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1. 发明授权

US08345444B2 Structure with electronic component mounted therein and method for manufacturing such structure 有权
标题翻译：安装有电子部件的结构及其制造方法
公开(公告)号：US08345444B2
公开(公告)日：2013-01-01
申请号：US12675080
申请日：2008-10-21
申请人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
发明人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
IPC分类号： H05K1/11
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译：安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔对应于电子部件的安装位置。孔用树脂填充。这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。

2. 发明申请

US20100224398A1 MOUNTING STRUCTURE 有权
标题翻译：安装结构
公开(公告)号：US20100224398A1
公开(公告)日：2010-09-09
申请号：US12738430
申请日：2008-10-16
申请人： Koso Matsuno , Atsushi Yamaguchi , Shigeaki Sakatani , Hidenori Miyakawa , Mikiya Ueda
发明人： Koso Matsuno , Atsushi Yamaguchi , Shigeaki Sakatani , Hidenori Miyakawa , Mikiya Ueda
IPC分类号： H05K1/18
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译：为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。底部填充树脂几乎不扩展到半导体元件外部的区域。

3. 发明授权

US08378472B2 Mounting structure for semiconductor element with underfill resin 有权
标题翻译：带底部填充树脂的半导体元件的安装结构
公开(公告)号：US08378472B2
公开(公告)日：2013-02-19
申请号：US12738430
申请日：2008-10-16
申请人： Koso Matsuno , Atsushi Yamaguchi , Shigeaki Sakatani , Hidenori Miyakawa , Mikiya Ueda
发明人： Koso Matsuno , Atsushi Yamaguchi , Shigeaki Sakatani , Hidenori Miyakawa , Mikiya Ueda
IPC分类号： H01L23/22
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译：为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。底部填充树脂几乎不扩展到半导体元件外部的区域。

4. 发明申请

US20110110050A1 STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH STRUCTURE 有权
标题翻译：电子元件安装结构及其制造方法
公开(公告)号：US20110110050A1
公开(公告)日：2011-05-12
申请号：US12675080
申请日：2008-10-21
申请人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
发明人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
IPC分类号： H05K7/00 , H05K3/30 , H05K1/16 , H05K1/00
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译：安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线基板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔对应于电子部件的安装位置。孔用树脂填充。这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。

5. 发明授权

US6126106A Cassette adapter and magnetic recording/reproduction apparatus 失效
标题翻译：盒式适配器和磁记录/再现设备
公开(公告)号：US6126106A
公开(公告)日：2000-10-03
申请号：US270758
申请日：1999-03-17
申请人： Mikiya Ueda
发明人： Mikiya Ueda
IPC分类号： G11B23/087 , G11B25/06 , G11B23/04 , G11B15/00
CPC分类号： G11B25/066 , G11B23/08714
摘要： A casette adapter in which an S-casette (first casette) of the professional digital video format is housed and having a shape identical with an different-sized M-casette (second casette) operates without fail under a simple constitution, without accompanying any fear of damage on a tape. The casette adapter capable of housing an S-casette (2) comprises an adapter (1) whose shape is identical to an different-sized M-casette. Reels (5, 6) and a reel brake releasing member (7) of the S-casette (2) are exposed while the S-casette is mounted in the casette adapter. The adaptor (1) includes a rear door (12) capable of opening and closing. The rear door (12) comprises contacts (14) for reading identification signal by contacting the identification terminal of S-casette, wirings (16) for coupling the contacts (14) with an identification terminal (15) provided in a same location as that of M-casette and a lever (18) for opening/closing an anti-erasing window in linkage with the anti-erasing gear of S-casette (2). A device for distinguishing the adapter from the M cassette and for preventing further insertion of the adapter.
摘要翻译：一种盒式适配器，其中容纳专业数字视频格式的S形盒（第一盒），并且具有与不同尺寸的M形盒（第二盒）相同的形状，在简单的构成下无故操作，而不伴随任何恐惧在磁带上的损坏。能够容纳S型盒（2）的盒式适配器包括其形状与不同尺寸的M型盒相同的适配器（1）。 S型盒（2）中的卷轴（5,6）和卷线器制动器释放构件（7）暴露，而S型盒安装在盒式适配器中。适配器（1）包括能够打开和关闭的后门（12）。后门（12）包括接触件（14），用于通过接触S型盒的识别端子来读取识别信号，用于将触点（14）耦合到与位于相同位置的识别端子（15）的布线（16）和用于打开/关闭与S形盒（2）的防擦除齿轮联动的防擦除窗口的杠杆（18）。用于将适配器与M盒区分开并用于防止适配器进一步插入的装置。

6. 发明授权

US07236371B2 PC card 有权
标题翻译： PC卡
公开(公告)号：US07236371B2
公开(公告)日：2007-06-26
申请号：US10566678
申请日：2004-08-25
申请人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
发明人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
IPC分类号： H05K7/02
CPC分类号： H05K5/0269
摘要： In a PC card incorporating a printed board, an electronic component having a greater height can be mounted on the printed board without reducing the strength of a cover. The PC card includes a cover member (1) and a main cover (2) at least one of which is formed with at least one opening (2a) for prevention of interference with an electronic component (4), and a plate member (8) closing the opening from the outside of the cover member or the main cover. An outer surface of the plate member (8) is located at substantially the same level as an outer surface of the cover member (1) or the main cover (2), and the plate member (8) has a smaller thickness than the cover member and the main cover. This arrangement increases the strength of the cover.
摘要翻译：在包含印刷电路板的PC卡中，具有较大高度的电子部件可以安装在印刷电路板上，而不会降低盖子的强度。 PC卡包括盖构件（1）和主盖（2），其中至少一个形成有至少一个开口（2a），用于防止与电子部件（4）的干涉，以及板构件 8）从盖构件或主盖的外部封闭开口。板构件（8）的外表面位于与盖构件（1）或主盖（2）的外表面大致相同的高度，并且板构件（8）的厚度小于盖会员和主盖。这种布置增加了盖的强度。

7. 发明授权

US5934591A Cassette adapter and magnetic recording/reproduction apparatus 失效
标题翻译：盒式适配器和磁记录/再现设备
公开(公告)号：US5934591A
公开(公告)日：1999-08-10
申请号：US836639
申请日：1997-08-04
申请人： Mikiya Ueda
发明人： Mikiya Ueda
IPC分类号： G11B23/087 , G11B25/06 , G11B23/04 , G11B5/008
CPC分类号： G11B25/066 , G11B23/08714
摘要： A casette adapter in which an S-casette (first casette) of the professional digital video format is housed and having a shape identical with an different-sized M-casette (second casette) operates without fail under a simple constitution, without accompanying any fear of damage on a tape. The casette adapter capable of housing an S-casette (2) comprises an adapter (1) whose shape is identical to an different-sized M-casette. Reels (5, 6) and a reel brake releasing member (7) of the S-casette (2) are exposed while the S-casette is mounted in the casette adapter. The adaptor (1) includes a rear door (12) capable of opening and closing. The rear door (12) comprises contacts (14) for reading identification signal by contacting the identification terminal of S-casette, wirings (16) for coupling the contacts (14) with an identification terminal (15) provided in a same location as that of M-casette and a lever (18) for opening/closing an anti-erasing window in linkage with the anti-erasing gear of S-casette (2).
摘要翻译： PCT No.PCT / JP96 / 02788 Sec。 371日期：1997年8月4日 102（e）日期1997年8月4日PCT PCT 1996年9月26日PCT公布。出版物WO97 / 12364 日期1997年04月3日一种盒式适配器，其中容纳专业数字视频格式的S盒（第一盒），并且具有与不同尺寸的M盒（第二盒）相同的形状，在简单的结构下运行，而不用担心在磁带上损坏。能够容纳S型盒（2）的盒式适配器包括其形状与不同尺寸的M型盒相同的适配器（1）。 S型盒（2）中的卷轴（5,6）和卷线器制动器释放构件（7）暴露，而S型盒安装在盒式适配器中。适配器（1）包括能够打开和关闭的后门（12）。后门（12）包括接触件（14），用于通过接触S型盒的识别端子来读取识别信号，用于将触点（14）耦合到与位于相同位置的识别端子（15）的布线（16）和用于打开/关闭与S形盒（2）的防擦除齿轮联动的防擦除窗口的杠杆（18）。

8. 发明授权

US07258577B2 Memory pack 失效
标题翻译：内存包
公开(公告)号：US07258577B2
公开(公告)日：2007-08-21
申请号：US10571072
申请日：2004-09-06
申请人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
发明人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
IPC分类号： H01R24/00
CPC分类号： G06K7/0047 , G06K7/0021 , G06K7/0034 , G06K19/07732 , G06K19/07741
摘要： The present invention provides a thin connector in which contacts to be brought into contact with terminals of a memory card are less liable to be deformed when the connector is assembled or an external force is exerted on the connector. The contacts (4) are located at a lower level than upper surfaces of protective projections (3a), and distal ends of the contacts (4) are located at a higher level than lower surfaces of the protective projections (3a). This prevents the deformation of the contacts, and allows the connector to have a smaller thickness. Further, the contacts are located at a lower level than the upper surfaces of the protective projections when the protective projections are deformed to be brought into contact with bottom portions of recesses of the memory card. Thus, the contacts are less liable to be deformed by an external force.
摘要翻译：本发明提供了一种薄型连接器，其中当连接器组装或外部力施加在连接器上时，与存储卡的端子接触的触点不易变形。触点（4）位于比保护突起（3a）的上表面更低的水平处，并且触头（4）的远端位于比保护突起（3a）的下表面更高的高度。这防止了触点的变形，并且允许连接器具有较小的厚度。此外，当保护突起变形以与存储卡的凹部的底部接触时，触头位于比保护突起的上表面更低的水平处。因此，触点不容易被外力变形。

9. 发明授权

US07401739B2 Case for card-type portable information processing device 有权
标题翻译：卡式便携式信息处理设备案例
公开(公告)号：US07401739B2
公开(公告)日：2008-07-22
申请号：US10559103
申请日：2005-04-06
申请人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
发明人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
IPC分类号： G06K7/00
CPC分类号： G06K13/0843 , A45C11/18 , A45C2011/188
摘要： An inventive card-type portable information processing device case permits a user to select a mode in which a card-type portable information processing device is taken out of the case with a cap attached thereto or a mode in which the card-type portable information processing device is taken out of the case with the cap detached therefrom and engaged with the first cover. The inventive case includes a cap engagement portion (15) provided in a first cover (1). By moving the card-type portable information processing device (30) in a direction A, the card-type portable information processing device (30) is taken out of the case with the cap (40) attached thereto. By moving the card-type portable information processing device (30) in a direction C, only the card-type portable information processing device (30) is taken out of the case with the cap (40) engaged in the cap engagement portion (15) of the first cover (1).
摘要翻译：本发明的卡式便携式信息处理装置的情况允许用户选择一种模式，其中卡式便携式信息处理装置从附着有帽的外壳中取出，或者卡式便携式信息处理将设备从外壳上取下并将盖与第一盖接合。本发明的壳体包括设置在第一盖（1）中的盖接合部（15）。通过沿方向A移动卡型便携式信息处理装置（30），卡式便携式信息处理装置（30）从安装有盖（40）的情况下取出。通过将卡式便携式信息处理装置（30）沿着方向C移动，只有卡式便携式信息处理装置（30）从盖接合部（15）中的盖（40）被取出，）的第一盖（1）。

10. 发明申请

US20070004281A1 Memory pack 失效
公开(公告)号：US20070004281A1
公开(公告)日：2007-01-04
申请号：US10571072
申请日：2004-09-06
申请人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
发明人： Chikanori Miyawaki , Mikiya Ueda , Yoshiaki Akutagawa
IPC分类号： H01R13/648
CPC分类号： G06K7/0047 , G06K7/0021 , G06K7/0034 , G06K19/07732 , G06K19/07741
摘要： The present invention provides a thin connector in which contacts to be brought into contact with terminals of a memory card are less liable to be deformed when the connector is assembled or an external force is exerted on the connector. The contacts (4) are located at a lower level than upper surfaces of protective projections (3a), and distal ends of the contacts (4) are located at a higher level than lower surfaces of the protective projections (3a). This prevents the deformation of the contacts, and allows the connector to have a smaller thickness. Further, the contacts are located at a lower level than the upper surfaces of the protective projections when the protective projections are deformed to be brought into contact with bottom portions of recesses of the memory card. Thus, the contacts are less liable to be deformed by an external force.

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