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1. 发明专利

JP2004154928A Polishing state monitoring device, polishing device and polishing method 有权
公开(公告)号：JP2004154928A
公开(公告)日：2004-06-03
申请号：JP2003321639
申请日：2003-09-12
申请人： Ebara Corp , Shimadzu Corp , 株式会社島津製作所 , 株式会社荏原製作所
发明人： KOBAYASHI YOICHI , NAKAI SHUNSUKE , TSUJI HITOSHI , TSUKUDA YASURO , ISHIMOTO MASUYOSHI , SHINYA KAZUYA
IPC分类号： B24B49/12 , B24B37/013 , B24B49/04 , H01L21/304 , B24B37/04
CPC分类号： B24B49/12 , B24B37/013
摘要： PROBLEM TO BE SOLVED: To provide a polishing state monitoring device capable of measuring a state of a film on a polishing surface of a polishing object in the middle of polishing precisely and at low cost. SOLUTION: This polishing state monitoring device is furnished with a light source 30, a luminous optical fiber 32 to irradiate the polished surface of a semiconductor wafer W with light from the light source 30, a light receiving optical fiber 34 receiving reflected light from the polished surface of the wafer W, a spectrograph to make spectral diffraction of received reflected light to a plurality of wavelength, a light receiving element to accumulate the light of a plurality of the wavelength made spectral diffraction, a spectral data forming part to form a spectral data of the reflected light by reading electric information accumulated in the light receiving element, a control part 40 to carry out sampling by the light receiving element at specified timing synchronized with rotation of a polishing table 12 and a computing part 48 to compute a specified characteristic value on the polishing surface of the wafer W in accordance with the spectral data formed by the spectral data forming part. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004085276A Film-thickness measuring method and film-thickness measuring apparatus 有权
公开(公告)号：JP2004085276A
公开(公告)日：2004-03-18
申请号：JP2002244234
申请日：2002-08-23
申请人： Shimadzu Corp , 株式会社島津製作所
发明人： SHINYA KAZUYA , NISHIMURA TAKASHI
IPC分类号： H01L21/66 , G01B11/06
CPC分类号： G01B11/0675
摘要： PROBLEM TO BE SOLVED: To provide a film-thickness measuring method which uses spectrometry and can be used for a double film, constituted of a plurality of layers having different refractive indexes.
SOLUTION: On the basis of a special feature of waveform of interference spectrum, a measurement spectrum waveform can be expressed approximately, by using a linear combination of a plurality of base spectra. By using base spectra, wherein the period is fixed previously as a variable, approximate spectrum wherein square spread to measurement spectrum becomes a minimum is found for each period, and the relation between the minimum square spread and periods is obtained as a graph. Correspondence between the respective layers of the double film and extremum dots of a minimum square spread which appear plurally in the case of a double film is obtained. The film thickness is calculated from the period, which gives extremum dots to each layer and the refractive index of the layer.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2009233853A Polishing apparatus and polishing method 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2009233853A
公开(公告)日：2009-10-15
申请号：JP2009172232
申请日：2009-07-23
申请人： Ebara Corp , Shimadzu Corp , 株式会社島津製作所 , 株式会社荏原製作所
发明人： KOBAYASHI YOICHI , NAKAI SHUNSUKE , TSUJI HITOSHI , TSUKUDA YASURO , ISHIMOTO MASUYOSHI , SHINYA KAZUYA
IPC分类号： B24B49/12 , B24B37/013 , B24B49/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing method capable of accurately and inexpensively measuring the state of a film on a surface being polished of an object of polishing, and of determining the timing of a polishing end point. SOLUTION: The polishing method for polishing the film formed on the surface being polished of a semiconductor wafer W applies pulsed light from a pulsed light source 30 to the surface, being polished, at a predetermined timing based on a trigger signal while moving the surface, being polished, relative to a polishing table 12, receives reflected light from the surface being polished, divides the received reflected light into a plurality of light rays having respective wavelengths, generates spectral data of the reflected light from the plurality of light rays having respective wavelengths, and monitors the progress of polishing of the surface, being polished, using characteristic values calculated based on the spectral data. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够精确且廉价地测量抛光对象的被抛光表面上的膜的状态以及确定抛光终点的定时的抛光方法。解决方案：用于研磨在半导体晶片W被研磨的表面上形成的膜的抛光方法，在移动时，基于触发信号，以预定的定时将来自脉冲光源30的脉冲光施加到表面，进行抛光抛光表面相对于抛光台12接收来自被抛光表面的反射光，将接收到的反射光分成具有各波长的多个光线，从多个光线产生反射光的光谱数据具有各自的波长，并且使用基于光谱数据计算的特征值来监视被抛光的表面的抛光进度。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2005003400A Film thickness measuring method and film thickness measuring device 审中-公开
标题翻译：薄膜厚度测量方法和薄膜厚度测量装置
公开(公告)号：JP2005003400A
公开(公告)日：2005-01-06
申请号：JP2003164491
申请日：2003-06-10
申请人： Shimadzu Corp , 株式会社島津製作所
发明人： SHINYA KAZUYA
IPC分类号： G01B11/06
摘要： PROBLEM TO BE SOLVED: To measure highly accurately the film thickness relative to a sample having the thin film thickness which is impossible to be measured by a conventional method. SOLUTION: In order to theoretically approximate a waveform shape of a general spectrum of an interference wave, an approximate expression f(x) in consideration of the phase shift, drift or offset of a cosine function is formed, and a fundamental expression showing the relation with quadratic differential f"(x) of the approximate expression is stored in a storage part 7. When spectrum data are acquired by measurement, a quadratic differential calculation part 61 calculates a quadratic differential value of each data, and a coefficient calculation part 62 calculates coefficients included in the approximate expression by a statistical technique by applying each wave number, measurement data and the differential values to the fundamental expression. A film thickness calculation part 63 calculates the film thickness d from a period T which is one of the coefficients. Hereby, the film thickness can be determined even if the interference wave included in the spectrum is shorter than one period. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：相对于通过常规方法不可能测量的具有薄膜厚度的样品，可以高精度地测量膜厚度。解决方案：为了理论上近似干扰波的一般光谱的波形形状，考虑到余弦函数的相移，漂移或偏移，形成近似表达式f（x），并且形成基本表达式表示与近似表达式的二次微分f“（x）的关系存储在存储部分7中。当通过测量获取频谱数据时，二次微分计算部分61计算每个数据的二次微分值，并且系数计算部分62通过将每个波数，测量数据和差分值应用于基本表达式，通过统计技术来计算包括在近似表达式中的系数。膜厚度计算部63从作为其中之一的周期T计算膜厚度d 因此，即使光谱中包括的干涉波短于一个pe，也可以确定膜厚度荒漠化问题。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2009246388A Polishing state monitoring apparatus, polishing apparatus, and method of polishing 有权
标题翻译：抛光状态监测装置，抛光装置和抛光方法
公开(公告)号：JP2009246388A
公开(公告)日：2009-10-22
申请号：JP2009172231
申请日：2009-07-23
申请人： Ebara Corp , Shimadzu Corp , 株式会社島津製作所 , 株式会社荏原製作所
发明人： KOBAYASHI YOICHI , NAKAI SHUNSUKE , TSUJI HITOSHI , TSUKUDA YASURO , ISHIMOTO MASUYOSHI , SHINYA KAZUYA
IPC分类号： H01L21/304 , B24B37/013 , B24B49/04 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide a polishing state monitoring apparatus precisely and inexpensively measuring the state of a film adhering to the surface of an object under polishing. SOLUTION: The polishing state monitoring apparatus is provided with: a light source 30; a light emitting optical fiber 32 for irradiating the surface being polished of a semiconductor wafer W with a light from the light source 30; a light receiving optical fiber 34 for receiving the light reflected from the surface being polished of the wafer W; a spectroscope for dividing the received reflected light into a plurality of wavelengths; a light receiving device for accumulating information of the lights of the plurality of the divided wavelengths in a form of electrical information; a spectral data generating section for generating spectral data of the reflected light by reading the electrical information accumulated in the light receiving device; and a calculating section 48 for calculating predetermined characteristic values of the surface under polishing of the semiconductor wafer by calculation including multiplication that multiplies wavelength components of the spectral data generated by the spectral data generating section by respectively predetermined weighting factors. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光状态监测装置，其精确且廉价地测量附着在被研磨物体表面的膜的状态。解决方案：抛光状态监测装置设置有：光源30; 用于利用来自光源30的光照射半导体晶片W被研磨的表面的发光光纤32; 用于接收从晶片W抛光的表面反射的光的光接收光纤34; 用于将接收到的反射光分成多个波长的分光镜; 光接收装置，用于以电信息的形式累积多个划分的波长的光的信息; 光谱数据产生部分，用于通过读取在光接收装置中累积的电信息来产生反射光的光谱数据; 以及计算部分48，用于通过计算来计算在半导体晶片的研磨下的表面的预定特征值，该乘积包括乘以由频谱数据产生部分生成的频谱数据的波长成分乘以预定的加权因子。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2003344024A Method and apparatus for measuring thickness of film 有权
标题翻译：测量薄膜厚度的方法和装置
公开(公告)号：JP2003344024A
公开(公告)日：2003-12-03
申请号：JP2002147107
申请日：2002-05-22
申请人： Shimadzu Corp , 株式会社島津製作所
发明人： SHINYA KAZUYA
IPC分类号： G01B11/06
CPC分类号： G01B11/0625
摘要： PROBLEM TO BE SOLVED: To improve the accuracy of measuring thickness of a film by using a spectrometer. SOLUTION: A measured spectrum waveform can be approximately represented by a linear sum of multiple basic spectra depending on a waveform feature of an interference spectrum. Therefore, such an approximate spectrum which gives a minimum square error relative to the measured spectrum is found for each thickness of the film, by using basic spectra previously determined in which the thickness of the film is set as a variable, and a relation between the least square error and the thickness of the film is represented as a graph. The thickness of the film which gives the minimum point in the graph of the least square error, is regarded as the thickness of a sample film. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过使用光谱仪来提高测量膜厚度的精度。解决方案：根据干涉光谱的波形特征，测量的光谱波形可以近似由多个基本光谱的线性和表示。因此，通过使用先前确定的将膜的厚度设置为可变的基本光谱，以及关于膜的厚度之间的关系，可以找出相对于测量光谱给出最小平方误差的近似光谱，最小二乘误差和薄膜的厚度表示为图形。给出最小二乘误差图中最小点的膜的厚度被认为是样品膜的厚度。版权所有（C）2004，JPO

7. 发明专利

JP2005003401A Film thickness measuring method and film thickness measuring device 有权
标题翻译：薄膜厚度测量方法和薄膜厚度测量装置
公开(公告)号：JP2005003401A
公开(公告)日：2005-01-06
申请号：JP2003164492
申请日：2003-06-10
申请人： Shimadzu Corp , 株式会社島津製作所
发明人： SHINYA KAZUYA , TSUJI SHIRO
IPC分类号： G01B11/06
摘要： PROBLEM TO BE SOLVED: To enable measurement of the thin film thickness which is difficult hitherto to be measured. SOLUTION: A measuring spectrum waveform can be expressed approximatively by the linear sum of a plurality of base spectrums by a characteristic of the waveform shape of an interference spectrum. Hereby, the base spectrum wherein the film thickness is determined beforehand as a variable is used, and an approximate spectrum wherein the square error to the measuring spectrum becomes the least is found relative to each film thickness, and the relation between the least square error and the film thickness is determined as a graph (S1-S6). When the film thickness is thin, a minimal point does not appear clearly on the error curve. In this case, a graph determined by turning over the error curve to the negative direction is taken into consideration, and the error at the film thickness zero point undetermined by calculation is determined by interpolation processing (S7, S8), and positive and negative peak separation processing of the error curve is performed (S9). Then, the film thickness showing the minimal point with a peak in the positive range is adopted as the thickness of the sample film (S10). COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了能够测量难以测量的薄膜厚度。解决方案：通过干涉光谱的波形形状的特性，可以通过多个基本光谱的线性和近似表示测量光谱波形。因此，使用预先确定膜厚度作为变量的基础光谱，并且相对于每个膜厚度发现其中测量光谱的平方误差变得最小的近似光谱，以及最小二乘误差与膜厚确定为曲线图（S1-S6）。当膜厚度薄时，误差曲线上的最小点不会清楚地显示出来。在这种情况下，考虑通过将误差曲线转换为负方向而确定的曲线图，并且通过计算确定的膜厚度零点处的误差由插值处理（S7，S8）确定，并且正和负峰值执行误差曲线的分离处理（S9）。然后，作为样品膜的厚度，采用表示具有正值范围的峰的最小点的膜厚（S10）。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2003052394A Method for analyzing enzymatic reaction and device for analyzing enzymatic reaction 审中-公开
标题翻译：分析酶促反应的方法和分析酶促反应的装置
公开(公告)号：JP2003052394A
公开(公告)日：2003-02-25
申请号：JP2001241534
申请日：2001-08-09
申请人： Shimadzu Corp , 株式会社島津製作所
发明人： SHINYA KAZUYA
IPC分类号： G01N21/75 , C12M1/34 , C12Q1/25 , G01N21/27
摘要： PROBLEM TO BE SOLVED: To accurately calculate the maximum reaction speed Vmax and a Michaelis constant Km.
SOLUTION: This method for analyzing an enzymatic reaction contains a step for calculating such a Km as satisfying the following equation: Σ(vi/ si)[1/(1+Km/si)]/{Σ(1/si)[1/(1+Km/si)
2 ]-Σ(vi/si
2 )[1/(1+Km/si)
2 ]/{Σ(1/si
2 )[1/(1+ Km/si)
3 ]=0, and a step for applying the Km to the following equation: Vmax=Σ(vi/si)[1/(1+Km/si]/{Σ(1/si)[1/(1+Km/si)
2 ] to calculate the Vmax, when a substrate concentration si as a measurement result for the change of an absorbance at a constant wavelength in a sample solution having an enzymatic activity and the reaction speed vi[(i)=1 to (n)] of the enzymatic reaction are given.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：准确计算最大反应速度Vmax和米氏常数Km。解决方案：用于分析酶反应的方法包括计算满足以下等式的这样的Km的步骤：Σ（vi / si）[1 /（1 + Km / si）] /Σ（1 / si）[1 / （1 + Km / si）2]-Σ（vi / si 2）[1 /（1 + Km / si）2] /Σ（1 / si 2） + Km / si）3] = 0，并且将Km应用于以下等式：Vmax =Σ（vi / si）[1 /（1 + Km / si）/Σ（1 / si） 1 /（1 + Km / si）2]计算Vmax，当作为测定结果的底物浓度si作为在具有酶活性的样品溶液中的恒定波长的吸光度的变化和反应速度vi 给出[（i）= 1〜（n）]的酶反应。

9. 发明专利

JP2508069B2 失效
公开(公告)号：JP2508069B2
公开(公告)日：1996-06-19
申请号：JP7927887
申请日：1987-03-30
申请人： SHIMADZU CORP
发明人： SHINYA KAZUYA
IPC分类号： G01N21/17 , G01N21/59 , G01N27/26 , G01N27/447 , G01N30/95

10. 发明专利

JPH06292003A PICTURE READER 失效
公开(公告)号：JPH06292003A
公开(公告)日：1994-10-18
申请号：JP9864893
申请日：1993-03-31
申请人： SHIMADZU CORP
发明人： SHINYA KAZUYA
IPC分类号： H04N1/409 , G06T3/00 , G06T5/20 , H04N1/40 , G06F15/66 , G06F15/68
摘要： PURPOSE:To eliminate locality without separate read scanning by applying discrete Fourier transformation to picture data so as to extract a locality equivalent component and using data obtained by applying inverse discrete Fourier transformation to the component thereby eliminating the locality. CONSTITUTION:A conversion means 10 applies discrete Fourier transformation to read picture data. The data corresponding to a frequency of the locality and frequencies at an integer multiple of the frequency among the converted data have an eminent value in comparison with the data in the vicinity of the former data because of the periodicity of the locality. An extract means 12 extracts the eminent portion as a portion equivalent to the locality. The inverse conversion means 14 applies inverse discrete Fourier transformation to the extracted portion equivalent to the locality. Then an eliminating means 16 uses the portion equivalent to the locality after the inverse conversion to eliminate the locality from the picture data.

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