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1. 发明授权

US08246900B2 Annealing apparatus 有权
标题翻译：退火设备
公开(公告)号：US08246900B2
公开(公告)日：2012-08-21
申请号：US12440034
申请日：2007-08-31
申请人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
发明人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
IPC分类号： H01L21/26 , C21D1/74
CPC分类号： H01L21/67115 , H01L21/67109 , H01L31/1864 , Y02E10/50 , Y02P70/521
摘要： Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber 1 for accommodating a wafer W; heating sources 17a and 17b including LEDs 33 and facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting members 18a and 18b arranged in alignment with the heating sources 17a and 17b to transmit the light emitted from the LEDs 33; cooling members 4a and 4b supporting the light-transmitting members 18a and 18b at opposite side to the processing chamber 1 to make direct contact with the heating sources 17a and 17b and made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling members 4a and 4b with a coolant.
摘要翻译：提供一种退火装置，其不会由于发热而导致的发光量的降低而导致光能效率降低的问题，并且能够保持稳定的性能。该装置包括：用于容纳晶片W的处理室1; 加热源17a和17b包括LED33并面向晶片W的表面以将光照射在晶片W上; 与发热源17a和17b对准布置的透光部件18a和18b，以透射从LED33发出的光; 在与处理室1相反的一侧支撑透光部件18a和18b的冷却部件4a和4b与加热源17a和17b直接接触并由导热性高的材料制成; 以及用冷却剂冷却冷却部件4a，4b的冷却机构。

2. 发明申请

US20100038833A1 ANNEALING APPARATUS 有权
标题翻译：退火装置
公开(公告)号：US20100038833A1
公开(公告)日：2010-02-18
申请号：US12440034
申请日：2007-08-31
申请人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
发明人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
IPC分类号： H01L21/26 , C21D1/74
CPC分类号： H01L21/67115 , H01L21/67109 , H01L31/1864 , Y02E10/50 , Y02P70/521
摘要： Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber 1 for accommodating a wafer W; heating sources 17a and 17b including LEDs 33 and facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting members 18a and 18b arranged in alignment with the heating sources 17a and 17b to transmit the light emitted from the LEDs 33; cooling members 4a and 4b supporting the light-transmitting members 18a and 18b at opposite side to the processing chamber 1 to make direct contact with the heating sources 17a and 17b and made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling members 4a and 4b with a coolant.
摘要翻译：提供一种退火装置，其不会由于发热而导致的发光量的降低而导致光能效率降低的问题，并且能够保持稳定的性能。该装置包括：用于容纳晶片W的处理室1; 加热源17a和17b包括LED33并面向晶片W的表面以将光照射在晶片W上; 与发热源17a和17b对准布置的透光部件18a和18b，以透射从LED33发出的光; 在与处理室1相反的一侧支撑透光部件18a和18b的冷却部件4a和4b与加热源17a和17b直接接触并由导热性高的材料制成; 以及用冷却剂冷却冷却部件4a，4b的冷却机构。

3. 发明授权

US08440939B2 Annealing device 失效
标题翻译：退火装置
公开(公告)号：US08440939B2
公开(公告)日：2013-05-14
申请号：US12680221
申请日：2008-09-25
申请人： Shigeru Kasai , Tomohiro Suzuki , Sumi Tanaka , Masatake Yoneda , Hiroyuki Miyashita
发明人： Shigeru Kasai , Tomohiro Suzuki , Sumi Tanaka , Masatake Yoneda , Hiroyuki Miyashita
IPC分类号： H05B3/00
CPC分类号： H01L21/67115 , H01L25/0753 , H01L33/54 , H01L2224/48091 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is an annealing device that includes a processing chamber into which a wafer is received, a heating source having a plurality of light emitting diodes (LEDs) for emitting a light toward the wafer, which faces the surface of the wafer, and a light transmissive member provided corresponding to the heating source, into which the light from the light emitting elements is transmitted. The heating source has the light emitting elements attached on a support toward the wafer. Each of the light emitting elements is individually covered with a lens layer made of a transparent resin.
摘要翻译：公开了一种退火装置，其包括接收晶片的处理室，具有朝向晶片的朝向晶片表面的光的多个发光二极管（LED）的加热源，以及透光对应于来自发光元件的光被传输到其中的加热源设置的构件。加热源具有附着在朝向晶片的支撑件上的发光元件。每个发光元件分别被透明树脂制成的透镜层覆盖。

4. 发明申请

US20100314377A1 ANNEALING DEVICE 失效
标题翻译：退火装置
公开(公告)号：US20100314377A1
公开(公告)日：2010-12-16
申请号：US12680221
申请日：2008-09-25
申请人： Shigeru Kasai , Tomohiro Suzuki , Sumi Tanaka , Masatake Yoneda , Hiroyuki Miyashita
发明人： Shigeru Kasai , Tomohiro Suzuki , Sumi Tanaka , Masatake Yoneda , Hiroyuki Miyashita
IPC分类号： H05B1/00 , H01L21/26 , H01L33/00
CPC分类号： H01L21/67115 , H01L25/0753 , H01L33/54 , H01L2224/48091 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is an annealing device that includes a processing chamber into which a wafer is received, a heating source having a plurality of light emitting diodes (LEDs) for emitting a light toward the wafer, which faces the surface of the wafer, and a light transmissive member provided corresponding to the heating source, into which the light from the light emitting elements is transmitted. The heating source has the light emitting elements attached on a support toward the wafer. Each of the light emitting elements is individually covered with a lens layer made of a transparent resin.
摘要翻译：公开了一种退火装置，其包括接收晶片的处理室，具有朝向晶片的朝向晶片表面的光的多个发光二极管（LED）的加热源，以及透光对应于来自发光元件的光被传输到其中的加热源设置的构件。加热源具有附着在朝向晶片的支撑件上的发光元件。每个发光元件分别被透明树脂制成的透镜层覆盖。

5. 发明授权

US08897631B2 Annealing apparatus 有权
标题翻译：退火设备
公开(公告)号：US08897631B2
公开(公告)日：2014-11-25
申请号：US12864792
申请日：2009-01-19
申请人： Shigeru Kasai , Hiroyuki Miyashita , Tomohiro Suzuki , Masatake Yoneda , Kazuhiro Ooya
发明人： Shigeru Kasai , Hiroyuki Miyashita , Tomohiro Suzuki , Masatake Yoneda , Kazuhiro Ooya
IPC分类号： F27D11/12 , H01L21/67 , H01L21/324 , H01L21/268
CPC分类号： H01L21/67109 , H01L21/268 , H01L21/324 , H01L21/67115
摘要： An annealing apparatus includes heating sources provided to face a wafer W, the heating sources having LEDs emitting lights to the wafer; light-transmitting members for transmitting the lights emitted from the LEDs; and cooling members made of aluminum and provided to directly contact with the heating sources, respectively. The heating sources include a plurality of LED arrays having supporters made of AlN, each having one surface on which the LEDs are adhered by using a silver paste; and other surface on which thermal diffusion members made of copper are adhered by using a solder. The LED arrays are fixed to the cooling member by using screws via a silicone grease.
摘要翻译：退火装置包括设置成面向晶片W的加热源，所述加热源具有向晶片发光的LED; 用于透射从LED发射的光的透光构件; 和由铝制成的冷却部件，分别与加热源直接接触。加热源包括具有由AlN制成的支撑体的多个LED阵列，每个具有一个表面，其上通过使用银膏粘合LED; 和由铜制成的热扩散构件的其他表面通过焊料粘合。 LED阵列通过使用硅脂润滑脂的螺丝固定在冷却部件上。

6. 发明申请

US20110033175A1 ANNEALING APPARATUS 有权
标题翻译：退火装置
公开(公告)号：US20110033175A1
公开(公告)日：2011-02-10
申请号：US12864792
申请日：2009-01-19
申请人： Shigeru Kasai , Hiroyuki Miyashita , Tomohiro Suzuki , Masatake Yoneda , Kazuhiro Ooya
发明人： Shigeru Kasai , Hiroyuki Miyashita , Tomohiro Suzuki , Masatake Yoneda , Kazuhiro Ooya
IPC分类号： F27D11/12
CPC分类号： H01L21/67109 , H01L21/268 , H01L21/324 , H01L21/67115
摘要： An annealing apparatus includes heating sources 17a and 17b provided to face a wafer W, the heating sources 17a and 17b having LEDs 33 emitting lights to the wafer; light-transmitting members 18a and 18b for transmitting the lights emitted from the LEDs 33; and cooling members 4a and 4b made of aluminum and provided to directly contact with the heating sources 17a and 17b, respectively. The heating sources 17a and 17b include a plurality of LED arrays having supporters 32 made of AlN, each having one surface on which the LEDs 33 are adhered by using a silver paste 56; and other surface on which thermal diffusion members 50 made of copper are adhered by using a solder 57. The LED arrays 34 are fixed to the cooling member 4a(4b) by using screws via a silicon grease.
摘要翻译：退火装置包括设置成面向晶片W的加热源17a和17b，具有向该晶片发光的LED 33的加热源17a和17b; 用于透射从LED 33发射的光的透光构件18a和18b; 以及由铝制成并分别与加热源17a和17b直接接触的冷却构件4a和4b。加热源17a和17b包括多个LED阵列，其具有由AlN制成的支撑体32，每个具有一个表面，其上通过使用银膏56粘附LED 33; 和由铜制成的热扩散构件50的其他表面通过使用焊料57粘附在其上。LED阵列34通过使用经由硅油脂的螺钉固定到冷却构件4a（4b）。

7. 发明申请

US20110174790A1 ANNEALING APPARATUS 审中-公开
标题翻译：退火装置
公开(公告)号：US20110174790A1
公开(公告)日：2011-07-21
申请号：US13001357
申请日：2009-06-24
申请人： Tomohiro Suzuki , Masatake Yoneda , Shigeru Kasai , Kazuhiro Ooya
发明人： Tomohiro Suzuki , Masatake Yoneda , Shigeru Kasai , Kazuhiro Ooya
IPC分类号： B23K26/12 , B23K26/00
CPC分类号： H01L21/67115
摘要： The present invention is an annealing apparatus configured to perform an annealing process to an object to be processed, the annealing apparatus comprising: a processing vessel in which the object to be processed can be accommodated; a support unit configured to support the object to be processed in the processing vessel; a gas supply unit configured to supply a process gas into the processing vessel; an exhaust unit configured to discharge an atmosphere in the processing vessel; and a rear-side heating unit including a plurality of laser elements configured to irradiate heating light beams toward an overall rear surface of the object to be processed.
摘要翻译：本发明是一种对被处理物进行退火处理的退火装置，该退火装置包括：处理容器，其中可容纳待加工物体; 支撑单元，其构造成在处理容器中支撑要处理的物体; 气体供给单元，其构造成将处理气体供给到处理容器中; 排气单元，其构造成排出处理容器中的气氛; 以及后侧加热单元，其包括多个激光元件，所述多个激光元件被配置为朝向待处理物体的整个后表面照射加热光束。

8. 发明申请

US20120118504A1 PROCESSING APPARATUS AND METHOD FOR OPERATING SAME 审中-公开
标题翻译：处理装置及其操作方法
公开(公告)号：US20120118504A1
公开(公告)日：2012-05-17
申请号：US13386572
申请日：2010-07-21
申请人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai , Sumi Tanaka
发明人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai , Sumi Tanaka
IPC分类号： B44C1/22 , C23C16/458 , C23C16/52 , B25B11/00 , B24C3/00
CPC分类号： H01L21/68792
摘要： A processing apparatus for performing a process on an object includes a chamber; a rotary floater for supporting the object on its upper end side; XY rotating attraction bodies provided in the rotary floater at an interval circumferentially; a floating attraction body provided in the rotary floater to extend circumferentially; a floating electromagnet group for floating the rotary floater while adjusting an inclination of the rotary floater by applying a vertically upward acting magnetic attraction to the floating attraction body; an XY rotating electromagnet group for rotating the rotary floater while adjusting a horizontal position of the rotary floater by applying a magnetic attraction force to the XY rotating attraction bodies; a gas supply for supplying a gas into the chamber; a mechanism for performing a process on the object; and an apparatus control unit for controlling an entire operation of the apparatus.
摘要翻译：用于对物体进行处理的处理装置包括：室; 用于在其上端侧支撑物体的旋转浮子; XY旋转吸引体以周向间隔设置在旋转浮子中; 浮动吸引体，设置在所述旋转浮子中以沿周向延伸; 浮动电磁体组，用于通过向浮动吸引体施加垂直向上作用的磁吸引力来调节旋转浮子的倾斜度而浮动旋转浮子; XY旋转电磁体组，用于通过向XY旋转吸引体施加磁力来调节旋转浮子的水平位置来旋转旋转浮筒; 用于将气体供应到所述室中的气体供应源; 用于对物体执行处理的机构; 以及用于控制装置的整个操作的装置控制单元。

9. 发明授权

US09202731B2 Liquid processing apparatus, liquid processing method, and recording medium having program for executing liquid processing method recorded therein 有权
标题翻译：液体处理装置，液体处理方法和具有记录在其中的用于执行液体处理方法的程序的记录介质
公开(公告)号：US09202731B2
公开(公告)日：2015-12-01
申请号：US13334406
申请日：2011-12-22
申请人： Shigeru Kasai , Ayuta Suzuki , Ikuo Sawada , Naoki Shindo , Masatake Yoneda , Kazuhiro Ooya
发明人： Shigeru Kasai , Ayuta Suzuki , Ikuo Sawada , Naoki Shindo , Masatake Yoneda , Kazuhiro Ooya
IPC分类号： H01L21/00 , H01L21/67 , H01L21/02
CPC分类号： H01L21/67115 , H01L21/02052 , H01L21/02057 , H01L21/67028 , H01L21/67051
摘要： Disclosed is a liquid processing apparatus that processes a substrate with a processing liquid. The processing apparatus includes: a substrate holder configured to hold the substrate; a processing liquid supply unit configured to supply the processing liquid to the substrate held by the substrate holder; a rinsing liquid supply unit configured to supply a rinsing liquid to the substrate; and a light emitting element configured to emit light of a wavelength range, which is absorbed only by the substrate, and irradiate the emitted light to the substrate.
摘要翻译：公开了一种用处理液处理基板的液体处理装置。所述处理装置包括：基板保持器，其构造成保持所述基板; 处理液供给部，其将处理液供给到由所述基板保持体保持的基板; 冲洗液体供给单元，其配置为向所述基板供给冲洗液; 以及发光元件，被配置为发射仅被衬底吸收的波长范围的光，并将发射的光照射到衬底。

10. 发明授权

US08107801B2 Heat treatment apparatus, computer program, and storage medium 有权
标题翻译：热处理装置，计算机程序和存储介质
公开(公告)号：US08107801B2
公开(公告)日：2012-01-31
申请号：US12053336
申请日：2008-03-21
申请人： Masahiro Shimizu , Shigeru Kasai , Masatake Yoneda
发明人： Masahiro Shimizu , Shigeru Kasai , Masatake Yoneda
IPC分类号： F26B19/00
CPC分类号： H01L21/67115 , H01L21/324 , H01L21/67109
摘要： A heat treatment apparatus for performing prescribed heat treatment to a subject (W) to be treated is provided with a processing chamber in which air can be exhausted; a mounting table arranged in the processing chamber, for placing on an upper plane the subject to be treated; a plurality of thermoelectric conversion elements arranged on an upper part of the mounting table; a light transmitting window for covering a ceiling portion of the processing chamber airtight; and a gas introduction unit for introducing a required gas into the processing chamber. A heating unit which includes a plurality of heating light sources including a semiconductor light emitting element for emitting heating light to the subject to be treated, is provided above the light transmitting window. Thus, heating efficiency is improved and temperature can be increased and reduced at a higher speed for the subject to be treated.
摘要翻译：对待处理对象（W）进行规定的热处理的热处理装置设置有能够排出空气的处理室; 布置在处理室中的安装台，用于将待处理的物体放置在上平面上; 多个热电转换元件，布置在所述安装台的上部; 用于将处理室的顶部部分密封的透光窗口; 以及用于将所需气体引入处理室的气体引入单元。包括多个加热光源的加热单元设置在透光窗的上方，该多个加热光源包括用于向被处理物体发出加热光的半导体发光元件。因此，提高加热效率并且可以以更高的速度提高和降低待处理对象的温度。

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