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    • 4. 发明授权
    • Compliant heat sink device/mounting system interconnect and a method of implementing same
    • 兼容的散热设备/安装系统互连及其实现方法
    • US06639803B1
    • 2003-10-28
    • US10193534
    • 2002-07-11
    • Joseph P. CorradoBudy D. NotohardjonoRoger R. Schmidt
    • Joseph P. CorradoBudy D. NotohardjonoRoger R. Schmidt
    • H05K720
    • H01L23/4006H01L23/3672H01L2023/4062H01L2023/4087H01L2924/0002H01L2924/00
    • A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between the mounting device top and the board stiffener, wherein the heat sink device includes a top plate, a bottom plate and a heat sink fin compressingly disposed between the top plate and the bottom plate. A method for implementing a heat sink device interconnect including obtaining an electronic module, a printed circuit board and a heat sink device interconnect having a heat sink device, an interconnect device, a mounting device and a board stiffener, arranging the electronic module, the printed circuit board and the heat sink device interconnect such that the electronic module and the printed circuit board is disposed between the board stiffener and the heat sink device and adjusting the mounting device so as to cause the electronic module to become compressingly associated with the printed circuit board.
    • 一种散热装置互连件,包括具有安装装置顶部的安装装置,板加强件,其中所述板加强件设置成与所述安装装置连通,以及压缩地设置在所述安装装置顶部和所述板之间的散热装置 加强件,其中所述散热装置包括压板地设置在所述顶板和所述底板之间的顶板,底板和散热片。 一种用于实现散热装置互连的方法,包括获得电子模块,印刷电路板和具有散热装置的互连装置,互连装置,安装装置和板加强件,布置电子模块,印刷 电路板和散热装置互连,使得电子模块和印刷电路板设置在板加强件和散热装置之间并调节安装装置,以使电子模块与印刷电路板压缩相关联 。