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    • 2. 发明公开
      EP2253671A1 Silicone Resin Composition for Optical Semiconductor Devices and an Optical Semiconductor Device 有权
    • Silicone Resin Composition for Optical Semiconductor Devices and an Optical Semiconductor Device
    • Silikonharzzusammensetzungfüroptische Halbleiterbauelemente und optisches Halbleiterbauelement
    • EP2253671A1
    • 2010-11-24
    • EP10160782.8
    • 2010-04-22
    • Shin-Etsu Chemical Co., Ltd.
    • Taguchi, Yusuke , Hagiwara, Kenji , Sawada, Junichi
    • C08L83/04 , H01L23/29 , H01L31/0203 , H01L33/56 , C09K3/10
    • C08L83/04 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L2205/035 , H01L21/02126 , H01L21/02216 , H01L21/3122 , H01L23/296 , H01L33/56 , H01L2224/29499 , H01L2224/48091 , H01L2224/48247 , C08L2666/22 , C08L2666/14 , C08L2666/54 , C08L83/00 , H01L2924/00014
    • Problems
      The purpose of the present invention is to provide a silicone resin composition for optical semiconductor devices which provides a cured product, wherein warpage in the optical semiconductor device in curing is less and whiteness, heat-resistance, and light resistance are superior.
      Means to Solve the Problems
      A silicone resin composition, comprising
      (A) 100 parts by weight of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1),

              (CH 3 ) a Si(OR 1 ) b (OH) c O (4-a-b-c)/2      (1)

      wherein R 1 is a monovalent hydrocarbon group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8
      (B) 3 to 200 parts by weight of a white pigment,
      (C) 400 to 1000 parts by weight of an inorganic filler other than the afore-mentioned white pigment,
      (D) 0.01 to 10 parts by weight of a condensation catalyst, and
      (E)1.0 to 10 parts by weight of an epoxy resin which is a derivative of isocyanuric acid,
      (F) 2 to 50 parts by weight of an organopolysiloxane comprising unit R 2 SiO and unit RSiO 1.5 , wherein R may be the same or different and is a group selected from the group consisting of a hydroxyl group, a methyl group, an ethyl group, a propyl group, a cyclohexyl group, a phenyl group, a vinyl group and an allyl group, wherein at least a part of the afore-mentioned unit R 2 SiO repeats itself in series and the number of the repetition is 5 to 100, and wherein 0.5 to 10 mole % of the siloxane units comprising unit R 2 SiO and unit RSiO 1.5 has a silanol group, and
      (G) 2 to 50 parts by weight of the linear dioraganopolysiloxane represented by the following formula (2).

      wherein R 5 and R 6 are, independently of each other, selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, a vinyl group, a phenyl group and an allyl group, and n is an integer of from 800 to 1200.
    • 发明内容本发明的目的在于提供一种提供固化物的光半导体装置用有机硅树脂组合物，其中，光固化中的光半导体装置的翘曲小，白度，耐热性，耐光性优异。 解决问题的方法一种有机硅树脂组合物，其包含（A）100重量份的重均分子量为500至20000的有机聚硅氧烷，还原为聚苯乙烯，并由以下平均组成式（1）表示： ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（CH 3）a Si（OR 1）b（OH）c O（4-abc）/ 2€ƒ€ƒ€ƒ€ƒ（1 ）其中R 1是具有1至4个碳原子的一价烃基，a，b和c是满足以下等式的数：0.8 <= a <= 1.5,0 <= b <= 0.3，0.001 <= c < 0.5和0.801 <= a + b + c <2，（B）3至200重量份的白色颜料，（C）400至1000重量份的除上述白色颜料之外的无机填料， （D）0.01〜10重量份缩合催化剂，（E）1.0〜10重量份作为异氰脲酸衍生物的环氧树脂，（F）2〜50重量份的包含单体的有机聚硅氧烷 R 2 SiO和单元RSiO 1.5，其中R 可以相同或不同，并且是选自羟基，甲基，乙基，丙基，环己基，苯基，乙烯基和烯丙基的基团，其中在 上述单元R 2 SiO的至少一部分自身重复，重复数为5〜100，其中0.5〜10摩尔％的包含单元R 2 SiO和单元RSiO 1.5的硅氧烷单元具有硅烷醇 和（G）2〜50重量份由下式（2）表示的直链二糖基聚硅氧烷。 其中R 5和R 6彼此独立地选自具有1至3个碳原子的烷基，环己基，乙烯基，苯基和烯丙基，n是整数 从800到1200。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Global Dossier Espacenet 法律信息 同族专利 专利引用
    • 5. 发明公开
      EP2295499A1 Underfill composition and an optical semiconductor device 有权 转让
    • Underfill composition and an optical semiconductor device
    • Unterfüllungszusammensetzungund optisches Halbleiterbauelement
    • EP2295499A1
    • 2011-03-16
    • EP10176334.0
    • 2010-09-13
    • Shin-Etsu Chemical Co., Ltd.
    • Taguchi, Yusuke , Sawada, Junichi
    • C08L83/04 , H01L23/29 , H01L33/56
    • H01L23/296 , C08G77/16 , C08G77/70 , C08K3/36 , C08K5/544 , C08K5/548 , C08K9/06 , C08L83/04 , H01L21/563 , H01L33/56 , H01L2924/0002 , C08L83/00 , H01L2924/00
    • The purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are improved. The present invention is an underfill composition, comprising:
      (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1),

               (CH 3 ) a Si(OR 1 ) b (OH) c O (4-a-b-c)/2      (1)

      wherein R 1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8
      (B) 250 to 1000 parts by weight of an inorganic filler,
      (C) 0.01 to 10 parts by weight of a condensation catalyst,
      (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety represented by the following formula (2),

      wherein R 2 and R 3 are, independently of each other, selected from the group consisting of a hydroxyl group, alkyl groups having 1 to 3 carbon atoms, a cyclohexyl group, a vinyl group, a phenyl group and an allyl group, and m is an integer of from 5 to 50, provided that the total amount of component (A) and component (D) is 100 parts by weight, and
      (E) 0.2 to 2.0 parts by weight of a silane coupling agent.
    • 本发明的目的是提供一种光学半导体装置的底部填充剂组合物，其可以提供其成型性，对金凸块的粘附性，耐热性和耐光性得到改善的固化产物。 本发明是一种底部填充剂组合物，其包含：（A）60〜99重量份的重均分子量为500〜20000的分支有机聚硅氧烷，还原为聚苯乙烯，并由以下平均组成式（1）表示， ，€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（CH 3）a Si（OR 1）b（OH）c O（4-abc）/ 2€ƒ€ƒ€ƒ€ƒ （1）其中R 1是具有1至4个碳原子的有机基团，a，b和c是满足以下等式的数：0.8 <= a <= 1.5,0 <= b <= 0.3，0.001 <= c < =0.5,0.801≤a+ b + c <2，（B）250〜1000重量份的无机填料，（C）0.01〜10重量份的缩合催化剂，（D）1〜40重量份 的具有由下式（2）表示的直链二有机聚硅氧烷部分的有机聚硅氧烷，其中R 2和R 3彼此独立地选自羟基，具有1至3个碳原子的烷基 ，一个环境 乙基，苯基和烯丙基，m为5〜50的整数，条件是成分（A）和成分（D）的总量为100重量份，（E ）0.2〜2.0重量份的硅烷偶联剂。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Global Dossier Espacenet 法律信息 同族专利 专利引用
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