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    • 2. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR
    • 半导体集成电路及其制造方法
    • US20080144365A1
    • 2008-06-19
    • US11943495
    • 2007-11-20
    • Masanao YAMAOKAKenichi OSADAShigenobu KOMATSU
    • Masanao YAMAOKAKenichi OSADAShigenobu KOMATSU
    • G11C11/34
    • G11C11/417
    • In this invention, high manufacturing yield is realized and variations in threshold voltage of each MOS transistor in a CMOS•SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. The threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is respectively programmed into control memories according to the results of determination. The levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS•SRAM are controlled to a predetermined error span. A body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.
    • 在本发明中,实现了高制造成品率,并补偿了CMOS.SRAM中的每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作,写入操作和读取操作的任何活动模式中,将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据测定结果分别被编程到控制存储器中。 基于程序调整体偏置电压的电平,使得CMOS.SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。
    • 3. 发明申请
    • Semiconductor Integrated Circuit and Manufacturing Method Thereof
    • 半导体集成电路及其制造方法
    • US20120147662A1
    • 2012-06-14
    • US13350340
    • 2012-01-13
    • Masanao YAMAOKAKenichi OSADAShigenobu KOMATSU
    • Masanao YAMAOKAKenichi OSADAShigenobu KOMATSU
    • G11C11/40
    • G11C11/417
    • High manufacturing yield is realized and variation in threshold voltage of each MOS transistor in a CMOS·SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. Threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is programmed into control memories according to results of determination. Levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS·SRAM are controlled to a predetermined error span. Body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.
    • 实现了高制造成品率,补偿了CMOS·SRAM中的每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作,写入操作和读取操作的任何活动模式中,将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据确定结果被编程到控制存储器中。 基于程序调整体偏置电压的电平,使得CMOS·SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置电压施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。