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1. 发明专利

JP2013107375A Band saw cutting device, and ingot cutting method 有权
标题翻译：带锯切割装置和切割方法
公开(公告)号：JP2013107375A
公开(公告)日：2013-06-06
申请号：JP2011256654
申请日：2011-11-24
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B28D5/04 , B24B27/06 , H01L21/304
CPC分类号： B28D1/08 , B23D55/082 , B23D55/086 , B23D59/04 , B24B27/06 , B28D5/04 , B28D5/045
摘要： PROBLEM TO BE SOLVED: To provide a band saw cutting device and an ingot cutting method capable of stably suppressing the displacement of a blade during cutting, stably keeping the quality of cut surface of an ingot block and a wafer, elongating a life of the blade and improving the cutting speed.SOLUTION: The band saw cutting device which cuts an ingot by sending a blade relatively from the upper side of the ingot to the lower side while guiding the blade circularly driven by means of a static pressure pads further includes a driving unit which moves the static pressure pads in the front-back direction with respect to the circular direction of the blade and a control unit which controls the movement distance and the movement speed of the static pressure pads by means of the driving unit, wherein the ingot is cut while controlling the movement of the static pressure pads with the control unit.
摘要翻译：解决问题的方案为了提供能够稳定地抑制切割时的叶片的位移的带锯切割装置和锭切割方法，能够稳定地保持锭块和晶片的切割面的质量，延长寿命的刀片并提高切割速度。解决方案：通过将锭子从锭的上侧相对地向下侧发送刀片来切割锭的带锯切割装置，同时引导通过静压垫圆周驱动的刀片还包括驱动单元，其移动相对于叶片的圆周方向的前后方向的静压垫和通过驱动单元控制静压垫的移动距离和移动速度的控制单元，其中，切割该锭，同时通过控制单元控制静压垫的移动。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2009233819A Cylindrical grinding device for single crystal ingot and method of machining the same 审中-公开
标题翻译：用于单晶体的圆柱磨削装置及其加工方法
公开(公告)号：JP2009233819A
公开(公告)日：2009-10-15
申请号：JP2008085195
申请日：2008-03-28
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B24B5/50 , B24B5/00
摘要： PROBLEM TO BE SOLVED: To provide a cylindrical grinding device for a single crystal ingot capable of improving wafer manufacturing efficiency by improving mark recognizing accuracy to reduce the number of times of repetitions of a mark position detection step in a step of detecting the position of the mark of the single crystal ingot and simplifying operation by eliminating operations by an operator for preventing the mark from being erroneously recognized, and also to provide a method of machining the single crystal ingot.
SOLUTION: This cylindrical grinding device includes at least a camera for taking in the image of the side surface of the single crystal ingot having a mark with reference to a crystal line beforehand, and a controller for processing the image taken therein. The cylindrical grinding device recognizes and stores the position of the mark provided beforehand by an image processing means for recognizing and storing the position of the mark. The method of machining the single crystal ingot is also provided.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过提高标记识别精度来提高晶片制造效率的单晶锭的圆柱形研磨装置，以减少检测步骤中的标记位置检测步骤的重复次数单晶锭的标记的位置，并且通过消除操作者的操作来简化操作，以防止标记被错误识别，并且还提供了对单晶锭进行加工的方法。解决方案：该圆柱形磨削装置至少包括一个相机，用于预先摄取具有参考晶体线的标记的单晶锭的侧表面的图像，以及用于处理其中取出的图像的控制器。圆柱形磨削装置识别并存储由用于识别和存储标记的位置的图像处理装置预先设置的标记的位置。还提供了加工单晶锭的方法。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2008200816A Cylindrical grinder 审中-公开
标题翻译：圆柱磨床
公开(公告)号：JP2008200816A
公开(公告)日：2008-09-04
申请号：JP2007040583
申请日：2007-02-21
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B24B5/04 , B24B41/06
摘要： PROBLEM TO BE SOLVED: To provide a cylindrical grinder, which can reduce the occurrence of a slide and a shift in position between a crystal rod and a rotating supporting device due to grinding load in traverse grinding during a cylindrical grinding process and can produce the crystal rod having a good ground face around an outer periphery of the rod and an accurate diameter.
SOLUTION: The cylindrical grinder 1 has, at least, supporting units 4a and 4b equipped with supporting devices 2a and 2b having a conical dent 7 formed on tips of a main spindle 3a and a sub spindle 3b for sandwiching the crystal rod 6 in the axial direction and rotatably supporting it around the axis, and a grinding unit 5 for traverse-grinding the outer periphery of the crystal rod 6 while moving in the axial direction of the rod 6. The supporting device 2a attached to the main spindle 3a is for holding the crystal rod 6 via an elastic material 8.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种圆柱形磨床，其可以在圆柱形磨削过程中由于横动磨削中的磨削负载而减少滑块的发生和晶棒与旋转支撑装置之间的位置偏移，并且可以产生在棒的外周附近具有良好的研磨面并具有精确直径的晶棒。解决方案：圆柱形研磨机1至少具有配备有支撑装置2a和2b的支撑单元4a和4b，该支撑装置2a和2b具有形成在主轴3a的尖端上的锥形凹部7和用于夹住晶体棒6的副心轴3b 在轴线方向上可旋转地支撑在轴上的磨削单元5，用于在杆6的轴向移动的同时对结晶棒6的外周进行横向磨削的磨削单元5.安装在主轴3a上的支撑装置2a 用于通过弹性材料8保持晶棒6.版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2009111260A Ingot cutting device 有权
标题翻译： INGOT切割装置
公开(公告)号：JP2009111260A
公开(公告)日：2009-05-21
申请号：JP2007283849
申请日：2007-10-31
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： H01L21/304 , B28D5/02 , B28D5/04 , C30B29/06 , C30B35/00
摘要： PROBLEM TO BE SOLVED: To provide an ingot cutting device capable of preventing a short block from being overturned, falling or being damaged on a tray for carrying, saving labor, improving productivity and suppressing the increase of costs and an equipment occupancy space by newly provided equipment.
SOLUTION: The ingot cutting device 10 is provided with a cutting part 11 for cutting an ingot 1 by a cutting means 16 and dividing it into blocks 1a, a send-out/send-in part 12 with a table 18 for sending out and sending in a tray 15 for cutting, a control part 13 for controlling the operation of the send-out/send-in part, and a transfer part 14 for transferring the cut block 1a to the tray 2 for carrying. The transfer part 14 is provided with an arm mechanism 19 and a bring-down mechanism 20, a long block 1b is transferred to the tray 2 for carrying by the arm mechanism 19, and a short block 1c is brought down by the bring-down mechanism 20 and transferred to the tray 2 for carrying.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止短块在托盘上被翻转，落下或损坏的锭切割装置，节省劳动力，提高生产率并抑制成本增加和设备占用空间由新提供的设备。解决方案：锭切割装置10设置有切割部分11，用于通过切割装置16切割锭块1，并将其分成块1a，发送/送入部分12，其具有用于发送的台18 输出和发送在用于切割的托盘15中，用于控制发送/发送部分的操作的控制部分13以及用于将切割块1a传送到用于传送的托盘2的传送部分14。传送部14设置有臂机构19和降下机构20，长块1b被传送到托架2，以通过臂机构19进行传送，并且短块1c通过降低机构20，并传送到托盘2以进行携带。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2014087854A Dressing method of inner peripheral blade 有权
标题翻译：内部叶片的磨损方法
公开(公告)号：JP2014087854A
公开(公告)日：2014-05-15
申请号：JP2012237717
申请日：2012-10-29
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B24B53/00
摘要： PROBLEM TO BE SOLVED: To provide a dressing method of an inner peripheral blade capable of improving life of the inner peripheral blade, by improving a variation in dressing accuracy by skill of a worker.SOLUTION: The dressing method of the inner peripheral blade is provided for locally dressing an edge by making the inner peripheral blade cut in a dress material by forming the edge by fixing an abrasive grain to an inner peripheral part of a doughnut-shaped thin plate. The dressing method of the inner peripheral blade automatically executes a process of selecting which side part of the left and right of the edge is dressed, by a control apparatus on the basis of the measured displacement direction and a displacement quantity of the inner peripheral blade by measuring the displacement direction and the displacement quantity of the inner peripheral blade by a measuring instrument and a process of locally dressing only the selected side part when dressing the edge.
摘要翻译：要解决的问题：提供一种能够提高内周刀片的使用寿命的内周刀片的修整方法，通过根据作业者的技术改善修整精度的变化。解决方案：提供内周刀片的修整方法通过将磨料颗粒固定在环形薄板的内周部分上形成边缘，通过使内周边刀片切割成衣服材料来局部修整边缘。内周刀片的修整方法通过控制装置根据测量的位移方向和内周边刀片的位移量自动执行选择边缘左右侧的哪一侧部分的处理通过测量仪器测量内周叶片的位移方向和位移量，以及在修整边缘时仅局部修整选定侧面部分的过程。

6. 发明专利

JP2012116049A Ingot cutting method 有权
标题翻译： INGOT切割方法
公开(公告)号：JP2012116049A
公开(公告)日：2012-06-21
申请号：JP2010266505
申请日：2010-11-30
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B28D1/10 , B24B49/12 , B28D1/08 , C30B29/06 , C30B35/00 , H01L21/304
CPC分类号： B28D1/10 , B28D5/0064
摘要： PROBLEM TO BE SOLVED: To provide an ingot cutting method that inhibits the displacement of a cutting position by highly accurately specifying the base point of the cutting position regardless of diameters and conical end shapes of diversified monocrystalline ingots.SOLUTION: The ingot cutting method cuts a monocrystalline ingot having a cylindrically-ground columnar straight body, and each conical end in a mirror-surface state that is formed at least at one end of the straight body and not cylindrically ground. The ingot cutting method comprises: a step in which a difference in light reflection between the surface of the cylindrically-ground straight body and the surface of each conical end in a mirror-surface state that is not cylindrically ground is utilized so as to detect the position of a boundary between the cylindrically-ground surface and the surface that is not cylindrically ground; and a step in which the ingot is cut after executing the positioning of cutting positions by using the detected position of the boundary as the base point.
摘要翻译：要解决的问题：提供一种通过高精度地指定切割位置的基点来抑制切割位置的位移的锭切割方法，而与多种单晶锭的直径和锥形端部形状无关。解决方案：锭切割方法切割具有圆柱形立柱柱状直体的单晶锭，并且每个圆锥形端部至少形成在直体的一端并且不是圆柱形接地的镜面状态。锭切割方法包括：利用圆柱形直的本体的表面与每个圆锥形端部的表面之间的光反射在不是圆柱形接地的镜面状态下的差异，以便检测在圆柱形地面和未圆柱形地面之间的边界位置; 并且通过使用检测到的边界位置作为基点，在执行切割位置的定位之后切割锭块的步骤。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011056647A Dressing method of inner peripheral blade 审中-公开
标题翻译：内部叶片的磨损方法
公开(公告)号：JP2011056647A
公开(公告)日：2011-03-24
申请号：JP2009212055
申请日：2009-09-14
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B24B53/00 , B28D5/02 , H01L21/304
CPC分类号： B24B53/06 , B23D63/00
摘要： PROBLEM TO BE SOLVED: To provide an inner peripheral blade dressing method capable of effectively correcting displacement of the inner peripheral blade and improving the life of the inner peripheral blade by locally and effectively dressing a blade tip of an inner peripheral blade in a short time.
SOLUTION: This inner peripheral blade dressing method includes a step for forming a reference groove on a dressing material in advance, a step for selecting either side of a blade tip to be dressed, a step for relatively moving an inner peripheral blade and the dressing material so that a position of a corner of an opening of the reference groove is identical to a leading position of the blade tip by placing the opening of the reference groove opposite to a side selected for dressing, and a step for cutting the dressing material and locally dressing only a portion on a side selected by the blade tip without making a portion of the blade tip opposite to the side selected for dressing into contact with the dressing material by simultaneously and relatively feeding the blade tip toward a depth direction of the dressing material and toward the side of the blade tip selected for dressing.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效地校正内周叶片的位移并通过局部地且有效地修整内周叶片的叶片尖端来改善内周叶片的寿命的内周刀片修整方法短时间。解决方案：该内周刀片修整方法包括预先在敷料材料上形成基准槽的步骤，用于选择要修整的刀片末端的任一侧的步骤，用于相对移动内周刀片的步骤，以及所述敷料材料使得所述基准槽的开口的角部的位置与所述叶片尖端的前端位置相同，所述前端位置是将所述基准槽的开口与所选择的修整侧相对，以及切割所述敷料的步骤材料并且仅局部地修整由叶片尖端选择的一侧的部分，而不使叶片尖端的一部分与被选择用于修整的侧面相对，以与敷料材料接触，同时并相对地将叶片尖端朝向修整材料并朝向选择用于敷料的刀片尖端的侧面。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010158628A Precoat type dehydration treatment apparatus and removing method of precoat layer of precoat type dehydration treatment apparatus 有权
标题翻译： PRECOAT型脱水处理装置和预处理层脱水处理装置的去除方法
公开(公告)号：JP2010158628A
公开(公告)日：2010-07-22
申请号：JP2009002789
申请日：2009-01-08
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： NAKAGAWA KAZUYA
IPC分类号： B01D33/06 , B01D37/02
摘要： PROBLEM TO BE SOLVED: To provide a precoat type dehydration treatment apparatus, in which a precoat layer is safely removed without damaging a filter cloth or a rotary drum, improving time required for removing the precoat layer, and thereby improving operation cost, and to provide a removing method of a precoat layer. SOLUTION: The precoat type dehydration treatment apparatus 1 dehydrates sewage 5 by sucking the sewage 5 into the rotary drum 2 through the precoat layer 4 while rotating the rotary drum 2 and decompressing the inside thereof, sucks and accumulates solid state sludge 8 on the outer periphery of the precoat layer 4, and removes the accumulated layer 8 formed on the outer periphery of the precoat layer 4 with a cutter 7. The apparatus has a brush 13 rotatable around a shaft parallel to a rotary shaft of the rotary drum 2, and a feeding mechanism 14 moving the brush 13 in the fore-and-aft direction of the precoat layer 4. The precoat layer 4 can be removed by coming into contact with the brush 13 by feeding the brush 13, while rotating it, to the precoat layer 4 direction with the feeding mechanism 14. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种预涂层脱水处理装置，其中安全地除去预涂层而不损坏滤布或旋转滚筒，改善除去预涂层所需的时间，从而提高操作成本，并提供预涂层的去除方法。解决方案：预涂型脱水处理装置1通过将旋转滚筒2旋转并减压其内部而将污水5通过预涂层4吸入旋转滚筒2而使污水5脱水，将固体状污泥8吸入并积聚预涂层4的外周，并且用切割器7除去形成在预涂层4的外周上的积聚层8.该装置具有可绕平行于旋转滚筒2的旋转轴的轴旋转的刷子13 以及沿着预涂层4的前后方向移动刷子13的进给机构14.通过在将刷子13旋转的同时将刷子13与毛刷13接触来除去预涂层4，预涂层4与进给机构14的方向。版权所有（C）2010，JPO＆INPIT

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