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    • 10. 发明授权
    • Cu—Mg—P based copper alloy material and method of producing the same
    • Cu-Mg-P系铜合金材料及其制造方法
    • US09255310B2
    • 2016-02-09
    • US12801359
    • 2010-06-04
    • Takeshi SakuraiYoshihiro KameyamaYoshio Abe
    • Takeshi SakuraiYoshihiro KameyamaYoshio Abe
    • C22C9/00H01B5/02C22F1/08
    • C22C9/00C22F1/08
    • A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.
    • 铜合金材料以质量%计含有0.3〜2%的Mg,0.001〜0.1%的P,余量包含Cu和不可避免的杂质。 在每个晶粒中的所有像素之间的平均取向度小于4°的这种晶粒的面积分数是测量面积的45至55%,当铜的表面的测量区域中的所有像素的取向 合金材料通过电子背散射衍射图像系统的扫描电子显微镜和相邻像素之间的取向偏差为5°以上的边界的EBSD法测定为晶界,拉伸强度为641〜 708N / mm2,弯曲弹性极限值为472〜503N / mm2。