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1. 发明申请

US20120269599A1 THREADED STRUCTURES WITH SOLDER MANAGEMENT FEATURES 审中-公开
标题翻译：具有焊接管理功能的螺纹结构
公开(公告)号：US20120269599A1
公开(公告)日：2012-10-25
申请号：US13188418
申请日：2011-07-21
申请人： Shayan Malek , Richard Hung Minh Dinh , James W. Bilanski
发明人： Shayan Malek , Richard Hung Minh Dinh , James W. Bilanski
IPC分类号： F16B37/00 , B21H3/02
CPC分类号： H01R4/028 , F16B37/06 , H01R12/7047
摘要： Threaded structures such as threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a material such as metal. During attachment of the standoff to a substrate such as a printed circuit board, the base structure may be exposed to molten solder. A solderphilic coating may be provided on the outer surface of the standoff to encourage wicking of solder up and over lower portions of the standoff and beneath the standoff, thereby helping to secure the standoff to the substrate. The center of the base structure may be provided with threads to receive screws. To prevent solder from covering the threads, the surface of the threads may be provided with a solderphobic surface.
摘要翻译：螺纹结构如螺纹间隔结构可以具有控制焊料流动的特征。用于支座的基座结构可以由诸如金属的材料形成。在将支座附接到诸如印刷电路板的基板时，基底结构可能暴露于熔融焊料。可以在支架的外表面上提供耐气相涂层，以促进焊料的上升和支架的下部以及隔板下方的芯吸，从而有助于将支座固定到基板上。基部结构的中心可以设有用于接收螺钉的螺纹。为了防止焊料覆盖螺纹，螺纹的表面可以设置有凹凸表面。

2. 发明申请

US20130077282A1 INTEGRATED THERMAL AND EMI SHIELDS AND METHODS FOR MAKING THE SAME 审中-公开
标题翻译：集成的热和EMI薄膜及其制造方法
公开(公告)号：US20130077282A1
公开(公告)日：2013-03-28
申请号：US13607567
申请日：2012-09-07
申请人： Shayan Malek , Michael Wittenberg , Richard Hung Minh Dinh
发明人： Shayan Malek , Michael Wittenberg , Richard Hung Minh Dinh
IPC分类号： H05K9/00 , H05K13/04
CPC分类号： H05K9/003 , G06F1/1656 , H05K9/0032 , H05K13/04 , Y10T29/4913
摘要： Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic device. The integrated shield can be constructed from a silicon material having one or more EMI shielding additives incorporated therein.
摘要翻译：提供具有用于提供一个或多个电路部件的散热和EMI屏蔽的集成热和EMI屏蔽的电子设备及其制造方法。集成屏蔽将热屏蔽和EMI屏蔽特性组合成单层材料，从而节省电子设备的空间。集成屏蔽可以由其中结合有一个或多个EMI屏蔽添加剂的硅材料构成。

3. 发明申请

US20130048369A1 SYSTEMS AND METHODS FOR SHIELDING CIRCUITRY FROM INTERFERENCE WITH A REMOVABLE SHIELD ASSEMBLY 审中-公开
标题翻译：屏蔽电路与可拆卸屏蔽组件干扰的系统和方法
公开(公告)号：US20130048369A1
公开(公告)日：2013-02-28
申请号：US13222179
申请日：2011-08-31
申请人： Shayan Malek , Gregory Stephens , Jared Mitchell Kole , Richard Hung Minh Dinh , Robert Sorensen
发明人： Shayan Malek , Gregory Stephens , Jared Mitchell Kole , Richard Hung Minh Dinh , Robert Sorensen
IPC分类号： H05K9/00 , H05K13/00
CPC分类号： H05K9/0032 , Y10T29/49002
摘要： This is directed to systems and methods for shielding a circuitry region of an electronic device from interference (e.g., EMI) with a removable shield assembly.
摘要翻译：这涉及用于屏蔽电子设备的电路区域与具有可移除的屏蔽组件的干扰（例如，EMI）的系统和方法。

4. 发明申请

US20130048368A1 SYSTEMS OF AN ELECTRONIC DEVICE AND METHODS FOR MANUFACTURING THE SAME 有权
标题翻译：电子设备的系统及其制造方法
公开(公告)号：US20130048368A1
公开(公告)日：2013-02-28
申请号：US13370881
申请日：2012-02-10
申请人： Shayan Malek , Benjamin John Pope , Daniel William Jarvis , Tang Tan , Richard Hung Minh Dinh , Robert Steinfeld , Ramachandran Chundru
发明人： Shayan Malek , Benjamin John Pope , Daniel William Jarvis , Tang Tan , Richard Hung Minh Dinh , Robert Steinfeld , Ramachandran Chundru
IPC分类号： H05K9/00
CPC分类号： H05K9/0064 , H04M1/0274 , H04M1/0277 , H04N5/2254 , H05K1/0215 , H05K1/0216 , H05K2201/0707
摘要： Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
摘要翻译：提供电子设备的各种系统及其制造方法。在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。

5. 发明申请

US20110255850A1 ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备的电子底座
公开(公告)号：US20110255850A1
公开(公告)日：2011-10-20
申请号：US12794601
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
IPC分类号： G03B15/03 , H01R13/648 , H05K9/00 , H01R13/516
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。散热片和其他导热结构可用于去除多余的部件热量。也可以在电子设备中提供结构以检测湿气。集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

6. 发明申请

US20110255250A1 PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES 审中-公开
标题翻译：电子设备印刷电路板组件
公开(公告)号：US20110255250A1
公开(公告)日：2011-10-20
申请号：US12794599
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
IPC分类号： H05K1/14 , F16B37/00 , F16B39/02 , H05K1/00 , H05K1/11
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。可以使用诸如整流罩的化妆结构来改善设备的美观性。缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。紧固件可以焊接到印刷电路板上的焊盘结构上。

7. 发明授权

US08710376B2 Systems of an electronic device and methods for manufacturing the same 有权
标题翻译：电子装置的系统及其制造方法
公开(公告)号：US08710376B2
公开(公告)日：2014-04-29
申请号：US13370881
申请日：2012-02-10
申请人： Shayan Malek , Benjamin John Pope , Daniel William Jarvis , Tang Tan , Richard Hung Minh Dinh , Robert Steinfeld , Ramachandran Chundru
发明人： Shayan Malek , Benjamin John Pope , Daniel William Jarvis , Tang Tan , Richard Hung Minh Dinh , Robert Steinfeld , Ramachandran Chundru
IPC分类号： H05K9/00
CPC分类号： H05K9/0064 , H04M1/0274 , H04M1/0277 , H04N5/2254 , H05K1/0215 , H05K1/0216 , H05K2201/0707
摘要： Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
摘要翻译：提供电子设备的各种系统及其制造方法。在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。

8. 发明授权

US09077795B2 Latch mechanism device and methods of use 有权
标题翻译：锁定机构装置及使用方法
公开(公告)号：US09077795B2
公开(公告)日：2015-07-07
申请号：US13421487
申请日：2012-03-15
申请人： Bryan P. Kiple , Michael B. Wittenberg , Shayan Malek
发明人： Bryan P. Kiple , Michael B. Wittenberg , Shayan Malek
IPC分类号： H05K7/14 , H04M1/02 , F16B21/18
CPC分类号： H04M1/0277 , F16B21/186 , Y10T24/45262 , Y10T24/45623 , Y10T24/45984 , Y10T29/49826
摘要： Latch mechanism devices for attaching components within a device and methods of use are provided herein. In one aspect, the latch mechanism includes a pair of deflectable members between which a protruding latch member, such as a latch pin, is inserted thereby separating the deflectable members. A latch pin can have a distal insertion portion and a proximal locking portion, the locking portion having a reduced profile so as to resiliently receive the deflectable members displaced by insertion of the latch pin so as to couple the latch pin between the cords. The latch pin can have insertion faces and locking faces angled so as to control the force required to insert and retract the latch pin from the cord pair. The latch mechanism may utilize releasing mechanisms for separating or reducing tension in the deflectable members to facilitate retraction of the latch pin.
摘要翻译：本文提供了用于附接装置内的部件的锁定机构装置和使用方法。在一个方面，闩锁机构包括一对可偏转构件，在其间插入突出的闩锁构件，例如闩锁销，由此分离可偏转构件。闩锁销可以具有远侧插入部分和近侧锁定部分，锁定部分具有减小的轮廓，以便弹性地接收通过插入闩锁销移动的可偏转部件，从而将闩锁销连接在电线之间。闩锁销可以具有成角度的插入面和锁定面，以便控制将插销从线对插入和缩回所需的力。闩锁机构可以利用用于分离或减小可偏转构件中的张力的释放机构，以便于闩锁销的缩回。

9. 发明申请

US20140055961A1 Printed Circuit Boards with Recesses 审中-公开
标题翻译：具有凹版印刷电路板
公开(公告)号：US20140055961A1
公开(公告)日：2014-02-27
申请号：US13593352
申请日：2012-08-23
申请人： Shayan Malek , Nicholas G. L. Merz , Michael B. Wittenberg
发明人： Shayan Malek , Nicholas G. L. Merz , Michael B. Wittenberg
IPC分类号： H05K3/34 , H05K3/46 , H05K7/00
CPC分类号： H05K3/1216 , H05K1/183 , H05K3/1225 , H05K3/3436 , H05K3/3484 , H05K2201/09036 , Y10T29/49144 , Y10T29/49155
摘要： Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations.
摘要翻译：印刷电路板设有凹槽安装部件。组件可以安装在印刷电路板基板的大于该部件的表面中的凹部内。可以使用焊接模板将组件安装在凹槽中。焊料模板可以在平坦部分和凹陷部分之间具有弯曲部分。凹部的横向宽度和部件的横向宽度的差异可以被配置为允许平面部分和凹陷部分抵靠印刷电路板的表面放置，而不会在焊接应用过程中损坏凹部的边缘。可以通过在板形成操作期间将具有大于凹入安装部件的尺寸和形状的尺寸和形状放置在印刷电路板的一部分上的方式来形成凹部。

10. 发明申请

US20130343015A1 Electronic Devices With Printed Circuit Boards Having Padded Openings 有权
标题翻译：具有打开电路板的电子设备
公开(公告)号：US20130343015A1
公开(公告)日：2013-12-26
申请号：US13530038
申请日：2012-06-21
申请人： Shayan Malek , Michael B. Wittenberg , John Ardisana
发明人： Shayan Malek , Michael B. Wittenberg , John Ardisana
IPC分类号： H05K7/14 , H05K1/09 , H05K1/02 , H05K1/11
CPC分类号： H05K7/1417 , G06F1/183 , H05K1/0201 , H05K1/0204 , H05K1/0215 , H05K1/09 , H05K1/11 , H05K3/42 , H05K5/0043 , H05K5/0047 , H05K5/0052 , H05K5/0073 , H05K2201/0314
摘要： An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes.
摘要翻译：电子设备可以设置有具有填充通孔的印刷电路板。填充的通孔可以由印刷电路板基板中的开口和开口中的弹性体构件形成。弹性体构件可以是导电弹性构件，例如导电或导热的弹性构件。印刷电路板可以使用延伸穿过填充通孔的接合构件固定在电子设备的壳体内。接合构件可以与壳体接合或者与附接到壳体的附加接合构件接合。电子设备可以包括形成在印刷电路板的表面上的电子部件上的整流罩结构。整流罩结构可以使用与填充通孔中的接合构件接合的附接构件固定到印刷电路板。

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