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    • 8. 发明授权
    • Image processing apparatus and storage medium storing image processing program
    • 图像处理装置和存储图像处理程序的存储介质
    • US08447143B2
    • 2013-05-21
    • US13008343
    • 2011-01-18
    • Chihiro MatsugumaHiroyoshi UejoKazuhiro OhyaKatsuya KoyanagiShintaro Adachi
    • Chihiro MatsugumaHiroyoshi UejoKazuhiro OhyaKatsuya KoyanagiShintaro Adachi
    • G06K9/03
    • G06K9/346G06K2209/01G06T11/60
    • An image processing apparatus that includes a character recognition component, a determining component and a generating component is provided. The determining component determines, when document data is generated that contains first data representing the document and representing the entity in which the characters are mixed and second data containing character code data of the characters recognized by the character recognition component and representing a character block displaying the characters represented by the character code data, whether to hide the character block represented by the second data behind the entity represented by the first data or to display the character block represented by the second data in front of the entity represented by the first data when the document represented by the document data is displayed, based on lightness or distribution of the lightness of a background region around the characters of the entity or the like.
    • 提供了一种包括字符识别组件,确定组件和生成组件的图像处理设备。 确定部件确定当生成包含表示文档的第一数据并且表示其中混合了字符的实体的文档数据的第二数据和包含由字符识别组件识别的字符的字符代码数据的第二数据并且表示显示 由字符代码数据表示的字符,是否隐藏由第一数据表示的实体后面的第二数据表示的字符块,或者当由第一数据表示的实体前面显示由第二数据表示的字符块时 基于文档数据表示的文档,基于实体的字符周围的背景区域的亮度的亮度或分布来显示。
    • 10. 发明授权
    • Separating machine for thinned semiconductor substrate and separation method
    • 分离机用于减薄半导体衬底和分离方法
    • US06730578B2
    • 2004-05-04
    • US10067370
    • 2002-02-07
    • Kazuhiro OtsuHideki KobayashiTatsuya SasakiKazuhiro Ohya
    • Kazuhiro OtsuHideki KobayashiTatsuya SasakiKazuhiro Ohya
    • H01L2146
    • H01L21/67092H01L21/6838
    • A separating machine for separating a thinned semiconductor substrate from a holding substrate after a semiconductor substrate is bonded to the holding substrate with a thermoplastic resin and a back surface treatment including the thinning of the semiconductor substrate is carried out. The separating machine includes a pair of vacuum adsorption heads for adsorbing the holding substrate-bonded thinned semiconductor substrate from the holding substrate side and from the thinned semiconductor substrate side, which is opposite to the holding substrate side. At least one of the vacuum adsorption heads has a moving means for moving the vacuum adsorption head to adsorb and hold the bonded substrates in a predetermined position together with the other vacuum adsorption head. At least one of the vacuum adsorption heads, has a system for moving the vacuum adsorption head in a single swing direction for separating the bonded substrates after the above adsorption and holding operation is performed.
    • 在将半导体衬底用热塑性树脂粘合到保持衬底上并且进行包括半导体衬底的薄化的背面处理之后,进行用于将减薄的半导体衬底与保持衬底分离的分离机。 分离机包括一对真空吸附头,用于从保持衬底侧吸附保持衬底粘合的薄化半导体衬底,并从与保持衬底侧相对的变薄的半导体衬底侧吸附。 真空吸附头中的至少一个具有移动装置,用于移动真空吸附头以将粘合的基底与另一个真空吸附头一起吸附并保持在预定位置。 至少一个真空吸附头具有用于在执行上述吸附和保持操作之后在单个摆动方向上移动真空吸附头的分离系统。