会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • HIGH-DENSITY COMPUTER SYSTEM
    • 高密度计算机系统
    • US20110292589A1
    • 2011-12-01
    • US13118062
    • 2011-05-27
    • Chih-Wei YANGShin-JAU LIShih-Hua HUANG
    • Chih-Wei YANGShin-JAU LIShih-Hua HUANG
    • G06F1/16
    • G06F1/183H05K7/1487H05K7/1488
    • A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a sub-backplane having a sub-control circuit and a plurality of second sub-backplane slots, and an end of the sub-backplane has a first sub-backplane slot corresponding to the main backplane slot, and the first sub-backplane slot and the sub-control circuit and the second sub-backplane slots being electrically coupled; a plurality of CPU cards installed on the expansion card module, each being inserted to the second sub-backplane slot, and the CPU card having a CPU, such that the computer system can have a powerful modular assembling function to enhance the economic benefits and product competitiveness.
    • 高密度计算机系统包括:分别安装并形成在主背板上的具有主背板的主机箱和主控制电路以及多个主背板槽; 至少一个插入并安装在所述机箱中的扩展卡模块,并且所述扩展卡模块包括具有子控制电路和多个第二子背板时隙的子背板,并且所述子背板的一端具有第一 子背板槽对应于主背板槽,并且第一子背板槽和子控制电路以及第二子背板槽电耦合; 安装在扩展卡模块上的多个CPU卡,每个插入到第二子背板插槽,并且CPU卡具有CPU,使得计算机系统可以具有强大的模块化组装功能,以增强经济效益和产品 竞争力。