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    • 4. 发明授权
    • Etching apparatus
    • 蚀刻装置
    • US06569282B1
    • 2003-05-27
    • US09641560
    • 2000-08-18
    • Shigeharu Arisa
    • Shigeharu Arisa
    • C23F100
    • H01L21/67207H01L21/6708H01L21/67132
    • A wafer is supplied from a wafer cassette to an etching part by a wafer transport robot so as to be etched. After the etching process, a wafer frame is supplied from a wafer frame supply part to a mount part. The mount part to which the wafer frame is supplied moves to the upper part of a processing vessel of the etching part, and mounts the wafer at that position. After that, the mount part returns to its original position. A wafer frame collecting robot collects the wafer frame from the mount part that has returned to its original position, and stores the wafer frame in the wafer frame cassette.
    • 通过晶片传送机器人将晶片从晶片盒提供到蚀刻部分以被蚀刻。 在蚀刻处理之后,将晶片框从晶片框架供给部供给到安装部。 提供晶片框架的安装部分移动到蚀刻部分的处理容器的上部,并将晶片安装在该位置。 之后,安装部分返回到其原始位置。 晶片框架收集机器人从已经返回其初始位置的安装部分收集晶片框架,并将晶片框架存储在晶片框架盒中。