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1. 发明申请

US20100206471A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：生产多层印刷线路板的工艺
公开(公告)号：US20100206471A1
公开(公告)日：2010-08-19
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

2. 发明授权

US08992713B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08992713B2
公开(公告)日：2015-03-31
申请号：US13618168
申请日：2012-09-14
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10 , H05K3/46 , B32B37/00 , B32B38/00
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
摘要翻译：多层印刷线路板可以通过以下方式制造：（1）从粘合片辊输送粘合片，其中将形成在支撑膜上的预浸料的粘合片卷绕成卷并将粘合片放置成预浸料表面接触电路板的一个或两个表面，（2）通过从支撑膜侧加热和压制粘合片的一部分，将粘合片部分地粘合到电路板上，并根据具有切割器的电路板，（3）在减压下对临时贴合的粘合片进行加热加压，将粘合片层压在电路板上，（4）通过热固化预浸料形成绝缘层，（5）热固化步骤后支撑薄膜。

3. 发明授权

US08337655B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08337655B2
公开(公告)日：2012-12-25
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

4. 发明授权

US08533942B2 Production method of multilayer printed wiring board and multilayer printed wiring board 有权
标题翻译：多层印刷线路板和多层印刷线路板的生产方法
公开(公告)号：US08533942B2
公开(公告)日：2013-09-17
申请号：US12275481
申请日：2008-11-21
申请人： Seiichiro Ohashi , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
发明人： Seiichiro Ohashi , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
IPC分类号： H05K3/02 , H05K3/10 , H01K3/10
CPC分类号： H05K3/02 , H05K1/02 , H05K1/0366 , H05K3/0032 , H05K3/0035 , H05K3/0055 , H05K3/42 , H05K2203/0796 , Y10T29/49155 , Y10T29/49165
摘要： Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below.
摘要翻译：多层印刷线路板可以通过在由浸渍有热固性树脂组合物的玻璃布组成的预浸料形成的绝缘层中通过激光照射形成通孔来制备，并且通过玻璃蚀刻溶液进行玻璃蚀刻处理然后用氧化剂溶液进行去污处理。通过这样的处理，可以充分地抑制玻璃布从通孔的壁面的回蚀现象和过度的突出，并且可以形成高度可靠的通孔。特别地，可以在顶部直径为75μm以下的小通孔中形成高度可靠的通孔。

5. 发明申请

US20090133910A1 PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：多层印刷线路板和多层印刷线路板的生产方法
公开(公告)号：US20090133910A1
公开(公告)日：2009-05-28
申请号：US12275481
申请日：2008-11-21
申请人： Seiichiro OHASHI , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
发明人： Seiichiro OHASHI , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
IPC分类号： H05K1/00 , B44C1/22 , C25D5/54
CPC分类号： H05K3/02 , H05K1/02 , H05K1/0366 , H05K3/0032 , H05K3/0035 , H05K3/0055 , H05K3/42 , H05K2203/0796 , Y10T29/49155 , Y10T29/49165
摘要： Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below.
摘要翻译：多层印刷线路板可以通过在由浸渍有热固性树脂组合物的玻璃布组成的预浸料形成的绝缘层中通过激光照射形成通孔来制备，并且通过玻璃蚀刻溶液进行玻璃蚀刻处理然后用氧化剂溶液进行去污处理。通过这样的处理，可以充分地抑制玻璃布从通孔的壁面的回蚀现象和过度的突出，并且可以形成高度可靠的通孔。特别地，可以在顶部直径为75μm以下的小通孔中形成高度可靠的通孔。

6. 发明授权

US08584352B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08584352B2
公开(公告)日：2013-11-19
申请号：US12869926
申请日：2010-08-27
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H05K3/02
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/0038 , H05K3/025 , H05K3/181 , H05K3/381 , H05K2203/1152
摘要： Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.
摘要翻译：可以通过包括以下步骤（A） - （E）的方法制备能形成在平坦绝缘层表面上的剥离强度优异的导电层的超细布线形成的多层印刷电路板：（A）通过固化性树脂组合物层在内层电路基板上形成金属膜的金属膜，其中在支撑层上形成金属膜层，或者用金属膜层压粘合膜的步骤，其中可固化在金属膜的金属膜层上在内层电路基板上形成树脂组合物层; （B）固化树脂组合物层以固化以形成绝缘层的步骤; （C）去除支撑层的步骤; （D）除去金属膜层的工序; 和（E）通过化学镀在绝缘层表面上形成金属膜层的步骤。

7. 发明授权

US06881293B2 Process for producing a multi-layer printer wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US06881293B2
公开(公告)日：2005-04-19
申请号：US10080408
申请日：2002-02-25
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08L63/00 , H05K1/00 , H05K3/46 , B32B31/20
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition.This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.
摘要翻译：本发明涉及一种层间粘合剂组合物，其包含液体环氧树脂，软化点高于粘合剂的层压温度和分子内具有两个或更多个环氧基的多官能环氧树脂; 和潜在的环氧固化剂在高于层压温度的温度下引发反应。粘合剂组合物任选地含有液体环氧树脂和/或有机溶剂以外的液体树脂，液体树脂包括液体环氧树脂，有机溶剂或两者构成组合物的10至55重量％。这种层间粘合剂组合物允许制备多层印刷线路板。提供了制备多层印刷线路板的方法。所得到的本发明的多层印刷电路板在内层电路中具有优异的嵌入性能，优异的表面平滑性，并且可以在使用本粘合剂的建筑工艺中以高生产率提供。

8. 发明授权

US5723262A Resin composition 失效
标题翻译：树脂组成
公开(公告)号：US5723262A
公开(公告)日：1998-03-03
申请号：US680551
申请日：1996-07-09
申请人： Shigeo Nakamura , Masahiko Oshimura , Kenichi Mori , Tadahiko Yokota , Hiroyasu Koto
发明人： Shigeo Nakamura , Masahiko Oshimura , Kenichi Mori , Tadahiko Yokota , Hiroyasu Koto
IPC分类号： C08F2/50 , C08F8/00 , C08G18/54 , C08G18/62 , C08G18/81 , C08G59/20 , C08G59/62 , C08L61/04 , C08L61/16 , C08L63/00 , G03F7/023 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/038 , H05K3/06 , H05K3/28
CPC分类号： G03F7/0388 , C08F8/00 , C08G18/542 , C08G18/62 , C08G18/8108 , C08G18/8116 , C08G18/8158 , C08G18/8175 , G03F7/032 , G03F7/038
摘要： An alkali soluble resin and a resin composition thereof useful as a solder resist, having good adhesive properties, solder heat resistance, and plating resistance are provided. Particular resistance to plating under alkaline conditions is provided by the invention.
摘要翻译：提供了可用作阻焊剂的碱溶性树脂和其树脂组合物，具有良好的粘合性，焊料耐热性和耐电镀性。在碱性条件下对电镀的耐受性由本发明提供。

9. 发明授权

US08357443B2 Laminate including water soluble release layer for producing circuit board and method of producing circuit board 有权
标题翻译：包括用于生产电路板的水溶性释放层和生产电路板的方法的层压板
公开(公告)号：US08357443B2
公开(公告)日：2013-01-22
申请号：US12551802
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B9/00 , B32B33/00 , B32B17/10 , B32B27/08 , G11B11/105 , G11B5/64 , C09J7/02 , H05K1/00 , H05K1/03 , B29C53/82
CPC分类号： H05K3/025 , B32B37/025 , B32B38/10 , B32B2038/0076 , B32B2311/00 , B32B2457/08 , H05K3/386 , H05K2201/0358 , H05K2203/0264 , H05K2203/0769 , H05K2203/0786 , Y10T428/14 , Y10T428/1438 , Y10T428/1443 , Y10T428/1476 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/269
摘要： Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.
摘要翻译：通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性。

10. 发明申请

US20100230382A1 METAL-CLAD LAMINATE 有权
标题翻译：金属层压板
公开(公告)号：US20100230382A1
公开(公告)日：2010-09-16
申请号：US12723165
申请日：2010-03-12
申请人： Hirohisa NARAHASHI , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa NARAHASHI , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B44C1/22 , B32B38/10 , C23C14/34 , B32B38/04
CPC分类号： H05K3/381 , H05K3/025 , H05K2203/072 , H05K2203/0786 , H05K2203/1152 , Y10T29/49155
摘要： Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.
摘要翻译：在绝缘层的光滑表面上形成具有优良剥离强度的导体层的覆金属层压体可以通过以下方法获得：（A）通过提供一层或多层片材来制备覆金属层压板前体的步骤在支撑层上具有金属膜层的两片薄膜之间的预浸料坯，并且在减压下加热和加压它们;（B）去除支撑层的步骤，（C）去除金属膜层的步骤和（ D）通过化学镀在绝缘层的表面上形成金属膜层的步骤。

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