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1. 发明申请

US20120167985A1 SOLAR CELL SEALANT SHEET AND SEALANT-INTEGRATED SUBSTRATE 审中-公开
标题翻译：太阳能电池密封材料和密封材料集成基板
公开(公告)号：US20120167985A1
公开(公告)日：2012-07-05
申请号：US13383285
申请日：2010-07-12
申请人： Shigeki Ichimura , Yutaka Natsume
发明人： Shigeki Ichimura , Yutaka Natsume
IPC分类号： H01L31/0203 , B32B3/00 , B32B27/38
CPC分类号： C09J175/04 , C08F8/44 , C08F220/14 , C08F2220/1858 , C08G18/283 , C08G18/58 , C08G18/755 , C08G18/7621 , C08G18/8077 , C08G18/831 , C08L43/04 , C09D143/04 , H01L31/0481 , Y02E10/50 , Y10T428/265 , Y10T428/31511 , C08F220/20 , C08F2220/325 , C08F2220/1825 , C08F212/08 , C08F2230/085
摘要： The solar cell sealant sheet of the present invention includes a coating film of a water-soluble thermosetting resin-dispersed paint obtained by emulsion-polymerizing a monomer mixture containing an α,β-ethylenically unsaturated monomer having an alkoxysilyl group in a presence of a resin serving as a dispersant, the resin having a quaternized ammonium group that has been obtained by addition of a tertiary amine compound and an organic acid to having an epoxy group, wherein a hardness (B) in terms of a pencil hardness of the coating film after being thermally cured is 4B or higher, and a hardness ratio (B/A) of the hardness (B) after being thermally cured relative to a hardness (A) before being heated is 1.1 or higher. The sealant-integrated substrate of the present invention includes, as a sealant, the coating film of the water-soluble thermosetting resin-dispersed paint that is integrally layered on a surface on a solar cell element side of a substrate of a solar cell module.
摘要翻译：本发明的太阳能电池用密封片包括在含有具有烷氧基甲硅烷基的α，β-烯键式不饱和单体的单体混合物的存在下，通过乳液聚合得到的水溶性热固性树脂分散涂料的涂膜，作为分散剂的树脂，具有通过添加叔胺化合物和有机酸获得的具有环氧基的季铵化铵基的树脂，其中以涂膜的铅笔硬度计的硬度（B）热固化后为4B以上，热固化后的硬度（B）相对于加热前的硬度（A）的硬度比（B / A）为1.1以上。本发明的密封剂一体化基板包括作为密封剂的在太阳能电池模块的基板的太阳能电池元件侧的表面上整体层叠的水溶性热固性树脂分散涂料的涂膜。

2. 发明申请

US20120114951A1 SOLAR CELL BACK SURFACE PROTECTION SHEET AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：太阳能电池背面保护片及其制造方法
公开(公告)号：US20120114951A1
公开(公告)日：2012-05-10
申请号：US13383852
申请日：2010-07-06
申请人： Shigeki Ichimura , Yutaka Natsume , Toru Sakai
发明人： Shigeki Ichimura , Yutaka Natsume , Toru Sakai
IPC分类号： B32B27/08 , B05D3/00 , B05D5/00 , B32B9/04 , B32B27/00
CPC分类号： B32B27/365 , B32B27/08 , B32B27/18 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2307/554 , B32B2457/12 , C08F2230/085 , C08J7/045 , C08J7/047 , C08J2367/02 , C08J2433/00 , C09D4/06 , H01L31/049 , Y02E10/50 , Y10T428/31507 , Y10T428/31663 , Y10T428/3175 , Y10T428/31855 , Y10T428/31913
摘要： The solar cell back surface protection sheet of the present invention includes a substrate film composed of at least one layer, and a coating layer composed of at least one layer and formed on one surface or both surfaces of the substrate film, wherein the coating layer is a ternary copolymer layer formed by curing a coating film of a liquid containing a resin component composed of a metal alkoxide having a reactive functional group (Y), an acrylic monomer having a reactive functional group (X) that is reactive with the reactive functional group (Y), and an acrylic monomer having no reactive functional group (X). The manufacturing method of the present invention can provide a solar cell back surface protection sheet that can satisfy a gas barrier property, an anti-weathering property, and flexibility all together.
摘要翻译：本发明的太阳能电池背面保护片包括由至少一层构成的基板膜和由至少一层构成的涂层，形成在基板膜的一个表面或两个表面上，其中涂层为通过使包含由具有反应性官能团（Y）的金属醇盐构成的树脂成分的液体的涂膜固化而形成的三元共聚物层，具有与反应性官能团反应的反应性官能团（X）的丙烯酸类单体（Y）和不具有反应性官能团的丙烯酸类单体（X）。本发明的制造方法可以提供能够一起满足阻气性，抗风化性，柔软性的太阳能电池背面保护片。

3. 发明申请

US20070072952A1 Resin composition for foam molding, foam and method for producing the foam 审中-公开
标题翻译：泡沫塑料用树脂组合物，泡沫体及泡沫体的制造方法
公开(公告)号：US20070072952A1
公开(公告)日：2007-03-29
申请号：US10577346
申请日：2004-10-29
申请人： Koichi Kusakawa , Shigeki Ichimura , Yuji Maeda
发明人： Koichi Kusakawa , Shigeki Ichimura , Yuji Maeda
IPC分类号： C08J9/00 , C08F8/00
CPC分类号： C08J9/06 , C08J9/0061 , C08J2323/16 , C08J2423/00 , C08L23/02 , C08L23/16 , C08L2666/06
摘要： A resin composition for a foam is composed of a branched rubbery olefin based soft resin (C) where its gel fraction (a weight percentage of an insoluble content after extraction with xylene boiled at 138° C. for 3 hours) is less than 5%, and a volume ratio of a component which exhibits a mobility of less than 400 microseconds at a T2 (spin-spin relaxation) time by proton (H+) pulse nuclear magnetic resonance is 55 to 95%, obtained by kneading and reacting to thicken an organic peroxide crosslinking type olefin based copolymer rubber (A) and an organic peroxide decomposing type crystalline olefin resin (B). By the use of this resin composition, it is possible to provide foamed articles which can be used for interior parts for automobiles, have high to low foaming magnifications and a recycling property, and are soft and excellent in cushion property, thermal insulating property and in-mold foam molding property.
摘要翻译：泡沫树脂组合物由支化橡胶系烯烃类软质树脂（C）构成，其中，凝胶分数（在138℃，3小时沸腾后的二甲苯萃取后的不溶成分的重量百分比）小于5％，并且在T 2（自旋 - 自旋弛豫）时间下通过质子（H + +）脉冲核心显示迁移率小于400微秒的成分的体积比通过捏合和反应使有机过氧化物交联型烯烃基共聚物橡胶（A）和有机过氧化物分解型结晶烯烃树脂（B）增稠而获得的磁共振为55至95％。通过使用该树脂组合物，可以提供可用于汽车内部部件的发泡制品，具有高至低发泡倍率和再循环性能，并且柔软且具有优良的缓冲性能，绝热性和 - 发泡成型性能。

4. 发明授权

US06236108B1 Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package 失效
标题翻译：用于保持半导体封装芯片，半导体封装和半导体封装的制造工艺的衬底
公开(公告)号：US06236108B1
公开(公告)日：2001-05-22
申请号：US09541041
申请日：2000-03-31
申请人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
发明人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
IPC分类号： H01L23495
CPC分类号： H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.
摘要翻译：本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。在绝缘支撑基板的一部分上还设置有开口，其中每个布线形成在绝缘支撑基板上，绝缘支撑基板是设置有内部连接的外部连接的部分。绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

5. 发明授权

US06331576B1 Surface-decorated foam skin of cross-linked rubbery soft olefin resin 失效
标题翻译：交联橡胶软烯烃树脂的表面装饰泡沫皮
公开(公告)号：US06331576B1
公开(公告)日：2001-12-18
申请号：US09719872
申请日：2000-12-19
申请人： Koichi Kusakawa , Shigeki Ichimura
发明人： Koichi Kusakawa , Shigeki Ichimura
IPC分类号： C08J900
CPC分类号： C08J9/36
摘要： A surface decorated foam skin of cross-linked rubbery soft olefin resin, comprising rubbery soft olefin resin, characterizing by having (1) an average cell diameter of 50 to 400 &mgr;m, (2) a crystallinity of 5 to 40% (3) a hysteresis loss of 35% or lower, and (4) an embossing percentage of 40% or higher.
摘要翻译：交联橡胶状软质烯烃树脂的表面装饰泡沫皮肤，包括橡胶状软质烯烃树脂，其特征在于：（1）平均泡孔直径为50〜400μm，（2）结晶度为5〜40％（3）a 滞后损耗为35％以下，（4）压花率为40％以上。

6. 发明申请

US20070082962A1 Resin composition for foam molding, foam and method for producing the foam 审中-公开
标题翻译：泡沫塑料用树脂组合物，泡沫体及泡沫体的制造方法
公开(公告)号：US20070082962A1
公开(公告)日：2007-04-12
申请号：US10577345
申请日：2004-10-29
申请人： Koichi Kusakawa , Shigeki Ichimura
发明人： Koichi Kusakawa , Shigeki Ichimura
IPC分类号： B29C44/34 , C08F8/00
CPC分类号： C08J9/06 , C08J9/0061 , C08J2323/16 , C08J2423/00 , C08L23/02 , C08L23/16 , C08L2666/06
摘要： A resin composition for a foam is composed of a branched rubbery olefin based soft resin (C) obtained by kneading and reacting an organic peroxide crosslinking type olefin based copolymer rubber (A) and an organic peroxide decomposing type crystalline olefin resin (B), in which the organic peroxide crosslinking type olefin based copolymer rubber (A) is present as a continuous phase as well as the organic peroxide decomposing type crystalline olefin resin (B) is present as a discontinuous phase in its microaggregation structure. This resin composition enables to provide foamed articles which can be used for interior parts for automobiles, have high to low foaming magnifications and a recycling property, and are soft and excellent in cushion property, thermal insulating property and in-mold foam molding property.
摘要翻译：泡沫树脂组合物由有机过氧化物交联型烯烃系共聚物橡胶（A）和有机过氧化物分解型结晶性烯烃树脂（B）捏合和反应得到的支化橡胶系烯烃系软质树脂（C）作为连续相存在的有机过氧化物交联型烯烃系共聚物橡胶（A）以及有机过氧化物分解型结晶性烯烃树脂（B）在其微聚集结构中作为不连续相存在。该树脂组合物能够提供可用于汽车内部部件的发泡制品，具有高至低发泡倍率和再循环性能，并且柔软且具有优异的缓冲性能，隔热性和模内发泡成型性能。

7. 发明申请

US20130167927A1 BASE MATERIAL FOR SOLAR CELL MODULE AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：用于太阳能电池模块的基材及其制造方法
公开(公告)号：US20130167927A1
公开(公告)日：2013-07-04
申请号：US13821386
申请日：2011-09-07
申请人： Shigeki Ichimura , Taketoshi Iwasa
发明人： Shigeki Ichimura , Taketoshi Iwasa
IPC分类号： H01L51/44
CPC分类号： H01L51/448 , B32B17/10018 , B32B17/10788 , B32B2367/00 , C08J7/045 , C08J7/047 , C08J2300/22 , C08J2367/02 , C08J2431/04 , C08J2433/02 , C08J2483/02 , H01L31/049 , Y02E10/549 , Y02P70/521
摘要： A base material for a solar cell module includes a base material film including at least one layer and a coating layer including at least one layer and formed on one surface or both surfaces of the base material film. The coating layer is a copolymer layer obtained by curing a liquid coating film consisting of an acrylic-based resin component consisting of metal alkoxide having a first reactive functional group, an acrylic-based monomer having a second reactive functional group that reacts with the first reactive functional group, and an acrylic-based monomer without the second reactive functional group; and an ethylene-based resin component having a carboxyl group binding to the first reactive functional group of metal alkoxide and including an ethylene monomer, a vinyl acetate monomer, and a monomer of carboxylic acid vinyl esters other than vinyl acetate.
摘要翻译：太阳能电池模块的基材包括至少包含一层的基材薄膜和至少包含一层的涂层，并形成在基材薄膜的一个表面或两个表面上。涂层是通过固化由具有第一反应性官能团的金属醇盐组成的丙烯酸类树脂组分和具有与第一反应性官能团反应的第二反应性官能团的丙烯酸类单体组成的液体涂膜而获得的共聚物层官能团和不含第二反应性官能团的丙烯酸类单体; 以及具有与金属醇盐的第一反应性官能团结合的羧基的乙烯类树脂组分，并且包括乙烯单体，乙酸乙烯酯单体和除乙酸乙烯酯之外的羧酸乙烯酯的单体。

8. 发明申请

US20070298272A1 Gasket, Method For Producing The Gasket, And Gasket Installation Method 审中-公开
标题翻译：垫片，垫片的生产方法和垫片的安装方法
公开(公告)号：US20070298272A1
公开(公告)日：2007-12-27
申请号：US11631856
申请日：2005-07-08
申请人： Kouichi Kusakawa , Shigeki Ichimura , Taisuke Suwa
发明人： Kouichi Kusakawa , Shigeki Ichimura , Taisuke Suwa
IPC分类号： F16J15/00
CPC分类号： F16J15/108 , B29C45/14336 , B29C2045/14459 , B29L2031/265 , B29L2031/3431 , B29L2031/3437 , F16J15/104 , Y10T428/31909
摘要： Provided are a gasket that is less likely to deform and installable with excellent workability when it is installed at a portion to be sealed and that can be produced at low cost, a method of producing the gasket, and a gasket installation method. A previously prepared thermoplastic resin film with a predetermined shape is placed in a metal mold composed of a stationary side metal mold and a movable side metal mold. Then, thermoplastic elastomer as an elastic body is insert molded on the film by an injection molding machine to form a gasket. After the molding, the gasket is removed from the metal molds.
摘要翻译：本发明提供一种当安装在要密封的部分并且可以以低成本生产且垫圈的制造方法和垫圈安装方法时，不太可能变形和可安装并且具有优异的可加工性的垫圈。将预先制备的具有预定形状的热塑性树脂膜放置在由固定侧金属模和可动侧金属模构成的金属模中。然后，作为弹性体的热塑性弹性体通过注射成型机嵌入成型在膜上，形成垫圈。成型后，从金属模具中取出垫圈。

9. 发明授权

US06331729B1 Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them 失效
标题翻译：用于半导体封装的芯片支撑衬底，半导体器件及其制造方法
公开(公告)号：US06331729B1
公开(公告)日：2001-12-18
申请号：US09297296
申请日：1999-08-10
申请人： Masami Yusa , Toshihiko Kato , Fumio Inoue , Shigeki Ichimura
发明人： Masami Yusa , Toshihiko Kato , Fumio Inoue , Shigeki Ichimura
IPC分类号： H01L2340
CPC分类号： H01L23/3121 , H01L23/13 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.
摘要翻译：在本发明中，绝缘膜粘合剂材料以帐篷的形式附接到布线上，从而提供与通气孔连通的空的空间。使用该芯片支撑基板使得可以生产小型半导体封装，防止封装开裂并具有高可靠性，因为通气孔的功能不被损坏，并且还产生从绝缘膜产生的气体和水蒸汽在回流时的粘合剂材料可以在包装外确保地被驱除。

10. 发明授权

US6064111A Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package 失效
标题翻译：用于保持半导体封装芯片，半导体封装和半导体封装的制造工艺的衬底
公开(公告)号：US6064111A
公开(公告)日：2000-05-16
申请号：US903996
申请日：1997-07-31
申请人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
发明人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
IPC分类号： H01L23/02 , H01L23/498 , H01L23/495 , H01L21/44
CPC分类号： H01L23/4985 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/181
摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.
摘要翻译：本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。在绝缘支撑基板上的绝缘性支撑基板上形成有各自的配线的绝缘物的绝缘体上设置开口部，绝缘性支撑基板是设置有内部连接部的外部连接部的部分。绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

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