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1. 发明授权

US09302306B2 Hot press mold, temperature measuring device, and hot press molding method 有权
标题翻译：热压模具，温度测量装置和热压成型法
公开(公告)号：US09302306B2
公开(公告)日：2016-04-05
申请号：US13508193
申请日：2009-11-09
申请人： Shin'ichiroh Matsumoto , Katsuro Goto , Shinji Ishii , Takefumi Suzuki , Takahiro Yoshihara
发明人： Shin'ichiroh Matsumoto , Katsuro Goto , Shinji Ishii , Takefumi Suzuki , Takahiro Yoshihara
IPC分类号： B21D22/00 , B21D22/21 , B21D37/16 , G01K1/14 , G01K1/16 , B21D22/20
CPC分类号： B21D22/208 , B21D22/20 , B21D22/21 , B21D37/16 , G01K1/14 , G01K1/16
摘要： Provided is a technique which can, in order to guarantee the molding accuracy of hot press molding, accurately measure the temperature of a workpiece being subjected to the hot press molding. A hot press mold is a mold used for hot press molding for hardening and molding a workpiece, which has been heated, by pressing the workpiece. The hot press mold is provided with a stroke type temperature measuring device which is extended and retracted by a pressing force applied thereto through the workpiece. The temperature measuring device is provided in such a manner that the temperature measuring device protrudes outward from the molding surface of the mold, and when subjected to the pressing force applied through the workpiece while being in contact with the workpiece, the temperature measuring device shortens in length and retracts into the mold. It is preferable that the temperature measuring device is provided with a first elastic member and a second elastic member which shorten in length when subjected to the pressing force applied through the workpiece, and that the temperature measuring device is extended and retracted in two stages by means of the first elastic member and the second elastic member.
摘要翻译：提供了为了确保热压成型的成型精度，能够精确地测定经受热压成型的工件的温度的技术。热压模具是用于对通过按压工件加热的工件进行硬化和成型的热压成型用的模具。热压模具设有行程式温度测量装置，该冲程型温度测量装置通过通过工件施加到其上的按压力而延伸和缩回。温度测量装置以使得温度测量装置从模具的模制表面向外突出的方式设置，并且当受到与工件接触的工件施加的压力时，温度测量装置缩短长度并缩回到模具中。优选地，温度测量装置设置有第一弹性构件和第二弹性构件，当经受通过工件施加的按压力时，第二弹性构件和第二弹性构件在长度上缩短，并且温度测量装置通过装置两级延伸和缩回的第一弹性构件和第二弹性构件。

2. 发明申请

US20120234069A1 HOT PRESS MOLD, TEMPERATURE MEASURING DEVICE, AND HOT PRESS MOLDING METHOD 有权
标题翻译：热压模具，温度测量装置和热压成型方法
公开(公告)号：US20120234069A1
公开(公告)日：2012-09-20
申请号：US13508193
申请日：2009-11-09
申请人： Shin'ichiroh Matsumoto , Katsuro Goto , Shinji Ishii , Takefumi Suzuki , Takahiro Yoshihara
发明人： Shin'ichiroh Matsumoto , Katsuro Goto , Shinji Ishii , Takefumi Suzuki , Takahiro Yoshihara
IPC分类号： B21D37/16
CPC分类号： B21D22/208 , B21D22/20 , B21D22/21 , B21D37/16 , G01K1/14 , G01K1/16
摘要： Provided is a technique which can, in order to guarantee the molding accuracy of hot press molding, accurately measure the temperature of a workpiece being subjected to the hot press molding. A hot press mold is a mold used for hot press molding for hardening and molding a workpiece, which has been heated, by pressing the workpiece. The hot press mold is provided with a stroke type temperature measuring device which is extended and retracted by a pressing force applied thereto through the workpiece. The temperature measuring device is provided in such a manner that the temperature measuring device protrudes outward from the molding surface of the mold, and when subjected to the pressing force applied through the workpiece while being in contact with the workpiece, the temperature measuring device shortens in length and retracts into the mold. It is preferable that the temperature measuring device is provided with a first elastic member and a second elastic member which shorten in length when subjected to the pressing force applied through the workpiece, and that the temperature measuring device is extended and retracted in two stages by means of the first elastic member and the second elastic member.
摘要翻译：提供了为了确保热压成型的成型精度，能够精确地测定经受热压成型的工件的温度的技术。热压模具是用于对通过按压工件加热的工件进行硬化和成型的热压成型用的模具。热压模具设有行程式温度测量装置，该冲程型温度测量装置通过通过工件施加到其上的按压力而延伸和缩回。温度测量装置以使得温度测量装置从模具的模制表面向外突出的方式设置，并且当受到与工件接触的工件施加的压力时，温度测量装置缩短长度并缩回到模具中。优选地，温度测量装置设置有第一弹性构件和第二弹性构件，当经受通过工件施加的按压力时，第二弹性构件和第二弹性构件在长度上缩短，并且温度测量装置通过装置两级延伸和缩回的第一弹性构件和第二弹性构件。

3. 发明授权

US08318991B2 Method for producing hydrogen-containing fluoroolefin compound 有权
标题翻译：含氢氟烯烃化合物的制造方法
公开(公告)号：US08318991B2
公开(公告)日：2012-11-27
申请号：US12990858
申请日：2009-07-13
申请人： Tatsuya Sugimoto , Takefumi Suzuki , Jo Konagawa
发明人： Tatsuya Sugimoto , Takefumi Suzuki , Jo Konagawa
IPC分类号： C07C21/00 , C07C17/00
CPC分类号： C07C17/23 , C07C23/06 , C07C23/08
摘要： An unsaturated hydrogen-containing fluoroolefin compound is obtained by bringing an unsaturated fluorine-containing halogen compound into contact with 0.1 to 3 molar equivalents of hydrogen relative to the unsaturated fluorine-containing halogen compound in a vapor phase in the presence of a supported palladium catalyst in which an amount of supported palladium is 0.1% by weight to 2.5% by weight.
摘要翻译：通过使不饱和含氟卤素化合物在负载的钯催化剂存在下，在气相中相对于不饱和含氟卤素化合物与0.1〜3摩尔当量的氢接触，得到不饱和含氢氟烯烃化合物其中负载钯的量为0.1重量％至2.5重量％。

4. 发明授权

US07033255B2 Chamfer processing method and device for plate material 失效
标题翻译：倒角加工方法和板材装置
公开(公告)号：US07033255B2
公开(公告)日：2006-04-25
申请号：US10446118
申请日：2003-05-28
申请人： Kazuyuki Hosoe , Takefumi Suzuki
发明人： Kazuyuki Hosoe , Takefumi Suzuki
IPC分类号： B24B1/00
CPC分类号： F16G5/16 , B24B9/00 , B24B19/26 , B24B21/002 , B24B47/04
摘要： Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.
摘要翻译：通过使板材W端面与旋转的研磨带接触来进行倒角加工。相对的并排研磨带的磨削表面在板材的厚度方向上的中心线上。中心点被认为是从板材端面看的枢轴点，距离小于板材的厚度。板材的枢轴运动沿研磨带的旋转方向进行。这种倒角加工方法和装置能够在小的曲率半径上进行倒角，而不会在研磨带上施加重的张力，同时对多个板材进行均匀的深倒角加工。

5. 发明授权

US06949013B1 Peripheral length correction device of metal rings 失效
标题翻译：金属环外围长度校正装置
公开(公告)号：US06949013B1
公开(公告)日：2005-09-27
申请号：US10644729
申请日：2003-08-21
申请人： Takefumi Suzuki
发明人： Takefumi Suzuki
IPC分类号： F16G5/16 , B21B5/00 , B21B45/02 , B21D1/02 , B21D45/06 , B21D53/14 , B24B7/00 , A47L5/38
CPC分类号： B21D45/06 , B21B5/00 , B21B45/0287 , B21D53/14
摘要： In the peripheral length correction device of metal rings, a metal ring is laid on a driving roller and a driven roller which are displaceable in mutually separating directions. One or both of the rollers are displaced while rotating the rollers, thereby applying tensile stress to the metal ring to correct the peripheral length thereof. The peripheral length correction device of metal rings further comprises a foreign substance removal head, which functions as the removal means for removing foreign substances adhered to the inner peripheral surface of the metal ring, and as the re-adhesion prevention means for preventing re-adhesion of the foreign substances removed by the removal means from the metal ring. There is provided a peripheral length correction device of metal rings which can prevent the reduction in production yield without damaging the rollers even if foreign substances (residual pieces of cutting metal or the like) adhere to the surface of the metal ring in a preceding process (solution treatment or the like) prior to the correction process.
摘要翻译：在金属环的圆周长度校正装置中，将金属环放置在驱动辊和从动辊上，该驱动辊和从动辊可以在相互分离的方向上移动。一个或两个辊在旋转辊的同时移位，从而对金属环施加拉伸应力以校正其周长。金属环的圆周长度校正装置还包括异物去除头，其用作去除附着在金属环的内周面上的异物的去除装置，以及用作防止再附着的再粘合防止装置的去除装置从金属环去除的异物。提供了金属环的周长校正装置，即使在前一过程中异物（切割金属等的残留部分）附着在金属环的表面上时，也可以防止生产量的降低而不损坏辊溶液处理等）。

6. 发明申请

US20100264116A1 PLASMA ETCHING METHOD 有权
标题翻译：等离子体蚀刻法
公开(公告)号：US20100264116A1
公开(公告)日：2010-10-21
申请号：US12733828
申请日：2008-09-26
申请人： Takefumi Suzuki , Tatsuya Sugimoto , Masahiro Nakamura
发明人： Takefumi Suzuki , Tatsuya Sugimoto , Masahiro Nakamura
IPC分类号： H01L21/308
CPC分类号： H01L21/31116
摘要： A plasma etching method includes plasma-etching a silicon oxide layer through a mask using a process gas, the process gas containing oxygen gas and a fluorohydrocarbon shown by the formula (1), CxHyFz, wherein x is an integer from 4 to 6, y is an integer from 1 to 4, and z is a positive integer, provided that (y+z) is 2x or less. A contact hole having a very small diameter and a high aspect ratio can be formed in a substantially vertical shape without necking by plasma-etching the silicon oxide layer using a single process gas.
摘要翻译：等离子体蚀刻方法包括使用工艺气体通过掩模等离子体蚀刻氧化硅层，含有氧气的工艺气体和由式（1）表示的氟代烃，C x H y F z，其中x是4至6的整数，y 是1〜4的整数，z为正整数，条件是（y + z）为2以下。具有非常小直径和高纵横比的接触孔可以通过使用单一工艺气体等离子体蚀刻氧化硅层而形成为基本垂直的形状而没有颈缩。

7. 发明授权

US09368363B2 Etching gas and etching method 有权
标题翻译：蚀刻气体和蚀刻方法
公开(公告)号：US09368363B2
公开(公告)日：2016-06-14
申请号：US14005483
申请日：2012-03-14
申请人： Takefumi Suzuki
发明人： Takefumi Suzuki
IPC分类号： H01L21/302 , H01L21/3065 , H01L21/311
CPC分类号： H01L21/3065 , H01L21/31116 , H01L21/31138
摘要： The present invention is a plasma etching gas comprising a fluorocarbon having 3 or 4 carbon atoms, the fluorocarbon including at least one unsaturated bond and/or ether linkage, and including a bromine atom, and a plasma etching method comprising subjecting a silicon oxide film on a substrate to plasma etching through a mask using a process gas, the process gas being the plasma etching gas. This plasma etching gas exhibits excellent etching selectivity, and has a short atmospheric lifetime and a low environmental impact. This plasma etching method makes it possible to selectively subject a silicon oxide film to plasma etching at a high etching rate without causing an increase in surface roughness.
摘要翻译：本发明是一种等离子体蚀刻气体，其包括碳原子数为3或4的碳氟化合物，所述碳氟化合物包括至少一个不饱和键和/或醚键，并且包括溴原子，以及等离子体蚀刻方法，包括使氧化硅膜用于使用处理气体等离子体蚀刻通过掩模的衬底，所述工艺气体是等离子体蚀刻气体。这种等离子体蚀刻气体表现出优异的蚀刻选择性，并且具有短的大气寿命和低的环境影响。这种等离子体蚀刻方法使得可以以高蚀刻速率选择性地使氧化硅膜进行等离子体蚀刻，而不会导致表面粗糙度的增加。

8. 发明申请

US20110068086A1 PLASMA ETCHING METHOD 审中-公开
标题翻译：等离子体蚀刻法
公开(公告)号：US20110068086A1
公开(公告)日：2011-03-24
申请号：US12736241
申请日：2009-03-27
申请人： Takefumi Suzuki , Azumi Ito
发明人： Takefumi Suzuki , Azumi Ito
IPC分类号： C03C25/68
CPC分类号： H01L21/31116
摘要： A plasma etching method includes etching an etching target under plasma conditions using a process gas, the process gas including a saturated fluorohydrocarbon shown by the formula (1): CxHyFz, wherein x is 3, 4, or 5, and y and z are individually positive integers, provided that y>z is satisfied. When etching a silicon nitride film that covers a silicon oxide film formed on the etching target, the silicon nitride film can be selectivity etched as compared with the silicon oxide film by utilizing the process gas including the specific fluorohydrocarbon under the plasma conditions.
摘要翻译：等离子体蚀刻方法包括使用处理气体在等离子体条件下蚀刻蚀刻靶，所述工艺气体包括由式（1）表示的饱和氟代烃：C x H y F z，其中x为3,4或5，y和z分别为正整数，条件是满足y> z。当蚀刻覆盖形成在蚀刻靶上的氧化硅膜的氮化硅膜时，与氧化硅膜相比，在等离子体条件下利用含有特定氟代烃的工艺气体，可以选择性地蚀刻氮化硅膜。

9. 发明申请

US20110060170A1 METHOD FOR PRODUCING HYDROGEN-CONTAINING FLUOROOLEFIN COMPOUND 有权
标题翻译：生产含氢氟烷化合物的方法
公开(公告)号：US20110060170A1
公开(公告)日：2011-03-10
申请号：US12990858
申请日：2009-07-13
申请人： Tatsuya Sugimoto , Takefumi Suzuki , Jo Konagawa
发明人： Tatsuya Sugimoto , Takefumi Suzuki , Jo Konagawa
IPC分类号： C07C17/23
CPC分类号： C07C17/23 , C07C23/06 , C07C23/08
摘要： An unsaturated hydrogen-containing fluoroolefin compound is obtained by bringing an unsaturated fluorine-containing halogen compound into contact with 0.1 to 3 molar equivalents of hydrogen relative to the unsaturated fluorine-containing halogen compound in a vapor phase in the presence of a supported palladium catalyst in which an amount of supported palladium is 0.1% by weight to 2.5% by weight.
摘要翻译：通过使不饱和含氟卤素化合物在负载的钯催化剂存在下，在气相中相对于不饱和含氟卤素化合物与0.1〜3摩尔当量的氢接触，得到不饱和含氢氟烯烃化合物其中负载钯的量为0.1重量％至2.5重量％。

10. 发明授权

US5578150A Heat treatment process for wire rods 失效
标题翻译：线材热处理工艺
公开(公告)号：US5578150A
公开(公告)日：1996-11-26
申请号：US466964
申请日：1995-06-06
申请人： Takefumi Suzuki , Shigekatsu Ozaki
发明人： Takefumi Suzuki , Shigekatsu Ozaki
IPC分类号： C21D9/52 , C21D1/46 , C21D1/607 , C21D1/667 , C21D9/573 , C21D9/58 , C21D9/64 , E21D1/00
CPC分类号： C21D9/58 , C21D9/5732 , C21D9/64 , C21D1/607 , C21D1/667
摘要： A conveyor moves forward an unconcentrically spiralled loose coil of steel wire rod having a temperature not lower than Ar.sub.3 into a retention bath of molten salt for heat treatment. Just before entering the retention bath, the coil is quenched by spraying a solution of molten salt kept at a temperature between 400.degree. and 600.degree. C. and not higher than the temperature of the retention bath either from above and below or from only above the coil. Then, the quenched coil is retained in the retention bath of molten salt kept at a temperature between 400.degree. and 600.degree. C., thereby causing pearlite transformation and forming a fine pearlite structure in the wire rod.
摘要翻译：传送带向前移动具有不低于Ar3的温度不低于Ar3的钢丝线的非集中螺旋松动线圈放入用于热处理的熔融盐的保留浴中。在进入保留浴之前，通过喷洒保持在400℃至600℃之间的温度的熔融盐溶液并且不高于保留浴的温度从上方和下方喷射或仅从高于线圈然后，将淬火的线圈保持在保持在400℃至600℃之间的熔融盐的保持浴中，从而在线材中引起珠光体相变并形成细珠光体组织。

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