申请人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
发明人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
IPC分类号： H05K3/46
CPC分类号： H05K3/4611 , H05K3/022 , H05K3/4658 , H05K3/4682
摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
摘要翻译：使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

6. 发明授权

US09585261B2 Manufacturing method of multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US09585261B2
公开(公告)日：2017-02-28
申请号：US14008034
申请日：2012-03-29
申请人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
发明人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
IPC分类号： H05K3/30 , H05K3/46 , H05K3/02
CPC分类号： H05K3/4652 , H05K3/022 , H05K3/4658 , H05K3/4682 , Y10T29/49155
摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
摘要翻译：具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

7. 发明申请

US20140096381A1 MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
标题翻译：制造方法由多层印刷线路板和制造方法获得的多层印刷线路板的制造方法
公开(公告)号：US20140096381A1
公开(公告)日：2014-04-10
申请号：US14008034
申请日：2012-03-29
申请人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
发明人： Ayumu Tateoka , Shinichi Obata , Toshiyuki Shimizu
IPC分类号： H05K3/46
CPC分类号： H05K3/4652 , H05K3/022 , H05K3/4658 , H05K3/4682 , Y10T29/49155
摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
摘要翻译：具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

8. 外观设计

USD605681S1 Camera lens 有权
标题翻译：镜头
公开(公告)号：USD605681S1
公开(公告)日：2009-12-08
申请号：US29290428
申请日：2007-12-05
申请人： Shinichi Obata
设计人： Shinichi Obata

9. 外观设计

USD534156S1 Headphone 有权
公开(公告)号：USD534156S1
公开(公告)日：2006-12-26
申请号：US29244002
申请日：2005-12-05
申请人： Shinichi Obata
设计人： Shinichi Obata

10. 外观设计

USD506459S1 Combined disc player, radio receiver and tape recorder 失效
公开(公告)号：USD506459S1
公开(公告)日：2005-06-21
申请号：US29200689
申请日：2004-03-04
申请人： Shinichi Obata , Satoshi Suzuki
设计人： Shinichi Obata , Satoshi Suzuki

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