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1. 发明专利

JP2009182962A Housing, method of manufacturing housing, and electronic apparatus using the same 审中-公开
标题翻译：住房，制造住房的方法和使用该住房的电子设备
公开(公告)号：JP2009182962A
公开(公告)日：2009-08-13
申请号：JP2009008213
申请日：2009-01-16
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , H01Q1/24 , H01Q1/42 , H05K1/16 , H05K3/00 , H05K3/12 , H05K3/28
CPC分类号： H01Q1/243 , H01Q1/40
摘要： PROBLEM TO BE SOLVED: To provide a housing which has a simple structure, a small volume and an antenna installed inside, and to provide a method of manufacturing the housing and an electronic device using the same.
SOLUTION: The housing includes a thin film layer, a substrate layer, and an antenna. The substrate layer is connected with the film layer by injection molding. The antenna is a conductive ink coating formed on the film layer. The film layer includes a first surface and a second surface opposite each other. On the second surface, an antenna connecting part is formed, and the antenna is formed at the antenna connecting part.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种外壳结构简单，体积小，安装在内部的天线，并提供一种制造外壳的方法和使用该外壳的电子设备。解决方案：壳体包括薄膜层，基底层和天线。衬底层通过注射成型与膜层连接。天线是形成在薄膜层上的导电油墨涂层。膜层包括彼此相对的第一表面和第二表面。在第二表面上形成天线连接部，天线形成于天线连接部。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009182960A Housing, method of manufacturing housing, and electronic apparatus using the same 审中-公开
标题翻译：住房，制造住房的方法和使用该住房的电子设备
公开(公告)号：JP2009182960A
公开(公告)日：2009-08-13
申请号：JP2009007008
申请日：2009-01-15
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , B29C45/17 , H01Q1/24 , H04M1/02
CPC分类号： H01Q1/40 , H01Q1/243 , H05K1/0284 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a housing which has a simple structure, a small volume and an antenna pattern installed inside, and to provide a method of manufacturing the housing and an electronic apparatus using the same.
SOLUTION: The housing includes a substrate layer and an antenna installed to the substrate layer. The antenna is a metal layer formed on the substrate layer by electroplating.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种外壳，其具有简单的结构，小体积和安装在内部的天线图案，并提供一种制造外壳的方法和使用该外壳的电子设备。解决方案：壳体包括衬底层和安装到衬底层的天线。天线是通过电镀在基底层上形成的金属层。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2010041052A Housing and method of manufacturing the same 审中-公开
标题翻译：住房及其制造方法
公开(公告)号：JP2010041052A
公开(公告)日：2010-02-18
申请号：JP2009179138
申请日：2009-07-31
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： CHO HEI , ZENG YI-PING
IPC分类号： H05K5/02
CPC分类号： C08J7/04 , H05K5/0243 , Y10T428/1352
摘要： PROBLEM TO BE SOLVED: To provide a housing having a pattern or a trade mark to be hardly worn or dropped off, and to provide a method of manufacturing the same. SOLUTION: The housing 10 includes a transparent substrate 11, a decoration layer 13 formed on the transparent substrate, and a transparent protection layer 15 formed on the decoration layer. The decoration layer has a void pattern 131 formed. A color ink layer 17 is printed on the surface of the transparent substrate opposite to the surface with the decoration layer formed. The manufacturing method of the housing includes a step of providing a transparent substrate, a step of forming a decoration layer on the transparent substrate, a step of forming a transparent protection layer on the decoration layer, a step of forming a pattern in the decoration layer, and a step of printing a color ink layer on the surface of the transparent substrate opposite to the surface with the decoration layer formed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种难以磨损或脱落的图案或商标的壳体，并提供其制造方法。解决方案：壳体10包括透明基板11，形成在透明基板上的装饰层13和形成在装饰层上的透明保护层15。装饰层具有形成的空隙图案131。在与形成有装饰层的表面相对的透明基板的表面上印刷彩色墨层17。壳体的制造方法包括提供透明基板的步骤，在透明基板上形成装饰层的步骤，在装饰层上形成透明保护层的步骤，在装饰层中形成图案的步骤以及在形成有装饰层的与表面相对的透明基板的表面上印刷彩色油墨层的步骤。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009207126A Housing, method for manufacturing housing, and electronic apparatus using housing 审中-公开
标题翻译：住房，制造住房的方法和使用住房的电子设备
公开(公告)号：JP2009207126A
公开(公告)日：2009-09-10
申请号：JP2009008211
申请日：2009-01-16
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , H01Q1/24
CPC分类号： H01Q1/40 , H01Q1/243 , H05K1/0284 , H05K3/146
摘要： PROBLEM TO BE SOLVED: To provide a housing having a simple structure and small volume and including an antenna installed in the inside of the housing, and to provide a method for manufacturing the housing and an electronic apparatus using the housing.
SOLUTION: The housing includes a base layer and an antenna formed on the base layer, and the antenna is a metallic layer formed by a vacuum deposition method. The base layer is a plastic layer formed by an injection molding method, and a material of the base layer is an optional sort out of polyethylene, polyamide, polycarbonate, an acrylonitrile butadiene styrene copolymer, polymethacrylic acid methyl, and polyethylene terephthalate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种结构简单，体积小，并且包括安装在壳体内部的天线，并且提供一种制造壳体的方法和使用该壳体的电子设备。解决方案：壳体包括基底层和形成在基底层上的天线，天线是通过真空沉积方法形成的金属层。基层是通过注射成型法形成的塑料层，基层的材料是聚乙烯，聚酰胺，聚碳酸酯，丙烯腈丁二烯苯乙烯共聚物，聚甲基丙烯酸甲酯和聚对苯二甲酸乙二醇酯中的任意一种。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009182961A Housing, method of manufacturing housing, and electronic apparatus using the same 审中-公开
标题翻译：住房，制造住房的方法和使用该住房的电子设备
公开(公告)号：JP2009182961A
公开(公告)日：2009-08-13
申请号：JP2009008212
申请日：2009-01-16
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , H01Q1/24
CPC分类号： H01Q1/243 , H01Q1/40
摘要： PROBLEM TO BE SOLVED: To provide a housing which has a simple structure, a small volume and an antenna installed inside, and to provide a method of manufacturing the housing and an electronic apparatus using the same.
SOLUTION: The housing 11 includes a substrate layer 111 and an antenna 113 formed on the substrate layer. The antenna pattern is a conductive paint layer. The manufacturing method includes a step of providing the substrate layer, and a step of forming the antenna by spray-painting a conductive paint to the substrate layer. The electronic apparatus includes a body for housing a circuit board on which a conductive terminal is installed and a housing provided with the substrate layer and the antenna formed on the substrate layer.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种外壳结构简单，体积小，安装在内部的天线，并提供一种制造外壳的方法和使用该外壳的电子设备。解决方案：壳体11包括形成在基底层上的基底层111和天线113。天线图案是导电漆层。该制造方法包括提供衬底层的步骤，以及通过将导电涂料喷涂到衬底层来形成天线的步骤。该电子设备包括一个用于容纳其上安装有导电端子的电路板的主体和设置有基板层的壳体和形成在基板层上的天线。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2010042675A Method for making pattern on housing 审中-公开
标题翻译：用于制作住房图案的方法
公开(公告)号：JP2010042675A
公开(公告)日：2010-02-25
申请号：JP2009187812
申请日：2009-08-13
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： CHO HEI , ZENG YI-PING
IPC分类号： B41M5/382
CPC分类号： B44C1/228
摘要： PROBLEM TO BE SOLVED: To provide a method for swiftly making a pattern with a metallic appearance on a housing. SOLUTION: The method comprises: a step where a substrate is provided; a step where a metal film is formed on the surface of the substrate; a step where the metal film and the substrate located at the lower part of the metal film are heated and bonded; and a step where, in the metal film, the region not heated and bonded in the substrate is removed. In the heating-bonding step, a laser light source is outputted, and a laser beam from the laser light source is irradiated, thus the substrate and the metal film are heated and bonded, and in the removing step, the region not irradiated by the laser is removed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在壳体上快速制造具有金属外观的图案的方法。解决方案：该方法包括：提供衬底的步骤; 在基板的表面上形成金属膜的工序; 将金属膜和位于金属膜下部的基板加热粘接的工序; 并且在金属膜中去除在基板中未被加热和结合的区域的步骤。在加热接合步骤中，输出激光源，照射来自激光光源的激光束，从而对基板和金属膜进行加热接合，在除去工序中，激光被去除。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009207125A Housing, method for manufacturing housing and electronic apparatus using housing 审中-公开
标题翻译：住房，使用住房制造住房和电子设备的方法
公开(公告)号：JP2009207125A
公开(公告)日：2009-09-10
申请号：JP2009007007
申请日：2009-01-15
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , H01P11/00 , H01Q1/24
CPC分类号： H01Q1/243 , H01Q1/40 , H05K1/0284 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a housing having a simple structure and a small volume and including an antenna installed in the inside of the housing, and to provide a method for manufacturing the housing and an electronic apparatus using the housing. SOLUTION: The housing 11 includes a base layer 111 and an antenna 113 formed on the base layer 111. The antenna 113 is a conductive ink layer. The manufacturing method of the housing 11 is provided with a step for providing the base layer 111 and a step for forming the antenna by printing conductive ink on the base layer 111. The electronic apparatus is provided with a body for storing a circuit board on which a conductive terminal is formed and the housing comprising the base layer and the antenna formed on the base layer. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有简单结构和小体积的壳体，并且包括安装在壳体内部的天线，并且提供一种制造壳体的方法和使用该壳体的电子设备。解决方案：壳体11包括形成在基底层111上的基底层111和天线113.天线113是导电油墨层。壳体11的制造方法具有提供基底层111的步骤和通过在基底层111上印刷导电油墨而形成天线的步骤。电子设备设置有用于存储电路板的主体，形成导电端子，并且壳体包括基底层和形成在基底层上的天线。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009182959A Housing, method of manufacturing housing, and electronic apparatus using the same 审中-公开
标题翻译：住房，制造住房的方法和使用该住房的电子设备
公开(公告)号：JP2009182959A
公开(公告)日：2009-08-13
申请号：JP2009006080
申请日：2009-01-14
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , H01P11/00 , H01Q1/24
CPC分类号： H01Q1/243 , H01Q1/40
摘要： PROBLEM TO BE SOLVED: To provide a housing which has a simple structure, a small volume and an antenna installed inside, and to provide a method of manufacturing the housing and an electronic apparatus using the same. SOLUTION: The housing includes a thin film layer, a substrate layer, and an antenna. The substrate layer is connected to the film layer by injection molding. The antenna is a metal layer formed on the film layer by vacuum deposition. COPYRIGHT: (C)2009,JPO&INPIT

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