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1. 发明申请

US20130096044A1 LIQUID CONCENTRATE FOR CLEANING COMPOSITION, CLEANING COMPOSITION AND CLEANING METHOD 有权
标题翻译：用于清洁组合物的液体浓度，清洁组合物和清洁方法
公开(公告)号：US20130096044A1
公开(公告)日：2013-04-18
申请号：US13805735
申请日：2011-05-31
申请人： Shigeo Hori , Hiroki Nakatsukasa , Yuki Akamatsu
发明人： Shigeo Hori , Hiroki Nakatsukasa , Yuki Akamatsu
IPC分类号： C11D7/50
CPC分类号： C11D7/5013 , B23K35/3612 , B23K35/362 , C11D7/24 , C11D7/247 , C11D7/261 , C11D7/263 , C11D7/264 , C11D7/5022 , C11D7/5027 , C11D11/0047 , C23G5/06 , H05K3/22 , H05K2203/0783 , H05K2203/122
摘要： Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.
摘要翻译：提供一种清洁组合物的液体浓缩物，其可以通过添加预定量的水，并且还具有优异的再生效率而可以表现出优异的环境安全性，并且提供了清洁组合物及其清洁方法。公开了一种用于与水混合使用的清洁组合物的液体浓缩物，其用于在预定量的水中加入清洁待清洁物体的混浊状态，所述清洗组合物用液体浓缩物包括：作为预定的疏水性二醇醚化合物等的第一有机溶剂和作为规定的亲水性胺化合物的第二有机溶剂。

2. 发明授权

US09085751B2 Liquid concentrate for cleaning composition, cleaning composition and cleaning method 有权
标题翻译：液体浓缩物用于清洗组合物，清洗组合物和清洗方法
公开(公告)号：US09085751B2
公开(公告)日：2015-07-21
申请号：US13805735
申请日：2011-05-31
申请人： Shigeo Hori , Hiroki Nakatsukasa , Yuki Akamatsu
发明人： Shigeo Hori , Hiroki Nakatsukasa , Yuki Akamatsu
IPC分类号： C11D7/50 , B23K35/36 , B23K35/362 , C23G5/06 , H05K3/22 , C11D11/00 , C11D7/24 , C11D7/26
CPC分类号： C11D7/5013 , B23K35/3612 , B23K35/362 , C11D7/24 , C11D7/247 , C11D7/261 , C11D7/263 , C11D7/264 , C11D7/5022 , C11D7/5027 , C11D11/0047 , C23G5/06 , H05K3/22 , H05K2203/0783 , H05K2203/122
摘要： Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.
摘要翻译：提供一种清洁组合物的液体浓缩物，其可以通过添加预定量的水，并且还具有优异的再生效率而可以表现出优异的环境安全性，并且提供了清洁组合物及其清洁方法。公开了一种用于与水混合使用的清洁组合物的液体浓缩物，其用于在预定量的水中加入清洁待清洁物体的混浊状态，所述清洗组合物用液体浓缩物包括：作为预定的疏水性二醇醚化合物等的第一有机溶剂和作为规定的亲水性胺化合物的第二有机溶剂。

3. 发明申请

US20060223732A1 Cleaning agent for removing solder flux and method for cleaning solder flux 有权
标题翻译：去除助焊剂的清洗剂和清洗焊剂的方法
公开(公告)号：US20060223732A1
公开(公告)日：2006-10-05
申请号：US10560941
申请日：2004-08-10
申请人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
发明人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
IPC分类号： C11D7/32
CPC分类号： C11D7/3218 , C11D7/261 , C11D11/0047 , H05K3/26
摘要： The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.
摘要翻译：本发明提供一种除去助焊剂的清洗剂和清洗焊剂的方法，即使在清洗无铅焊剂，高熔点焊剂等时也具有优异的清洗性能，以及同时在下一步骤中使用醇溶剂在漂洗中表现出优异的冲洗性能。因此，本发明提供一种除去助焊剂的清洗剂，其将苯甲醇的含量设定在70〜99.9重量％的范围内，氨基醇的含量为当二醇化合物的含量相对于除去助焊剂的清洁剂的总量低于1重量％时，为0.1〜30重量％，将苯甲醇的含量设定为15以下的范围至99重量％，氨基醇含量为0.1〜30重量％的范围时，二醇化合物的含量相对于清洗量的总量为1〜40重量％去除助焊剂的试剂。用于去除焊剂的清洁剂用于清洁无铅焊剂和高熔点焊剂等。

4. 发明申请

US20080305979A1 Cleaning agent for removing solder flux and method for cleaning solder flux 有权
标题翻译：去除助焊剂的清洗剂和清洗焊剂的方法
公开(公告)号：US20080305979A1
公开(公告)日：2008-12-11
申请号：US12221660
申请日：2008-08-05
申请人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
发明人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
IPC分类号： C11D7/50
CPC分类号： C11D7/3218 , C11D7/261 , C11D11/0047 , H05K3/26
摘要： The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.
摘要翻译：本发明提供一种除去助焊剂的清洗剂和清洗焊剂的方法，即使在清洗无铅焊剂，高熔点焊剂等时也具有优异的清洗性能，以及同时在下一步骤中使用醇溶剂在漂洗中表现出优异的冲洗性能。因此，本发明提供一种除去助焊剂的清洗剂，其将苯甲醇的含量设定在70〜99.9重量％的范围内，氨基醇的含量为当二醇化合物的含量相对于除去助焊剂的清洁剂的总量低于1重量％时，为0.1〜30重量％，将苯甲醇的含量设定为15以下的范围至99重量％，氨基醇含量为0.1〜30重量％的范围时，二醇化合物的含量相对于清洗量的总量为1〜40重量％去除助焊剂的试剂。用于去除焊剂的清洁剂用于清洁无铅焊剂和高熔点焊剂等。

5. 发明授权

US07776808B2 Cleaning agent for removing solder flux and method for cleaning solder flux 有权
标题翻译：去除助焊剂的清洗剂和清洗焊剂的方法
公开(公告)号：US07776808B2
公开(公告)日：2010-08-17
申请号：US12221660
申请日：2008-08-05
申请人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
发明人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
IPC分类号： C11D7/50
CPC分类号： C11D7/3218 , C11D7/261 , C11D11/0047 , H05K3/26
摘要： The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.
摘要翻译：本发明提供一种除去助焊剂的清洗剂和清洗焊剂的方法，即使在清洗无铅焊剂，高熔点焊剂等时也具有优异的清洗性能，以及同时在下一步骤中使用醇溶剂在漂洗中表现出优异的冲洗性能。因此，本发明提供一种除去助焊剂的清洗剂，其将苯甲醇的含量设定在70〜99.9重量％的范围内，氨基醇的含量为当二醇化合物的含量相对于除去助焊剂的清洁剂的总量低于1重量％时，为0.1〜30重量％，将苯甲醇的含量设定为15以下的范围至99重量％，氨基醇含量为0.1〜30重量％的范围时，二醇化合物的含量相对于清洗量的总量为1〜40重量％去除助焊剂的试剂。用于去除焊剂的清洁剂用于清洁无铅焊剂和高熔点焊剂等。

6. 发明授权

US07435711B2 Cleaning agent for removing solder flux and method for cleaning solder flux 有权
公开(公告)号：US07435711B2
公开(公告)日：2008-10-14
申请号：US10560941
申请日：2004-08-10
申请人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
发明人： Shigeo Hori , Hisakazu Takahashi , Hirohiko Furui , Hiroki Nakatsukasa
IPC分类号： C11D7/50
CPC分类号： C11D7/3218 , C11D7/261 , C11D11/0047 , H05K3/26
摘要： The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.

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