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1. 发明授权

US5685684A Vacuum processing system 失效
标题翻译：真空加工系统
公开(公告)号：US5685684A
公开(公告)日：1997-11-11
申请号：US612465
申请日：1996-03-07
申请人： Shigekazu Kato , Naoyuki Tamura , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou , Kenji Nakata , Yoshifumi Ogawa
发明人： Shigekazu Kato , Naoyuki Tamura , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou , Kenji Nakata , Yoshifumi Ogawa
IPC分类号： B65G49/07 , H01L21/677 , B65H5/08
CPC分类号： H01L21/67778 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A vacuum treating apparatus having a vacuum treating chamber for treating a to-be-treated substrate in vacuum, includes a plurality of substrate cassettes which are installed in the open air and hold substrates that are to be conveyed into the vacuum treating chamber, a device for conveying the substrates between the substrate cassettes and the vacuum treating chamber, and a device which selects either that the to-be-treated substrate after treated in the vacuum treating chamber be held in the substrate cassette from which the to-be-treated substrate was taken out or that the to-be-treated substrate after treated in the vacuum treating chamber be held in another substrate cassette which is different from the substrate cassette.
摘要翻译：一种具有真空处理室的真空处理装置，其特征在于，包括：多个基板盒，其安装在所述露天空间中并保持要被输送到所述真空处理室的基板;装置用于在基板盒和真空处理室之间输送基板，以及选择在真空处理室中处理后的被处理基板被保持在待处理基板的基板盒中的装置或将真空处理室中处理后的被处理基板保持在与基板盒不同的另一基板盒中。

2. 发明授权

US5673750A Vacuum processing method and apparatus 失效
标题翻译：真空加工方法及装置
公开(公告)号：US5673750A
公开(公告)日：1997-10-07
申请号：US460600
申请日：1995-06-02
申请人： Tsunehiko Tsubone , Naoyuki Tamura , Shigekazu Kato , Kouji Nishihata , Atsushi Itou
发明人： Tsunehiko Tsubone , Naoyuki Tamura , Shigekazu Kato , Kouji Nishihata , Atsushi Itou
IPC分类号： C23C14/50 , C23C14/54 , C23C16/458 , C30B33/00 , H01L21/00 , F28F27/00
CPC分类号： C23C16/466 , C23C14/50 , C23C14/541 , C23C16/4583 , C23C16/4586 , C30B33/00 , H01L21/67103
摘要： This invention relates to a vacuum processing method and apparatus. When a sample is plasma processed under a reduced pressure, a sample bed is cooled by a cooling medium kept at a predetermined temperature lower than an etching temperature, the sample is held on the sample bed, a heat transfer gas is supplied between the back of the sample and the sample installation surface of the sample bed, and the pressure of the heat transfer gas is controlled so as to bring the sample to a predetermined processing temperature. Before the step of holding the sample on the sample bed and supplying the heat transfer gas, heat transfer gas remaining upstream and downstream of the flow rate regulator in the supply line for the heat transfer gas is vacuum exhausted. This is accomplished using a bypass line connected upstream and downstream of the flow rate regulator and an arrangement of appropriate valves.
摘要翻译：本发明涉及一种真空处理方法和装置。当样品在减压下进行等离子体处理时，样品床被保持在比蚀刻温度低的预定温度的冷却介质冷却，样品被保持在样品床上，传热气体在样品床的样品和样品安装表面以及传热气体的压力被控制以使样品达到预定的处理温度。在将样品保持在样品床上并供给传热气体的步骤之前，用于传热气体的供给管线中的流量调节器的上游和下游的传热气体被真空排空。这是使用连接在流量调节器的上游和下游的旁路管线和适当的阀的布置来实现的。

3. 发明授权

US5663884A Multiprocessing apparatus 失效
标题翻译：多处理装置
公开(公告)号：US5663884A
公开(公告)日：1997-09-02
申请号：US461523
申请日：1995-06-05
申请人： Kouji Nishihata , Naoyuki Tamura , Shigekazu Kato , Atsushi Itou , Tsunehiko Tsubone
发明人： Kouji Nishihata , Naoyuki Tamura , Shigekazu Kato , Atsushi Itou , Tsunehiko Tsubone
IPC分类号： G05B15/02 , G05B19/418 , H01L21/677 , G06F17/00
CPC分类号： G05B19/4184 , G05B19/41845 , G05B2219/31361 , G05B2219/31362 , G05B2219/35291 , G05B2219/45026 , Y02P90/14 , Y02P90/16 , Y10S414/135 , Y10S414/139 , Y10S414/14
摘要： A multiprocessing apparatus has a plurality of process processors connected to a carrier processor and controlled by a control system, wherein the apparatus includes connection information signal generating means for generating a connection information signal expressing information of connection of the plurality of process processors to the carrier processor, switching means for generating a registration information signal expressing information of registration of connection of the plurality of process processors to the carrier processor, and control means for carrying out a control process while logically judging a matching state between the connected process processors and the registered process processors by reference to the connection information and the registration information. Thus, it is possible to provide a multiprocessing apparatus in which process processors to be connected to the carrier processor can be increased or decreased in number easily and securely.
摘要翻译：多处理装置具有连接到载波处理器并由控制系统控制的多个处理处理器，其中该装置包括连接信息信号产生装置，用于产生表示多个处理处理器连接到载波处理器的信息的连接信息信号用于产生表示多个处理处理器的连接登记信息到载波处理器的登记信息信号的切换装置，以及用于在逻辑判断连接的处理处理器之间的匹配状态和登记处理的同时执行控制处理的控制装置处理器参考连接信息和注册信息。因此，可以提供一种可以容易且可靠地增加或减少要连接到载波处理器的处理器的多处理装置。

4. 发明授权

US5445484A Vacuum processing system 失效
标题翻译：真空加工系统
公开(公告)号：US5445484A
公开(公告)日：1995-08-29
申请号：US131911
申请日：1993-10-04
申请人： Shigekazu Kato , Naoyuki Tamura , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
发明人： Shigekazu Kato , Naoyuki Tamura , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
IPC分类号： B01J3/02 , B65G49/07 , H01L21/677 , B65G49/05
CPC分类号： H01L21/67778 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A vacuum processing system of a type in which wafer cassettes each accommodating a plurality of wafers to be treated are supplied to deliver the wafers and wafer cassettes collecting the treated wafers are taken out. To enable the vacuum treatment, the vacuum processing system has a structure comprising:a plurality of wafer cassettes each being set in the atmospheric air and holding a plurality of wafers to be treated; at least one vacuum processing chamber for effecting vacuum treatment on the wafers; at least one load-lock chamber disposed between the cassettes and the vacuum processing chamber, the wafers being transferred into and out of vacuum atmosphere in the vacuum processing chamber through the load-lock chamber; and a wafer transfer device for transferring the wafers from each of the cassettes to the load-lock chamber and vice versa. The wafer cassettes are arranged on a substantially horizontal flat surface with respect to each other and each of the cassettes has two upper and lower stationary positions, and the transference of the wafers from and into each of the cassettes is conducted at one of the upper and lower stationary positions.
摘要翻译：提供一种类型的真空处理系统，其中提供各自容纳待处理的多个晶片的晶片盒以传送晶片，并且收集经处理的晶片的晶片盒被取出。为了进行真空处理，真空处理系统具有如下结构：多个晶片盒分别设置在大气中并保持待处理的多个晶片; 至少一个用于对所述晶片进行真空处理的真空处理室; 设置在盒和真空处理室之间的至少一个装载锁定室，所述晶片通过所述装载锁定室转移到所述真空处理室中的真空气氛中并从所述真空处理室中排出; 以及用于将晶片从每个盒传送到装载锁定室的晶片传送装置，反之亦然。晶片盒相对于彼此布置在基本水平的平坦表面上，并且每个盒具有两个上部和下部固定位置，并且每个盒的晶片从每个盒的转移在上部和下部的一个处进行较低的固定位置。

5. 发明授权

US5078851A Low-temperature plasma processor 失效
标题翻译：低温等离子体处理器
公开(公告)号：US5078851A
公开(公告)日：1992-01-07
申请号：US556449
申请日：1990-07-24
申请人： Kouji Nishihata , Shigekazu Kato , Atsushi Itou , Tsunehiko Tsubone , Naoyuki Tamura
发明人： Kouji Nishihata , Shigekazu Kato , Atsushi Itou , Tsunehiko Tsubone , Naoyuki Tamura
IPC分类号： C23C16/448 , C23C16/509 , C23C16/511 , H01J37/32 , H01L21/00
CPC分类号： H01L21/67103 , C23C16/448 , C23C16/509 , C23C16/511 , H01J37/32192 , H01J2237/2001
摘要： The present invention relates to a plasma processor in which a sample such as semiconductor substrate is processed with a plasma under a cooled state. An electric insulator is interposed between a sample holder for arranging the sample thereon and a cooling container for cooling the sample holder, so as to electrically insulate them, whereby a bias voltage applied to the sample holder and a voltage for generating the plasma can be prevented from leaking, so as to stabilize the process. In addition, the insulator is held in close contact with the sample holder and the cooling container through members of a thermal conductor, whereby the occurrence of non-uniformity during the processing of the sample and the occurrence of a dispersion in the qualities of processed samples among sample lots or among processors can be suppressed.

6. 发明授权

US5448470A Multiprocessing apparatus 失效
标题翻译：多处理装置
公开(公告)号：US5448470A
公开(公告)日：1995-09-05
申请号：US941905
申请日：1992-09-08
申请人： Kouji Nishihata , Naoyuki Tamura , Shigekazu Kato , Atsushi Itou , Tsunehiko Tsubone
发明人： Kouji Nishihata , Naoyuki Tamura , Shigekazu Kato , Atsushi Itou , Tsunehiko Tsubone
IPC分类号： G05B15/02 , G05B19/418 , H01L21/677 , G06F15/46
CPC分类号： G05B19/4184 , G05B19/41845 , G05B2219/31361 , G05B2219/31362 , G05B2219/35291 , G05B2219/45026 , Y02P90/14 , Y02P90/16 , Y10S414/135 , Y10S414/139 , Y10S414/14
摘要： A multiprocessing apparatus has a plurality of process processors connected to a carrier processor and controlled by a control system, wherein there are provided connection information signal generating means for generating a connection information signal expressing information of connection of the plurality of process processors to the carrier processor; switching means for generating a registration information signal expressing information of registration of connection of the plurality of process processors to the carrier processor; and control means for carrying out a control process while logically judging a matching state between the connected process processors and the registered process processors by reference to the connection information and the registration information. Thus, it is possible to provide a multiprocessing apparatus in which the number of process processors to be connected to the carrier processor can be securely increased or decreased.
摘要翻译：多处理装置具有连接到载波处理器并由控制系统控制的多个处理处理器，其中提供有连接信息信号产生装置，用于产生表示多个处理处理器连接到载波处理器的信息的连接信息信号 ; 切换装置，用于产生表示将多个处理处理器的连接登记到载波处理器的信息的登记信息信号; 以及控制装置，用于通过参考连接信息和注册信息逻辑地判断连接的处理处理器和注册的处理处理器之间的匹配状态来执行控制处理。因此，可以提供一种可以可靠地增加或减少要连接到载波处理器的处理器的数量的多处理装置。

7. 发明授权

US5320982A Wafer cooling method and apparatus 失效
标题翻译：晶圆冷却方法和装置
公开(公告)号：US5320982A
公开(公告)日：1994-06-14
申请号：US724801
申请日：1991-07-02
申请人： Tsunehiko Tsubone , Naoyuki Tamura , Shigekazu Kato , Kouji Nishihata , Atsushi Itou
发明人： Tsunehiko Tsubone , Naoyuki Tamura , Shigekazu Kato , Kouji Nishihata , Atsushi Itou
IPC分类号： C23C14/50 , C23C14/54 , C23C16/458 , C30B33/00 , H01L21/00 , H01L21/465
CPC分类号： C23C16/466 , C23C14/50 , C23C14/541 , C23C16/4583 , C23C16/4586 , C30B33/00 , H01L21/67103 , H01L21/67109 , Y10T279/23
摘要： This invention relates to a vacuum processing method and apparatus. When a sample is plasma-processed under a reduced pressure, a sample bed is cooled by a cooling medium kept at a predetermined temperature lower than an etching temperature, the sample is held on the sample bed, a heat transfer gas is supplied between the back of the sample and the sample installation surface of the sample bed, and the pressure of the heat transfer gas is controlled so as to bring the sample to a predetermined processing temperature. In this way, a sample temperature can be regulated rapidly without increasing the scale of the apparatus.
摘要翻译：本发明涉及一种真空处理方法和装置。当样品在减压下进行等离子体处理时，样品床被保持在低于蚀刻温度的预定温度的冷却介质冷却，将样品保持在样品床上，在后面提供传热气体的样品和样品安装表面，并且控制传热气体的压力以使样品达到预定的处理温度。以这种方式，可以快速调节样品温度，而不会增加设备的规模。

8. 发明授权

US07089680B1 Vacuum processing apparatus and operating method therefor 失效
标题翻译：真空处理装置及其操作方法
公开(公告)号：US07089680B1
公开(公告)日：2006-08-15
申请号：US09766596
申请日：2001-01-23
申请人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
发明人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
IPC分类号： F26R13/30
CPC分类号： H01L21/67748 , B41J2/36 , B41J2/365 , C23C14/564 , H01L21/67028 , H01L21/67167 , H01L21/67253 , Y10S134/902 , Y10S414/139 , Y10S414/14
摘要： A vacuum processing apparatus which includes a means for transferring substrates from a loader, with a transferring device, to a double lock chamber; and, then to a selected vacuum processing chamber. The substrates are returned to a substrate, by the vacuum loader, into their original position in the substrate table. The surfaces of the substrates are maintained in a horizontal position during processing.
摘要翻译：一种真空处理装置，包括用于将基板从装载器与转印装置传送到双重锁定室的装置; 然后到选定的真空处理室。基板通过真空装载机返回到基板到基板台中的原始位置。在处理期间，基板的表面保持在水平位置。

9. 发明申请

US20060032073A1 Vacuum processing apparatus and operating method therefor 失效
公开(公告)号：US20060032073A1
公开(公告)日：2006-02-16
申请号：US11204171
申请日：2005-08-16
申请人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
发明人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
IPC分类号： F26B13/30 , F26B5/04
CPC分类号： H01L21/67748 , B01J3/006 , B41J2/36 , B41J2/365 , C23C14/564 , H01L21/67028 , H01L21/67167 , H01L21/67253 , H01L21/67736 , Y10S134/902 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

10. 发明授权

US06968630B2 Vacuum processing apparatus and operating method therefor 失效
公开(公告)号：US06968630B2
公开(公告)日：2005-11-29
申请号：US10796195
申请日：2004-03-10
申请人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
发明人： Shigekazu Kato , Kouji Nishihata , Tsunehiko Tsubone , Atsushi Itou
IPC分类号： B01J3/00 , B41J2/36 , B41J2/365 , C23C14/56 , H01L21/00 , H01L21/677 , F26B5/04
CPC分类号： H01L21/67748 , B01J3/006 , B41J2/36 , B41J2/365 , C23C14/564 , H01L21/67028 , H01L21/67167 , H01L21/67253 , H01L21/67736 , Y10S134/902 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

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