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    • 7. 发明授权
    • Method of manufacturing printed circuit board
    • 制造印刷电路板的方法
    • US08438726B2
    • 2013-05-14
    • US13083097
    • 2011-04-08
    • Shinichi InoueHiroyuki HanazonoMineyoshi HasegawaKeisuke Okumura
    • Shinichi InoueHiroyuki HanazonoMineyoshi HasegawaKeisuke Okumura
    • H05K3/02
    • H05K3/20H05K1/0393Y10T29/49117Y10T29/49144Y10T29/49155
    • A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
    • 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来,将抗蚀剂膜曝光和显影,从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后,在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影,使得在导体图案上形成粘合剂图案。 之后,将基底绝缘层接合到导体图案上,其中夹有粘合剂图案。 最后,将载体层与导体图案分离,从而制造FPC基板。
    • 9. 发明授权
    • Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
    • 用于光学膜,压敏粘合剂光学膜和图像显示器的压敏粘合剂组合物
    • US08709597B2
    • 2014-04-29
    • US12916959
    • 2010-11-01
    • Yuusuke ToyamaShinichi InoueMizue NagataToshitsugu Hosokawa
    • Yuusuke ToyamaShinichi InoueMizue NagataToshitsugu Hosokawa
    • B32B15/04
    • C08G18/6229C08F8/00C08F2800/20C08G18/10C08G18/6254C08G18/73Y10T428/2891C08F220/12
    • There is provided a pressure-sensitive adhesive composition for optical films. The composition can form a pressure-sensitive adhesive layer that can prevent light leakage caused by stress associated with dimensional change of a component such as an optical film, which include the pressure-sensitive adhesive layer that has reworkability such that it can be easily peeled from a component, and that has satisfactory processability such that it can be processed without pressure-sensitive adhesive stain or dropout, after it is formed on an optical film. A pressure-sensitive adhesive optical film produced using the composition is also provided. The pressure-sensitive adhesive composition includes a (meth)acrylic polymer including (a) 34 to 94% by weight of an alkyl (meth)acrylate monomer unit, (b) 5 to 35% by weight of an aromatic ring-containing (meth)acrylate monomer unit, and (c) 0.01 to 0.5% by weight of an amino group-containing (meth)acrylate monomer unit and further including (d) 0.05 to 3% by weight of a carboxyl group-containing (meth)acrylate monomer unit and/or (e) 0.05 to 2% by weight of a hydroxyl group-containing (meth)acrylate monomer unit and having a weight average molecular weight of 1,600,000 to 3,000,000 as determined by gel permeation chromatography; crosslinking agents including 0.01 to 5 parts by weight of an isocyanate crosslinking agent and 0.01 to 2 parts by weight of a silane coupling agent based on 100 parts by weight of the (meth)acrylic polymer.
    • 提供了一种用于光学膜的压敏粘合剂组合物。 该组合物可以形成一种压敏粘合剂层,其可以防止由与诸如光学膜的组分的尺寸变化相关的应力引起的光泄漏,其包括具有可再加工性的压敏粘合剂层,使得其可以容易地从 并且具有令人满意的加工性,使得其可以在形成在光学膜上之后可以被加工而没有压敏粘合剂污渍或脱落。 还提供了使用该组合物制备的压敏粘合剂光学膜。 压敏粘合剂组合物包括(甲基)丙烯酸类聚合物,其包含(a)34-94重量%的(甲基)丙烯酸烷基酯单体单元,(b)5-35重量%的含芳环的(甲基) )丙烯酸酯单体单元,(c)0.01〜0.5重量%的含氨基(甲基)丙烯酸酯单体单元,进一步含有(d)0.05〜3重量%的含羧基的(甲基)丙烯酸酯单体 单元和/或(e)0.05〜2重量%的含羟基的(甲基)丙烯酸酯单体单元,通过凝胶渗透色谱法测定的重均分子量为1,600,000至3,000,000; 交联剂,其包含0.01至5重量份的异氰酸酯交联剂和基于100重量份的(甲基)丙烯酸类聚合物)的0.01至2重量份的硅烷偶联剂。