专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4775783A Transaction system 失效
标题翻译：交易系统
公开(公告)号：US4775783A
公开(公告)日：1988-10-04
申请号：US890609
申请日：1986-07-30
申请人： Shigeru Sasaki , Masataka Kawauchi , Yasunori Hamada , Masao Okayama , Yoshiharu Takahashi
发明人： Shigeru Sasaki , Masataka Kawauchi , Yasunori Hamada , Masao Okayama , Yoshiharu Takahashi
IPC分类号： G07D3/00 , G07D11/00 , G06F15/30
CPC分类号： G07D11/0054 , G07D11/0057 , G07D11/0072
摘要： A transaction system comprises a plurality of transaction machines capable of accepting deposits and paying out bills and a bill supplying/retrieving device which operates in conjunction with the transaction machines for supplying and retrieving bills to and from the transaction machines wherein the bill supplying/retrieving device is movable by a driving device.
摘要翻译：交易系统包括能够接收存款和支付账单的多个交易机器以及与交易机器一起操作的票据提供/取回装置，用于向交易机器提供和从交易机器取回票据，其中票据提供/取回装置可通过驱动装置移动。

2. 发明申请

US20160378028A1 SEPARATOR, FIXING DEVICE, AND IMAGE FORMING APPARATUS 有权
标题翻译：分离器，固定装置和图像形成装置
公开(公告)号：US20160378028A1
公开(公告)日：2016-12-29
申请号：US15158391
申请日：2016-05-18
申请人： Hitoshi Fujiwara , Tomoya Adachi , Tomohiko Fujii , Masahiro Samei , Yutaka Naitoh , Yoshiharu Takahashi , Yasuharu Kawarasaki , Kenta Kashiwagi , Kohta Sakaya
发明人： Hitoshi Fujiwara , Tomoya Adachi , Tomohiko Fujii , Masahiro Samei , Yutaka Naitoh , Yoshiharu Takahashi , Yasuharu Kawarasaki , Kenta Kashiwagi , Kohta Sakaya
IPC分类号： G03G15/20
CPC分类号： G03G15/2028
摘要： A separator for separating a recording medium from a fixing rotator includes a separation body including a front end and a conveyance path side face. The front end is disposed in proximity to an outer circumferential surface of the fixing rotator. The conveyance path side face faces a conveyance path where the recording medium is conveyed. At least one rotary separation aid projects beyond the conveyance path side face of the separation body toward the conveyance path. The rotary separation aid is rotated by the recording medium as the recording medium comes into contact with the rotary separation aid.
摘要翻译：用于从定影旋转器分离记录介质的分离器包括：分离体，其包括前端和输送路侧面。前端设置在固定旋转体的外周面附近。输送路侧面面向输送记录介质的输送路径。至少一个旋转分离助剂超过分离体的输送路侧面朝向输送路径突出。当记录介质与旋转分离助剂接触时，旋转分离助剂由记录介质旋转。

3. 发明授权

US08874021B2 Media guide mechanism, fixing device and image forming apparatus incorporating same 有权
标题翻译：介质引导机构，固定装置和结合其的图像形成装置
公开(公告)号：US08874021B2
公开(公告)日：2014-10-28
申请号：US13535931
申请日：2012-06-28
申请人： Kohta Sakaya , Yasuhide Ohkubo , Tamotsu Ikeda , Yoshiharu Takahashi , Chikara Hiraoka , Toshio Ogiso
发明人： Kohta Sakaya , Yasuhide Ohkubo , Tamotsu Ikeda , Yoshiharu Takahashi , Chikara Hiraoka , Toshio Ogiso
IPC分类号： G03G15/20 , B65H5/36 , B65H5/06
CPC分类号： G03G15/2028 , B65H5/062 , B65H5/36 , B65H2402/24 , B65H2511/212 , B65H2515/81 , B65H2220/01 , B65H2220/08 , B65H2220/11
摘要： A mechanism for guiding a recording medium into a nip formed between a first rotary member subjected to heating, and a second rotary member pressed against the first rotary member includes a guide member and a biasing member. The guide member is disposed upstream from the nip to guide the recording medium therealong. The biasing member is connected to the guide member to mechanically bias the guide member. The guide member is subjected to a constant biasing force from the biasing member and to a pressure force from the recording medium. The pressure force is opposite the biasing force and variable with a stiffness of the recording medium being guided. The guide member is movable to different operational positions depending on the biasing and pressure forces acting thereon.
摘要翻译：用于将记录介质引导到形成在经受加热的第一旋转构件之间的辊隙中的机构和被压靠在第一旋转构件上的第二旋转构件包括引导构件和施力构件。引导构件设置在辊隙的上游，以在其上引导记录介质。偏置构件连接到引导构件以机械地偏置引导构件。引导构件受到来自偏压构件的恒定的偏压力和来自记录介质的压力。压力与偏压力相反，并且随着记录介质的刚度被引导而变化。引导构件可以根据作用在其上的偏压和压力而移动到不同的操作位置。

4. 发明申请

US20130004214A1 GUIDE DEVICE WITH MECHANISM CAPABLE OF MINIMIZING DAMAGE TO TONER IMAGE AND RECORDING MEDIUM AND FIXING DEVICE AND IMAGE FORMING APPARATUS INCORPORATING SAME 有权
标题翻译：具有能够最小化对图像和记录介质的损坏的机构的指导装置和固定装置以及映射装置的图像形成装置
公开(公告)号：US20130004214A1
公开(公告)日：2013-01-03
申请号：US13525971
申请日：2012-06-18
申请人： Kohta SAKAYA , Yoshiharu Takahashi , Tamotsu Ikeda , Chikara Hiraoka
发明人： Kohta SAKAYA , Yoshiharu Takahashi , Tamotsu Ikeda , Chikara Hiraoka
IPC分类号： G03G15/20
CPC分类号： G03G15/2028 , G03G2215/0132
摘要： A guide device includes a fixing exit guide, a first rotary body, a second rotary body disposed downstream from the first rotary body in a recording medium conveyance direction and partially protruding from a guide face through a slot of the fixing exit guide to contact and support an image side of a recording medium conveyed over the second rotary body, and at least one guide rib mounted on the guide face of the fixing exit guide and extending substantially in the recording medium conveyance direction. The guide rib includes a contact face contacting the image side of the recording medium and a downstream end disposed downstream from the contact face in the recording medium conveyance direction to overlap the second rotary body in cross-section taken along a direction orthogonal to an axial direction of the second rotary body.
摘要翻译：引导装置包括固定出口引导件，第一旋转体，第二旋转体，其在记录介质输送方向上设置在第一旋转体的下游，并且通过定影出口引导件的狭槽从引导面部分地突出以接触和支撑在第二旋转体上传送的记录介质的图像侧，以及安装在固定出口引导件的引导面上且基本上沿着记录介质输送方向延伸的至少一个引导肋。引导肋包括与记录介质的图像侧接触的接触面和设置在记录介质传送方向上的接触面的下游的下游端，以与第二旋转体沿与轴向正交的方向截取的横截面重叠的第二旋转体。

5. 发明授权

US06790711B2 Method of making semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US06790711B2
公开(公告)日：2004-09-14
申请号：US10663940
申请日：2003-09-17
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： H01L2144
CPC分类号： H01L23/4334 , H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H05K3/3426 , H05K3/3436 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device using a lead frame composed of a plate-like body having a non-planar upper surface and a planar under surface. The plate-like body includes a first thin portion for mounting a semiconductor chip with pad electrodes, first thick portions radially arranged for forming lead electrodes respectively corresponding to the pad electrodes of the semiconductor chip, a second thin portion between pairs of the first thick portions, a third thin portion peripherally surrounding the first thick portions, and a second thick portion surrounding the third thin portion. The semiconductor chip and the lead electrodes are sealed to the same surface as all of the thin portions with a resin, after making a connection between the pad electrodes and the lead electrodes with connecting wires. The first, second, and third thin portions are removed by etching so that each of the lead electrodes includes a thin internal lead portion having a connection part on an upper surface side and a thick external electrode portion protruding toward an under surface and forming a connection part. The resin at the underside is substantially co-planar with the under surface of the internal lead portion of the lead electrodes, and the external electrode portion protrudes downward from the underside of the resin layer.
摘要翻译：使用由具有非平面上表面和平面下表面的板状体构成的引线框架制造半导体器件的方法。板状体包括用于安装具有焊盘电极的半导体芯片的第一薄部分，径向布置用于形成分别对应于半导体芯片的焊盘电极的引线电极的第一厚部分，第一厚部分对之间的第二薄部分围绕第一厚部分的第三薄壁部分和围绕第三薄部分的第二厚壁部分。在利用连接线形成焊盘电极和引线电极之间的连接之后，用树脂将半导体芯片和引线电极密封到与所有薄部分相同的表面。通过蚀刻去除第一，第二和第三薄部分，使得每个引线电极包括具有在上表面侧上的连接部分的薄内部引线部分和向下表面突出的厚外部电极部分，并形成连接部分。下侧的树脂与引线电极的内部引线部的下表面基本共面，外部电极部从树脂层的下侧向下方突出。

6. 发明授权

US06310395B1 Electronic component with anodically bonded contact 失效
标题翻译：具有阳极接触接触的电子部件
公开(公告)号：US06310395B1
公开(公告)日：2001-10-30
申请号：US09666101
申请日：2000-09-20
申请人： Yoshiharu Takahashi , Toshiaki Shinohara
发明人： Yoshiharu Takahashi , Toshiaki Shinohara
IPC分类号： H01L2348
CPC分类号： H01L23/4951 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/05554 , H01L2224/13144 , H01L2224/16 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/81801 , H01L2224/83894 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic component includes an inner lead having a tip with a projection; an insulating coating that is electrically conductive when heated disposed around the projection; and a metallic coating disposed around an electrode on a semiconductor chip, with a crater reaching the electrode, the projection engaging the crater to make a contact between the inner lead and the electrode, the insulating coating and the metallic coating being anodically bonded to each other.
摘要翻译：电子部件包括具有突起的尖端的内引线; 绝缘涂层，其被加热设置在所述突起周围时是导电的; 以及设置在半导体芯片上的电极周围的金属涂层，其中火山口到达电极，突起接合火山口以在内部引线和电极之间接触，绝缘涂层和金属涂层彼此阳极接合。

7. 发明授权

US06159766A Designing method of leadframe tip arrangement 失效
标题翻译：引线框尖端布置的设计方法
公开(公告)号：US06159766A
公开(公告)日：2000-12-12
申请号：US37963
申请日：1998-03-11
申请人： Hirokazu Taki , Akihiro Goto , Hirochika Kawaguchi , Yoshiharu Takahashi , Yasuhito Suzuki , Takao Takahashi , Takashi Arita , Satoshi Ookyuu
发明人： Hirokazu Taki , Akihiro Goto , Hirochika Kawaguchi , Yoshiharu Takahashi , Yasuhito Suzuki , Takao Takahashi , Takashi Arita , Satoshi Ookyuu
IPC分类号： H01L21/60 , G06F17/50 , H01L23/495 , H01L23/50 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/00
摘要： To determine leadframe tip positions, a circular arc portion where leadframe tips are to be arranged is determined so as to be opposed to each of the four corners of a die pad by performing a search. Then, straight line portions are set so as to extend from the circular arc portion and to be opposed to the die pad sidelines. The shape of each leadframe tip on the circular arc portion is defined as a region that is sectioned by two concentric circles and two radial rays extending from the center of the concentric circles. The division between the circular arc portion and straight line portions and the setting of the center of the circular arc portion are performed automatically. The leadframe tip width and interval are determined independently of each other.
摘要翻译：为了确定引线框尖端位置，通过执行搜索来确定引线框架顶端将被布置的圆弧部分，以便与芯片焊盘的四个角中的每一个相对。然后，直线部分被设置成从圆弧部分延伸并与芯片焊盘侧面相对。圆弧部分上的每个引线框尖的形状被定义为由两个同心圆分割的区域和从同心圆的中心延伸的两个径向射线。自动进行圆弧部与直线部之间的分割以及圆弧部的中心的设定。引线框尖端宽度和间隔彼此独立地确定。

8. 发明授权

US5902119A Leadframe tip arrangement designing method 失效
标题翻译：引线框架布置设计方法
公开(公告)号：US5902119A
公开(公告)日：1999-05-11
申请号：US885352
申请日：1997-06-30
申请人： Hirokazu Taki , Akihiro Goto , Yoshiharu Takahashi , Yasuhito Suzuki , Takao Takahashi , Takashi Arita , Satoshi Ookyuu
发明人： Hirokazu Taki , Akihiro Goto , Yoshiharu Takahashi , Yasuhito Suzuki , Takao Takahashi , Takashi Arita , Satoshi Ookyuu
IPC分类号： H01L23/50 , G06F17/50 , H01L23/495 , H01L21/44
CPC分类号： H01L23/49541 , H01L2924/0002
摘要： A designing method calculates leadframe tip arrangement. The method comprises the steps of setting a leadframe tip arrangement region opposed to a die pad sideline of a leadframe, setting a leadframe tip arrangement line in the leadframe arrangement region, and arranging a predetermined number of leadframe tips on the leadframe tip arrangement line at proper intervals. The method allows for the independent calculation of various parameters.
摘要翻译：一种设计方法计算引线框尖端布置。该方法包括以下步骤：设置与引线框架的芯片焊盘副线相对的引线框尖端布置区域，将引线框架布置线设置在引线框架布置区域中，并且在引线框架顶端布置线上以适当的方式布置预定数量的引线框架末端间隔该方法允许独立计算各种参数。

9. 发明授权

US5793100A Lead frame for semiconductor device 失效
标题翻译：半导体器件引线框架
公开(公告)号：US5793100A
公开(公告)日：1998-08-11
申请号：US584124
申请日：1996-01-11
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49565 , H01L2924/0002
摘要： A lead frame includes first slits in a lead frame edge in a direction parallel to a longitudinal direction of the lead frame edge at spaced intervals and a plurality of slits in the lead frame edge in a direction parallel to the first slits at spaced intervals so that the second slits are separated from the first slits wherein each end of each of the second slits is located near the center of a corresponding first slit.
摘要翻译：引线框架包括引线框架边缘中的平行于引线框架边缘的纵向方向的方向的间隔开的第一狭缝和引线框架边缘中的多个狭缝在平行于第一狭缝的方向上间隔开间隔，使得第二狭缝与第一狭缝分开，其中每个第二狭缝的每个端部位于相应的第一狭缝的中心附近。

10. 发明授权

US5753977A Semiconductor device and lead frame therefor 失效
标题翻译：半导体器件及其引线框架
公开(公告)号：US5753977A
公开(公告)日：1998-05-19
申请号：US768909
申请日：1996-12-18
申请人： Kenichi Kusaka , Yoshiharu Takahashi
发明人： Kenichi Kusaka , Yoshiharu Takahashi
IPC分类号： H01L23/28 , H01L21/56 , H01L23/433 , H01L23/495 , H01L23/50 , H01L23/29
CPC分类号： H01L24/32 , H01L21/565 , H01L23/4334 , H01L23/49503 , H01L23/49541 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/01004 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01076 , H01L2924/01082 , H01L2924/181
摘要： A semiconductor device includes a semiconductor chip; leads including first inner leads and second inner leads extending substantially radially from a central point of the semiconductor chip; electrical conductors electrically connecting the semiconductor chip to the lead frame; and an encapsulating resin encapsulating the semiconductor chip, the electrical conductors, and the inner leads, Each of the first inner leads has a first inner end located proximate the central point and each of the second inner leads has a second inner end located farther from the central point than the first inner ends. The first and second inner leads are alternatingly arranged. Thus, at least some of the inner leads extend under the semiconductor chip, providing heat conducting paths. The lead frame includes a frame and leads supported by the frame and including first inner leads and second inner leads extending substantially radially toward a central point of the frame. The lead frame is applicable for mounting semiconductor chips of different outer dimensions and a necessary clearance is maintained between the leads.
摘要翻译：半导体器件包括半导体芯片; 引线包括从半导体芯片的中心点基本上径向延伸的第一内引线和第二内引线; 将半导体芯片电连接到引线框架的电导体; 以及密封半导体芯片，电导体和内引线的封装树脂。每个第一内引线具有位于中心点附近的第一内端，并且每个第二内引线具有位于距离中心点更远的第二内端中心点比第一个内端。交替布置第一和第二内引线。因此，至少一些内引线延伸在半导体芯片下方，提供导热路径。引线框架包括框架和由框架支撑的引线，并且包括基本上径向地朝向框架的中心点延伸的第一内引线和第二内引线。引线框架适用于安装不同外形尺寸的半导体芯片，导线之间保持必要的间隙。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式