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1. 发明授权

US5504924A Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards 失效
标题翻译：使用与板上的半导体器件接触的柔性部件的电子计算机的冷却系统
公开(公告)号：US5504924A
公开(公告)日：1996-04-02
申请号：US317621
申请日：1994-09-26
申请人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
发明人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20 , G06F9/00
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , H05K7/20809 , G06F2200/201
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.
摘要翻译：一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

2. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

3. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

4. 发明授权

US5361188A Cooling apparatus of electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5361188A
公开(公告)日：1994-11-01
申请号：US115669
申请日：1993-09-02
申请人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
发明人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20 , H01L23/467
CPC分类号： H01L23/467 , H05K7/20563 , H01L2224/32 , H01L2224/73253 , Y10S165/908
摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.
摘要翻译：在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

5. 发明授权

US5313362A Packaging structure of small-sized computer 失效
标题翻译：小型电脑包装结构
公开(公告)号：US5313362A
公开(公告)日：1994-05-17
申请号：US885979
申请日：1992-05-20
申请人： Toshio Hatada , Hiroshi Inouye , Takao Ohba , Susumu Iwai
发明人： Toshio Hatada , Hiroshi Inouye , Takao Ohba , Susumu Iwai
IPC分类号： G06F1/20 , H01L23/36 , H01L23/467 , H05K7/20
CPC分类号： G06F1/203
摘要： In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40.degree. C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50.degree. to 60.degree. C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.
摘要翻译：在天然空气冷却型的小型计算机中，高温散热器促进自然对流，从而增加散热量，并且提高LSI芯片的允许的发热极限，从而提高处理速度电脑为此，在约40℃的相对低的温度下，壳体和翅片被用作热辐射器，即使操作者的手被触摸也是安全的。另一方面，在壳体内部设置约50〜60℃的高温散热器，防止操作者的手直接接触。通过LSI芯片等产生的热量通过热传导等传递到高温散热器，并且在升温的高温散热器和引入壳体的空气之间进行热交换，以促进套管内部自然对流。

6. 发明授权

US4708350A Magnetic liquid seal with magnetized deformable magnet 失效
标题翻译：磁性液体密封与磁化可变形磁铁
公开(公告)号：US4708350A
公开(公告)日：1987-11-24
申请号：US886813
申请日：1986-07-18
申请人： Muneo Mizumoto , Hiroshi Inouye , Hiroyuki Kitsunai
发明人： Muneo Mizumoto , Hiroshi Inouye , Hiroyuki Kitsunai
IPC分类号： F16J15/43 , F16J15/16 , F16J15/40
CPC分类号： B82Y15/00 , F16J15/43
摘要： A magnetic liquid seal retains a magnetic liquid by means of the magnetic force applied thereto from a magnet. The magnet is constituted by a magnetized deformable member.
摘要翻译：磁性液体密封件借助于从磁体施加到其上的磁力而保持磁性液体。磁体由磁化的可变形构件构成。

7. 发明授权

US5258047A Holder device and semiconductor producing apparatus having same 失效
标题翻译：持有器件及其制造装置
公开(公告)号：US5258047A
公开(公告)日：1993-11-02
申请号：US800834
申请日：1991-11-29
申请人： Hiromitsu Tokisue , Hiroyuki Kitsunai , Nobuo Tsumaki , Hiroshi Inouye
发明人： Hiromitsu Tokisue , Hiroyuki Kitsunai , Nobuo Tsumaki , Hiroshi Inouye
IPC分类号： B05B13/02 , B23Q3/15 , H01L21/683 , H01L21/687 , H02N13/00 , B05B13/00
CPC分类号： H01L21/6831 , B05B13/02 , H01L21/68707 , Y10T29/41 , Y10T29/413 , Y10T29/417
摘要： A device for holding an object by electrostatic force includes a body made of a dielectric of a low resistivity, such as SiC, and an electrode provided on that surface of the device body facing away from a holder surface, so that a potential difference is produced between the object and the holder surface. A change-over switch for grounding the device body to an earth potential of an ambient environment is provided, so that the dielectric can be rapidly brought into a potential equal to the earth potential.
摘要翻译：用于通过静电力保持物体的装置包括由诸如SiC的低电阻率的电介质制成的主体以及设置在器件主体的远离保持器表面的表面上的电极，从而产生电位差在物体和支架表面之间。提供了用于将设备主体接地到环境环境的地电位的转换开关，使得电介质可以被迅速地变成等于地电位的电位。

8. 发明授权

US5077888A Article assembling method and device 失效
标题翻译：文章组装方法和装置
公开(公告)号：US5077888A
公开(公告)日：1992-01-07
申请号：US480943
申请日：1990-02-16
申请人： Hiromitsu Tokisue , Hiroshi Inouye
发明人： Hiromitsu Tokisue , Hiroshi Inouye
IPC分类号： B23P19/04 , B23P19/00 , B23P19/02 , B25J15/06 , B25J17/02 , G11B17/038 , G11B23/00
CPC分类号： B23P19/10 , B23P19/006 , B25J17/0208 , G11B17/038 , G11B23/00 , Y10T29/49901
摘要： A device for mounting magnetic discs on a spindle of a magnetic disc file assembly has a disc transfer mechanism provided with a disc supporting surface operative to support a disc in non-contacting and relatively movable relationship with a fluid film formed therebetween. The thus supported disc is axialy aligned, by a positioning mechanism, with the spindle and then released into engagement with the spindle. The floating support of the disc allows the disc to be moved relative to the disc supporting surface first into alignment and then into engagement with the spindle without any mechanical contact and friction between the disc supporting surface and the disc to thereby prevent the production of dusty material otherwise produced by mechanical contact between the disc and the supporting surface.

9. 发明授权

US4639146A Thrust bearing 失效
标题翻译：推力轴承
公开(公告)号：US4639146A
公开(公告)日：1987-01-27
申请号：US600324
申请日：1984-04-13
申请人： Masahiro Yoshioka , Hideki Izumi , Hiroshi Inouye , Eiichi Hazaki , Shiro Nakadaira
发明人： Masahiro Yoshioka , Hideki Izumi , Hiroshi Inouye , Eiichi Hazaki , Shiro Nakadaira
IPC分类号： F16C17/06 , F16C27/00 , F16C27/02 , F16C27/08
CPC分类号： F16C17/06
摘要： A thrust bearing has a plurality of bearing pads each provided on its back side with a pivot, and a support on which the pads are disposed in the circumferential direction. An integral carrier is mounted on the support. The carrier has leg portions and a resilient portion and definies a squeeze film damper portion between the rear surface thereof and the opposing surface of the support. The pads are carried tiltably by the carrier through the pivots.
摘要翻译：推力轴承具有多个轴承瓦片，每个轴承瓦片在其后侧具有枢轴，支撑件在其周向上设置有支撑件。整体载体安装在支架上。载体具有腿部和弹性部分，并且在其后表面和支撑体的相对表面之间限定挤压薄膜阻尼部分。垫片由载体通过枢轴可倾斜地承载。

10. 发明授权

US4296935A Mechanical seal 失效
标题翻译：机械密封
公开(公告)号：US4296935A
公开(公告)日：1981-10-27
申请号：US83340
申请日：1979-10-10
申请人： Hiroshi Inouye
发明人： Hiroshi Inouye
IPC分类号： F16J15/34 , F16J15/48
CPC分类号： F16J15/3448 , Y10S277/91
摘要： In a mechanical seal for the rotary shaft of a rotary machine wherein the pressure difference between the internal and external liquids acting on the mechanical seal changes from positive to negative, and vice versa, a ring and a seat ring are formed with mating seal faces which coact to seal between the internal and exterior liquid present externally and internally, respectively, of the retainer; the seat ring is securely and liquid-tightly mounted on the rotary shaft for rotation therewith in a casing; the ring is fitted over a retainer axially movably, but nonrotationally and is normally pressed against the seat ring under the force of a bias spring which provides the sealing force for maintaining the seal between the seal faces when the external liquid pressure exceeds the internal liquid pressure, but the pressure difference is relatively small; the retainer in turn is mounted in the casing nonrotationally but axially movably due to the difference in pressure between the internal and external liquids, whereby regardless of the difference in pressure between the internal and external liquids, the seal may be maintained securely.
摘要翻译：在用于旋转机械的旋转轴的机械密封件中，其中作用在机械密封件上的内部和外部液体之间的压力差从正向变化到负，反之亦然，环和座环形成有配合密封面，共同密封在保持器的外部和内部分别存在的内部和外部液体之间; 所述座圈牢固且液密地安装在所述旋转轴上，以便在壳体中旋转; 环被安装在轴向可移动的保持器上，但是非旋转地并且通常在偏置弹簧的作用下被压靠在座环上，当偏压弹簧的作用力提供密封力时，当外部液体压力超过内部液体压力时，该密封力保持在密封面之间，但压差相对较小; 保持器依次由于内部和外部液体之间的压力差异而非旋转地安装在壳体中，但是可轴向移动，由此不管内部和外部液体之间的压力差如何，可以可靠地保持密封。

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