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1. 发明专利

JP2008094902A Thixotropic sealant 有权
标题翻译： THIXOTROPIC SEALANT
公开(公告)号：JP2008094902A
公开(公告)日：2008-04-24
申请号：JP2006276031
申请日：2006-10-10
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C08L63/00 , C08K3/00 , C08K5/09 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a thixotropic sealant giving a semiconductor product having high reliability, imparting stable thixotropic nature and effective for preventing exposure of a lead wire after curing by controlling the shape maintenance after the application, by comprehending the behavior of the thixotropic nature relating to the shape-retention of the thixotropic sealant. SOLUTION: The thixotropic sealant contains (A) a liquid epoxy resin, (B) an acid anhydride curing agent having a free acid content of ≤0.1 mass%, (C) an inorganic filler containing ≤1 mass% particles having a particle diameter of ≥128 μm and having an average particle diameter of 5-20 μm, and (D) an inorganic filler surface-treated with a non-reactive organic silicon compound and having an average particle diameter of 0.01-0.1 μm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有高可靠性的触变密封剂，赋予稳定的触变性，并且通过控制施加后的形状维持来有效地防止固化后的引线的暴露，通过理解触变性与触变密封胶的形状保持有关。触变密封剂含有（A）液体环氧树脂，（B）游离酸含量≤0.1质量％的酸酐固化剂，（C）含有≤1质量％的具有粒径≥128μm，平均粒径为5-20μm，（D）用非反应性有机硅化合物表面处理的平均粒径为0.01〜0.1μm的无机填料。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008088378A Liquid epoxy resin composition for semiconductor encapsulation, its manufacturing method and semiconductor device 审中-公开
标题翻译：用于半导体封装的液体环氧树脂组合物及其制造方法和半导体器件
公开(公告)号：JP2008088378A
公开(公告)日：2008-04-17
申请号：JP2006273705
申请日：2006-10-05
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C08G59/50 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for semiconductor encapsulation which stably gives good gap penetration property in performing the underfill, its manufacturing method and a semiconductor device encapsulated by using the cured product of this composition as a underfill material.
SOLUTION: The liquid epoxy resin composition for semiconductor encapsulation employs (a) a liquid epoxy resin, (b) an inorganic filler and (c) 2-phenyl-4,5-dihydroxymethyl imidazole curing accelerator as the essential components and is characterized in that the average particle size of the curing accelerator, the component (c), is 3-5 μm and that the mixture or kneaded product containing the above (a)-(c) is aged at 20-30°C for 72-336 hours. The manufacturing method of the composition comprises kneading the mixture containing the (a)-(c) and then aging at 20-30°C for 72-336 hours. The semiconductor device encapsulated by using the cured product of this composition as the underfill material is provided.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体封装用液态环氧树脂组合物，其通过使用该组合物的固化物作为底部填充材料，在进行底部填充剂，其制造方法和半导体装置中稳定地获得良好的间隙渗透性。解决方案：用于半导体封装的液体环氧树脂组合物使用（a）液体环氧树脂，（b）无机填料和（c）2-苯基-4,5-二羟甲基咪唑固化促进剂作为必要组分，并且是其特征在于，固化促进剂（c）成分的平均粒径为3-5μm，含有上述（a） - （c）的混合物或捏合物在20-30℃下老化72 -336小时。组合物的制造方法包括捏合含有（a） - （c）的混合物，然后在20-30℃熟化72-336小时。提供通过使用该组合物的固化产物作为底部填充材料包封的半导体器件。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006028243A Liquid epoxy resin composition, light-shielding material composed of cured product of composition, and semiconductor device sealed with cured product 审中-公开
标题翻译：液体环氧树脂组合物，组合物固化产物的遮光材料和用固化产品密封的半导体器件
公开(公告)号：JP2006028243A
公开(公告)日：2006-02-02
申请号：JP2004205756
申请日：2004-07-13
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C08G59/50 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition excellent in light-shielding property and reliability and useful particularly for semiconductor devices having a light-receiving part such as a digital camera, a light-shielding material composed of a cured product of the composition, and a semiconductor device sealed with the cured product of the composition.
SOLUTION: The liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) a curing accelerator, and (C) 10-40 mass%, based on the whole composition, of a carbon powder bearing a hydroxy group and a carboxy group on the particle surface and having a BET specific surface area of 100-200 m
2 /g where the content of particles having a particle size of at least 75 μm is at most 1 mass% based on the whole amount of the carbon powder. The light-shielding material is composed of the cured product of the composition. The semiconductor device sealed with the cured product of the composition is also provided.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了提供优异的遮光性和可靠性的液体环氧树脂组合物，特别适用于具有诸如数码相机的光接收部分的半导体器件，由固化的该组合物的产物和用组合物的固化产物密封的半导体器件。解决方案：液体环氧树脂组合物包含（A）液体环氧树脂，（B）固化促进剂和（C）基于整个组合物10-40质量％的含有羟基的碳粉末和颗粒表面上的羧基，其BET比表面积为100-200m 2 / SP / g，其中粒径为至少75μm的颗粒的含量为至多1质量％基于碳粉的总量。遮光材料由组合物的固化产物组成。还提供了用该组合物的固化产物密封的半导体器件。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004307701A Highly thixotropic ultraviolet curable resin composition 审中-公开
标题翻译：高分子量紫外线可固化树脂组合物
公开(公告)号：JP2004307701A
公开(公告)日：2004-11-04
申请号：JP2003104975
申请日：2003-04-09
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI , SHIOBARA TOSHIO
IPC分类号： C08L63/00 , C08K3/00 , C08K9/06
摘要： PROBLEM TO BE SOLVED: To provide a highly thixotropic ultraviolet curable resin composition, excellent in sealing properties and shape-maintaining properties after coating, which can be used as a sealing material. SOLUTION: The highly thixotropic ultraviolet curable composition has a viscosity of not more than 100 Pa s at 25°C, a thixotropy in the range of 4-7 with the viscosity ratio of 0.1 rpm/1 rpm (25°C) and a ratio of the contact angles before and after being left for 30 minutes (before being left/after being left) not less than 0.7. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供可用作密封材料的涂覆后的密封性能和形状保持性优异的高触变性紫外线固化性树脂组合物。高触变性紫外线固化性组合物在25℃下的粘度不大于100Pa·s，触变性在4-7范围内，粘度比为0.1rpm / 1rpm（25℃）剩余30分钟之前（左后）之前和之后的接触角的比率不小于0.7。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2003292924A Adhesive for optical device and optical device using the same 审中-公开
标题翻译：用于光学装置的粘合剂和使用该装置的光学装置
公开(公告)号：JP2003292924A
公开(公告)日：2003-10-15
申请号：JP2002134390
申请日：2002-05-09
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI , WAKAO MIYUKI , SHIOBARA TOSHIO
IPC分类号： C08G59/14 , C08G59/62 , C09J163/00 , C09J163/02 , C09J183/04
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for an optical device, capable of preventing peeling at the interface between the adhesive and an optical element caused by thermal expansion and shrinkage, and providing good adhesion and thermal shock resistance to the optical element even in a high-temperature and high- humidity condition, or a temperature-cycling condition.
SOLUTION: The adhesive for the optical device is used for sticking the optical element to a base plate, and comprises (A) a liquid epoxy resin, (B) an inorganic filler having ≤1 wt.% content of particles with ≥45 μm particle diameters, and 1-20 μm average particle diameter. The content of the inorganic filler is 20-90 wt.% based on the whole composition.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种能够防止由热膨胀和收缩引起的粘合剂和光学元件之间的界面处的剥离的光学装置用粘合剂，并且对光学元件提供良好的粘附性和耐热冲击性即使在高温高湿条件或温度循环条件下。解决方案：用于光学装置的粘合剂用于将光学元件粘贴到基板上，并且包括（A）液体环氧树脂，（B）具有≥1重量％颗粒含量的无机填料，≥ 粒径为45μm，平均粒径为1-20μm。基于整个组合物，无机填料的含量为20-90重量％。版权所有（C）2004，JPO

6. 发明专利

JP2009007467A Flame-retardant sidefill material for mounting and semiconductor device 审中-公开
标题翻译：阻燃剂材料用于安装和半导体器件
公开(公告)号：JP2009007467A
公开(公告)日：2009-01-15
申请号：JP2007169956
申请日：2007-06-28
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C08G59/62 , C08K5/101 , C08K9/04 , C08L63/00 , C08L83/10 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/73204 , H01L2224/92125
摘要： PROBLEM TO BE SOLVED: To provide a flame-retardant sidefill material enabling repair and rework, having high sealing performance, providing a semiconductor product excellent in crack resistance and having high reliability by stress relaxation performance of the cured material and a semiconductor device sealed thereby. SOLUTION: The flame-retardant sidefill material for mounting of semiconductor device having a substrate and an element loaded on the substrate is composed of a liquid epoxy resin composition having ≥100 Pa s and COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够进行修复和返修的阻燃性侧面填充材料，具有高密封性能，提供了抗裂性优异并且通过固化材料的应力松弛性能以及半导体装置具有高可靠性的半导体产品密封。解决方案：用于安装具有衬底和装载在衬底上的元件的半导体器件的阻燃剂填充材料由在25℃下具有≥100Pa·s和<1,000Pa·s粘度的液体环氧树脂组合物组成，含有（A）液体环氧树脂，（B）苯酚类固化剂，（C）丙二醇单甲醚乙酸酯和（D）用硬脂酸表面处理的具有1-15μm平均粒径的氢氧化镁粉末和基于100 pts.mass有机成分含量为90-120 pts.mass。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008177521A Sealing material for mounting and semiconductor device 审中-公开
标题翻译：密封材料用于安装和半导体器件
公开(公告)号：JP2008177521A
公开(公告)日：2008-07-31
申请号：JP2007169950
申请日：2007-06-28
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： H01L23/29 , C08G59/62 , C08K3/00 , C08K5/10 , C08L63/00 , H01L21/60 , H01L23/31
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a sealing material for mounting, capable of supplying a repairable and reworkable semiconductor product, suppressing the bleed of a liquid component as a side fill material, preventing the intrusion to a gap between a substrate and an element of the side fill material and being excellent in a gap intrusion property as an under fill material, and a semiconductor device sealed with it.
SOLUTION: The sealing material for mounting the semiconductor device provided with a substrate and an element loaded on the substrate comprises a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a phenol-based curing agent, (C) propylene glycol monomethyl ether acetate, and (D) an inorganic filler, and the semiconductor device is sealed with the sealing material.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于安装的密封材料，能够提供可修复和可再加工的半导体产品，抑制作为侧面填充材料的液体组分的渗出，防止侵入基板和基板之间的间隙侧填充材料的元件和作为下填充材料的间隙侵入性优异，以及用其密封的半导体器件。解决方案：用于安装设置有衬底和装载在衬底上的元件的半导体器件的密封材料包括液体环氧树脂组合物，其包含（A）液体环氧树脂，（B）酚类固化剂，（ C）丙二醇单甲醚乙酸酯，（D）无机填料，半导体装置用密封材料密封。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007284475A Ultraviolet-curing type end sealing material 审中-公开
标题翻译： ULTRAVIOLET固化型密封材料
公开(公告)号：JP2007284475A
公开(公告)日：2007-11-01
申请号：JP2006109824
申请日：2006-04-12
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C09K3/10 , C08K9/06 , C08L63/00 , G02F1/1339 , H01L51/50 , H05B33/04
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet curing type end sealing material having excellent reliability for preventing mixing of water in the interior of a large-sized panel such as a liquid crystal or an organic EL (electroluminescent) display.
SOLUTION: The ultraviolet curing type end sealing material comprises (A) a liquid epoxy resin, (B) an inorganic filler, (C) a cationic photopolymerization initiator and (D) a hygroscopic inorganic filler. (B) The inorganic filler has the surface treated with an un-reactive organosilicon compound and 0.01-0.3 μm average particle diameter. (D) The hygroscopic inorganic filler has ≥1 to 2 /g BET specific surface area and is contained in an amount of ≥20 to ≤40 mass% based on the whole components.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的可靠性以防止诸如液晶或有机EL（电致发光）显示器的大尺寸面板内部的水混合的紫外线固化型端部密封材料。解决方案：紫外线固化型端部密封材料包括（A）液体环氧树脂，（B）无机填料，（C）阳离子光聚合引发剂和（D）吸湿性无机填料。（B）无机填料的表面用非反应性有机硅化合物进行表面处理，平均粒径为0.01-0.3μm。（D）吸湿性无机填料的平均粒径≥1〜25μm，BET比表面积≥100〜≤400m2 / SP / g，含量≥20〜≤40 基于整个组件的质量％。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006306985A Method for producing encapsulating material for cob mounting 有权
标题翻译：用于生产用于COB安装的封装材料的方法
公开(公告)号：JP2006306985A
公开(公告)日：2006-11-09
申请号：JP2005130721
申请日：2005-04-28
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C08L63/00 , C08K3/00 , C08K9/06 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an encapsulating material for COB mounting capable of controlling a held shape after coating by obtaining a thixotropic behavior concerning a shape holding property of the encapsulating material for COB mounting, preventing a lead wire to be exposed after curing and giving a semiconductor product of high reliability.
SOLUTION: The encapsulating material for COB mounting comprises (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler having 1 mass% or less of particles of a particle size of 128 μm or greater and having an average particle size of 5-20 μm, and (D) an inorganic filler having an average particle size of 0.01-0.1 μm and surface-treated with a non-reactive organosilicone compound. The method for producing the encapsulating material for COB mounting comprises mixing and kneading the (A)-(D) constituents and aging the resultant epoxy resin composition at least during a thixotropy varying period which lasts until its thixotropy decreases and increases thereafter.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决方案：提供一种用于COB安装的封装材料，其能够通过获得关于用于COB安装的封装材料的形状保持性能的触变性能来控制涂覆后的保持形状，防止引线在之后露出固化并提供高可靠性的半导体产品。解决方案：用于COB安装的封装材料包括（A）液体环氧树脂，（B）固化剂，（C）具有1质量％以下的粒径为128μm以上的颗粒的无机填料平均粒径为5-20μm，（D）平均粒径为0.01〜0.1μm的无机填料，并用非反应性有机硅氧烷化合物表面处理。制备用于COB安装的包封材料的方法包括混合和捏合（A） - （D）成分并使所得环氧树脂组合物至少在触变变化期间老化直到其触变性降低并随后增加。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006160970A Heat-resistant and ultraviolet-curable resin composition 审中-公开
标题翻译：耐高温和超紫外线固化树脂组合物
公开(公告)号：JP2006160970A
公开(公告)日：2006-06-22
申请号：JP2004357741
申请日：2004-12-10
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUWABARA HARUYOSHI
IPC分类号： C08G59/20 , C08K7/00 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet-curable resin composition excellent in heat resistance and sealing ability.
SOLUTION: The heat-resistant and ultraviolet-curable resin composition comprises (a) 100 pts.mass of a liquid epoxy resin comprising (a-1) 50-80 pts.mass of a naphthalene-type liquid epoxy resin and (a-2) 50-20 pts.mass of a non-naphthalene-type liquid epoxy resin, (b) 42-82 pts.mass of a flaky inorganic filler with an average particle size of larger than 10 μm but not larger than 35 μm and (c) a photocationic polymerization initiator.
COPYRIGHT: (C)2006,JPO&NCIPI

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