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1. 发明授权

US5730832A Ultrasonic vibration bonding machine 失效
标题翻译：超声波振动粘合机
公开(公告)号：US5730832A
公开(公告)日：1998-03-24
申请号：US699863
申请日：1996-08-20
申请人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
发明人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
IPC分类号： B23K31/00 , B06B3/04 , B23K20/10 , B23K37/00 , B29C65/08 , B32B31/20
CPC分类号： B23K20/10 , B29C65/08 , B29C65/18 , B29C65/30 , B29C65/72 , B29C66/472 , B29C66/816 , B29C66/8242 , B29C66/8322 , B29C66/9516 , B29C65/081 , B29C65/24 , B29C66/1122 , B29C66/41 , B29C66/81433 , B29C66/8167 , B29C66/9512 , B29C66/9513
摘要： To stabilize bonding strength by concentrating bonding energy upon members to be bonded together, when an overlapped interface of a plurality of members to be bonded together is to be bonded by ultrasonic vibration, heaters 6 and 7 are caused to generate heat to heat the bonding working portion 3d of a resonator 2, whereby bonding energy generated by ultrasonic vibration and bonding energy generated by heating are provided to the interface so that bonding energy can be concentrated upon the interface without increasing the energy of ultrasonic vibration and bonding strength can be stabilized. Further, when electric heaters are used as the heaters 6 and 7, operationability is improved. Moreover, when heater holes 3e and 3f are formed in the resonator 2 and electric heaters are fitted into the holes 3e and 3f, heater installation work is facilitated. The heater may be provided in the mount.
摘要翻译：为了通过将结合能量集中在要接合的构件上来稳定接合强度，当要通过超声波振动将要接合的多个构件的重叠界面进行接合时，加热器6和7产生热量以加热接合作业谐振器2的3d部分，由此通过超声波振动产生的结合能量和通过加热产生的结合能量被提供到界面，使得能够将接合能量集中在界面上而不增加超声波振动的能量，并且可以稳定结合强度。此外，当使用电加热器作为加热器6和7时，可操作性得到改善。此外，当在谐振器2中形成加热孔3e和3f并且将电加热器装配到孔3e和3f中时，加热器安装工作变得容易。加热器可以设置在安装座中。

2. 发明授权

US5884831A Ultrasonic vibration bonding chip mounter 失效
标题翻译：超声波振动贴片贴片机
公开(公告)号：US5884831A
公开(公告)日：1999-03-23
申请号：US845372
申请日：1997-04-24
申请人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
发明人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
IPC分类号： H01L21/52 , B23K20/10 , H01L21/60 , H01L21/607 , H05K13/04 , B23K31/02 , B23K37/04
CPC分类号： B23K20/10 , H01L24/75 , H05K13/0413 , H05K13/046
摘要： An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.
摘要翻译：一种超声波振动接合片贴装机，具有配置在芯片供给单元，预对准单元和安装单元之上的芯片承载单元，其配置成一排，并具有可移动工作台，该活动工作台可以在平行于这些单元被布置，附接到可移动台的拾取单元，用于将芯片从芯片供应单元传送到预对准单元;以及超声波振动接合单元，附接到可移动台，用于将芯片从预对准单元到安装单元，使得芯片通过可移动台的往复运动逐个地从芯片供应单元传送到预对准单元并进一步传送到安装单元。

3. 发明授权

US5931367A Removable bonding working portions for an ultrasonic welder 失效
标题翻译：用于超声波焊接机的可拆卸接合工作部分
公开(公告)号：US5931367A
公开(公告)日：1999-08-03
申请号：US856583
申请日：1997-05-15
申请人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
发明人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
IPC分类号： B06B1/02 , B23K20/10 , B29C65/00 , B29C65/08 , B23K1/006 , B32B31/000
CPC分类号： B29C65/08 , B23K20/106 , B29C65/081 , B29C66/80 , B29C66/81433 , B29C66/8167
摘要： A resonator for an ultrasonic bonding apparatus, which comprises an ultrasonic horn having a recessed portion in the exterior surface and a threaded hole, a bonding working portion having a chip base fitted in the recessed portion and a chip body provided on the chip base, and a screw member having a screw portion to fit into the threaded hole and a through-hole through which the chip body is put without contact with said screw member so that the screw member is screwed into the threaded hole, the bonding portion is fixed to the ultrasonic horn, with the chip body projecting through the through-hole for contact with a workpiece.
摘要翻译：一种超声波接合装置用谐振器，其特征在于，包括：在所述外表面具有凹部的超声波喇叭和螺纹孔;嵌合在所述凹部中的芯片基部的接合工作部以及设置在所述芯片基板上的芯片本体; 螺纹部件，其具有螺纹部分以配合到螺纹孔中;以及通孔，芯体与所述螺纹部件接触而不与所述螺纹部件接触，从而将螺纹部件拧入螺纹孔中，超声波喇叭，芯片体通过通孔突出，与工件接触。

4. 发明授权

US06491785B1 Ultrasonic vibration bonding machine 失效
标题翻译：超声波振动粘合机
公开(公告)号：US06491785B1
公开(公告)日：2002-12-10
申请号：US09597567
申请日：2000-06-20
申请人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
发明人： Shigeru Sato , Mitsugu Katsumi , Seiya Nakai
IPC分类号： B23K2100
CPC分类号： B23K20/106 , B23K20/10 , B29C65/08 , B29C66/8242 , B29C66/8322 , B29C66/9221 , B29C66/92445 , B29C66/92921 , B29C66/9512 , B29C66/9516 , H01L24/75 , H01L24/81
摘要： An ultrasonic vibration bonding machine which enables appropriate bonding by selecting a pressure curve according to the sizes of portions to be bonded together and the physical properties of their materials and the like. Pressure inside the pressure chamber of an air cylinder which is a pressure control unit for bonding work and the normal rotation and reverse rotation of a motor which constitutes part of a vertical drive unit for bonding work are controlled to bond together a first member and a second member with ultrasonic vibration under pressure which rises from a first pressure set value to a second pressure value from a vibration start time.
摘要翻译：一种超声波振动接合机，其通过根据要结合的部分的尺寸和其材料的物理性质选择压力曲线来进行适当的接合。作为用于接合作业的压力控制单元的气缸的压力室内的压力和构成用于接合作业的垂直驱动单元的一部分的电动机的正常的旋转和反向旋转被控制以将第一构件和第二构件在压力下超声波振动的构件从振动开始时间从第一压力设定值上升到第二压力值。

5. 发明授权

US5883460A Support unit for ultrasonic vibration resonator 失效
标题翻译：超声波振动谐振器支撑单元
公开(公告)号：US5883460A
公开(公告)日：1999-03-16
申请号：US879321
申请日：1997-06-19
申请人： Shigeru Sato , Ryoichi Ishii , Seiya Nakai
发明人： Shigeru Sato , Ryoichi Ishii , Seiya Nakai
IPC分类号： B23K20/10 , B06B1/02 , B06B3/00 , H01L41/053
CPC分类号： B06B3/00
摘要： First and second boosters are attached to a holder in the following manner to prevent a portion between the first and second boosters from being curved. The outer side surface of a projecting portion on the outer peripheral surface of a second booster is pressed toward the inward of the holder by a stopper attached to the holder so that a stepped portion formed in the interior surface of the holder is pressed by the projecting portion through a bridge member and a projecting portion on the outer peripheral surface of the first booster.
摘要翻译：第一和第二增压器以下列方式附接到保持器，以防止第一和第二助力器之间的部分弯曲。第二助力器的外周面上的突出部分的外侧表面通过安装在保持器上的止动件朝向保持器的内侧挤压，使得形成在保持器的内表面中的阶梯部分被突出部分通过桥构件和在第一助力器的外周表面上的突出部分。

6. 发明授权

US06818098B2 Ultrasonic bonding machine 失效
标题翻译：超声波焊接机
公开(公告)号：US06818098B2
公开(公告)日：2004-11-16
申请号：US10676150
申请日：2003-10-02
申请人： Shigeru Sato , Seiya Nakai
发明人： Shigeru Sato , Seiya Nakai
IPC分类号： B29C6508
CPC分类号： B06B3/00 , B23K20/10
摘要： After the fixing of an angle indexing body to a holder by fixtures is canceled by loosening the fixtures, a resonator is turned by operating the angle indexing body with an axis in a vibration transmission direction as the center of rotation, a bonding work face is replaced by another bonding work face, and the angle indexing body is fixed to the holder by the fixtures so that the new bonding work face becomes parallel to the top face of a mounting table. Therefore, the replacement of the bonding work face can be simplified. Since overlapped workpieces are sandwiched between the bonding work face of the resonator and the mounting table, the mounting table makes a follow-up movement by a bearing composed of a spherical projection portion and a spherical depression portion to ensure that the bonding work face becomes parallel to the top face of the mounting table, thereby making it possible to optimize the position of the sandwiched workpieces.
摘要翻译：在通过松开固定装置将角度分度体固定到支架上之后，通过使振动传播方向上的轴作为旋转中心，通过使角度分度体运动来转动谐振器，从而更换接合作业面通过另一接合作业面，并且通过固定装置将角度分度体固定到保持器，使得新的粘合工作面变得平行于安装台的顶面。因此，可以简化接合作业面的更换。由于重叠的工件夹在谐振器的接合工作面和安装台之间，所以安装台通过由球形突起部和球形凹部构成的轴承进行后续运动，以确保接合作业面平行到达安装台的顶面，从而可以优化夹层工件的位置。

7. 发明授权

US06247628B1 Ultrasonic vibration bonding tool 有权
标题翻译：超声波振动焊接工具
公开(公告)号：US06247628B1
公开(公告)日：2001-06-19
申请号：US09630410
申请日：2000-08-01
申请人： Shigeru Sato , Seiya Nakai
发明人： Shigeru Sato , Seiya Nakai
IPC分类号： B23K3700
CPC分类号： B23K20/106
摘要： An ultrasonic vibration bonding tool comprising a square bar-like horn body, bonding working portions projecting from the upper and lower surfaces of the horn body at the central maximum vibration amplitude point, and crooked support portions projecting from front and rear surfaces of the horn body at the two minimum vibration amplitude points which are separate the same distance from the bonding working portions on both sides. Proper bonding can be carried out with this ultrasonic vibration bonding tool.
摘要翻译：一种超声波振动接合工具，包括方形棒状喇叭体，在中心最大振动振幅点从喇叭体的上下表面突出的接合作业部，以及从喇叭体的前后表面突出的弯曲的支承部在与两侧的接合工作部分分开相同距离的两个最小振动振幅点处。可以用这种超声波振动焊接工具进行适当的接合。

8. 发明授权

US06168063A Ultrasonic vibration bonding machine 失效
标题翻译：超声波振动粘合机
公开(公告)号：US06168063A
公开(公告)日：2001-01-02
申请号：US09461112
申请日：1999-12-14
申请人： Shigeru Sato , Seiya Nakai
发明人： Shigeru Sato , Seiya Nakai
IPC分类号： B23K106
CPC分类号： H01L21/67138 , B23K20/10 , B23K2101/40 , H01L2224/75
摘要： An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.
摘要翻译：一种能够简化吸入通道结构的超声波振动接合机。一种谐振器具有在设置接合工作部分的最大振动振幅点处的吸入通道，安装在安装单元上的电路板的焊盘的位置和位置测量吸收并吸附到接合工作部分的半导体芯片的焊盘，以便准确地对准焊盘，然后将焊盘接合在一起。

9. 发明授权

US5884833A Ultrasonic vibration soldering apparatus and resonator used therein 失效
标题翻译：超声波振动焊接装置及谐振器
公开(公告)号：US5884833A
公开(公告)日：1999-03-23
申请号：US839318
申请日：1997-04-17
申请人： Shigeru Sato , Mitsugu Katsumi , Ryoichi Ishii
发明人： Shigeru Sato , Mitsugu Katsumi , Ryoichi Ishii
IPC分类号： B23K1/08 , B06B1/02 , B23K3/06 , B23K3/00
CPC分类号： B23K3/0653
摘要： A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.
摘要翻译：在喇叭主体上，在节点f2处设置用于将喇叭主体连接到焊料槽的支撑部分，并且来自外部换能器的超声波振动通过喇叭主体传递到焊料槽中的焊料。

10. 发明授权

US08201722B2 Resonator for joining metal members together utilizing ultrasonic vibration 有权
标题翻译：用于使用超声波振动将金属构件连接在一起的谐振器
公开(公告)号：US08201722B2
公开(公告)日：2012-06-19
申请号：US12793251
申请日：2010-06-03
申请人： Shigeru Sato , Mayumi Kouya , Mitsugu Katsumi , Ryoichi Ishii , Takahiro Ito
发明人： Shigeru Sato , Mayumi Kouya , Mitsugu Katsumi , Ryoichi Ishii , Takahiro Ito
IPC分类号： B23K1/06 , B29C65/08 , B32B37/00
CPC分类号： B23K20/106 , H01L2224/75
摘要： A resonator for joining metal members utilizing ultrasonic vibration includes an ultrasonic horn having a length of at least half wavelength of a resonance frequency of ultrasonic vibration transmitted from a vibrator, and a joining tool provided on the ultrasonic horn so as to project in a direction normal to a vibration transmission direction of the ultrasonic horn at a position of a point of a maximum vibration amplitude of the ultrasonic horn. The joining tool is formed into a linear bar made of a material excellent in acoustic property and is provided on a distal end thereof with a tool head projecting laterally.
摘要翻译：用于使用超声波振动连接金属构件的谐振器包括：超声波喇叭，其具有从振动器传递的超声波振动的共振频率的至少半波长的长度，以及设置在超声波喇叭上的接合工具，以沿正常方向涉及超声波喇叭的最大振动振幅点的位置处的超声波喇叭的振动传播方向。连接工具形成为由声学特性优异的材料制成的直线杆，并且在其远端设置有横向突出的工具头。

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