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1. 发明授权

US08514517B1 Systems and methods for providing hybrid coils for magnetic write heads 有权
标题翻译：用于为磁写头提供混合线圈的系统和方法
公开(公告)号：US08514517B1
公开(公告)日：2013-08-20
申请号：US13174619
申请日：2011-06-30
申请人： Sharat Batra , Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Sharat Batra , Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/17
CPC分类号： G11B5/17 , G11B5/1278 , G11B5/3123 , G11B5/3136 , G11B2005/0005
摘要： Systems and methods for providing hybrid coils for magnetic write heads used in disk drives are described. One such system includes a magnetic read/write head including a read transducer, and a write transducer including a pair of write poles, a hybrid coil including a first coil having a pancake coil configuration including at least one turn positioned between the pair of write poles, and a second coil having a helical coil configuration including a plurality of turns positioned between the pair of write poles, the second coil coupled to the first coil, where the at least one turn of the first coil is interleaved with the turns of the second coil.
摘要翻译：描述了用于为磁盘驱动器中使用的写磁头提供混合线圈的系统和方法。一种这样的系统包括包括读取换能器的磁读/写头和包括一对写磁极的写换能器，包括具有扁平线圈配置的第一线圈的混合线圈，该扁平线圈配置包括位于一对写极之间的至少一匝以及具有螺旋线圈结构的第二线圈，其包括位于所述一对写入极之间的多个匝，所述第二线圈耦合到所述第一线圈，其中所述第一线圈的所述至少一个匝与所述第二线圈的匝相交叉线圈

2. 发明授权

US08488272B1 Magnetic recording transducer having side shields 有权
标题翻译：具有侧面屏蔽的磁记录传感器
公开(公告)号：US08488272B1
公开(公告)日：2013-07-16
申请号：US13433587
申请日：2012-03-29
申请人： Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/127
CPC分类号： G11B5/315 , G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A magnetic recording transducer includes a main pole including a nose portion, the nose portion terminating at an air-bearing surface (ABS). The magnetic recording transducer further includes at least one coil having a coil front distal from the ABS, and at least one side shield, the at least one side shield extending from at the ABS to not further than the coil front.
摘要翻译：磁记录传感器包括一个主极，其包括一个鼻部，鼻部终止在空气轴承表面（ABS）处。磁记录传感器还包括至少一个线圈，其具有远离ABS的线圈前端，以及至少一个侧屏蔽，所述至少一个侧屏蔽件从ABS延伸到不超过线圈前端。

3. 发明授权

US08797684B1 Magnetic writer configured for high data rate recording 有权
标题翻译：磁记录器配置为高数据速率记录
公开(公告)号：US08797684B1
公开(公告)日：2014-08-05
申请号：US13331020
申请日：2011-12-20
申请人： Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/17
CPC分类号： G11B5/3123
摘要： A method and system provide a magnetic transducer having an air-bearing surface (ABS). The magnetic transducer includes a write pole and a coil. The write pole has a pole tip and a yoke. The coil energizes the write pole and includes a plurality of turns. A turn of the plurality of turns has a first portion and a second portion. The first portion has a first length in a stripe height direction substantially perpendicular to the ABS. The second portion has a second length in the stripe height direction. The second length is greater than the first length and extends at least to at least one adjacent turn.
摘要翻译：一种方法和系统提供具有空气轴承表面（ABS）的磁换能器。磁换能器包括写极和线圈。写极具有极尖和轭。线圈激励写入极并且包括多个匝。多个匝的转动具有第一部分和第二部分。第一部分具有基本上垂直于ABS的条带高度方向上的第一长度。第二部分在条带高度方向上具有第二长度。第二长度大于第一长度并至少延伸至至少一个相邻的匝。

4. 发明授权

US08166631B1 Method for fabricating a magnetic recording transducer having side shields 有权
标题翻译：制造具有侧屏蔽的磁记录换能器的方法
公开(公告)号：US08166631B1
公开(公告)日：2012-05-01
申请号：US12199624
申请日：2008-08-27
申请人： Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/17 , H04R31/00
CPC分类号： G11B5/315 , G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method provides a magnetic transducer that includes an underlayer and a nonmagnetic layer on the underlayer. The method includes providing a plurality of trenches in the nonmagnetic layer. A first trench of corresponds to a main pole, while at least one side trench corresponds to at least one side shield. The method also includes providing mask covering the side trench(es) and providing the main pole. At least a portion of the main pole resides in the first trench. The method also includes removing at least a portion of the nonmagnetic layer residing between the side trench(es) and the main pole. The method also includes providing at least one side shield. The shield(s) extend from at least an air-bearing surface location to not further than a coil front location.
摘要翻译：一种方法提供一种磁传感器，其包括底层上的底层和非磁性层。该方法包括在非磁性层中提供多个沟槽。第一沟槽对应于主极，而至少一个侧沟槽对应于至少一个侧屏蔽。该方法还包括提供覆盖侧沟槽并提供主极的掩模。主极的至少一部分位于第一沟槽中。该方法还包括去除位于侧沟槽和主极之间的非磁性层的至少一部分。该方法还包括提供至少一个侧屏蔽。屏蔽件至少从空气轴承表面位置延伸到不超过线圈前部位置。

5. 发明授权

US08786983B1 Magnetic writer having a low aspect ratio two layer coil 有权
标题翻译：具有低纵横比的两层线圈的磁性写入器
公开(公告)号：US08786983B1
公开(公告)日：2014-07-22
申请号：US13532658
申请日：2012-06-25
申请人： Feng Liu , Zhanjie Li , Zhigang Bai , Ut Tran , Kevin K. Lin
发明人： Feng Liu , Zhanjie Li , Zhigang Bai , Ut Tran , Kevin K. Lin
IPC分类号： G11B5/17
CPC分类号： G11B5/17 , G11B5/3123
摘要： A method and system provide a magnetic transducer having an air-bearing surface (ABS). The magnetic transducer includes a write pole and at least one coil. The write pole has a pole tip and a yoke. The coil(s) energize the write pole. The coil(s) include a plurality of turns a first distance from the pole and at least one additional turn a second distance from the pole. The first distance is different from the second distance. The at least one additional turn extends over at least part of two of the plurality of turns, has a length in a stripe height direction perpendicular to the ABS and has a height in a down track direction. The length is greater than the height.
摘要翻译：一种方法和系统提供具有空气轴承表面（ABS）的磁换能器。磁换能器包括写极和至少一个线圈。写极具有极尖和轭。线圈使写入极点通电。所述线圈包括与所述极点第一距离的多个匝和距离所述极点至少一个第二距离的至少一个附加匝。第一距离与第二距离不同。所述至少一个附加转弯在所述多个匝中的两个匝中的至少一部分上延伸，具有垂直于所述ABS的条带高度方向上的长度，并且具有向下轨道方向的高度。长度大于高度。

6. 发明授权

US08307540B1 Method for providing an energy assisted magnetic recording (EAMR) transducer 有权
标题翻译：提供能量辅助磁记录（EAMR）传感器的方法
公开(公告)号：US08307540B1
公开(公告)日：2012-11-13
申请号：US13045433
申请日：2011-03-10
申请人： Ut Tran , Kevin K. Lin , Yufeng Hu
发明人： Ut Tran , Kevin K. Lin , Yufeng Hu
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/314 , G11B5/6088 , G11B2005/0021 , Y10T29/49032 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method provides an EAMR transducer. A sacrificial post is provided on an NFT distal from the ABS. This post has an edge proximate and substantially parallel to the ABS. A sacrificial mask is provided on the NFT between the post and the ABS. Optical material(s) are provided. The post is between the optical material(s) and the ABS. The post is removed. A heat sink post corresponding to the post is provided. The heat sink post has a bottom thermally coupled with the NFT and an edge proximate and substantially parallel to the ABS. Part of the heat sink post is removed, forming a heat sink having a top surface at an acute angle from the ABS. Nonmagnetic material(s) are provided on the optical material(s). A pole having a bottom surface thermally coupled with the heat sink and coil(s) are provided.
摘要翻译：一种方法提供一种EAMR传感器。在远离ABS的NFT上提供牺牲柱。该柱具有靠近并且基本上平行于ABS的边缘。在NFT之间在柱和ABS之间提供牺牲掩模。提供光学材料。该柱位于光学材料和ABS之间。该帖子被删除。提供对应于该柱的散热片。散热柱具有与NFT热耦合的底部和靠近并且基本上平行于ABS的边缘。去除部分散热片，形成散热片，其顶面与ABS呈锐角。在一些或多个光学材料上提供非磁性材料。提供具有与散热器和线圈热耦合的底表面的极。

7. 发明授权

US07635636B2 Wafer level packaging of materials with different coefficients of thermal expansion 失效
标题翻译：晶圆级封装材料具有不同的热膨胀系数
公开(公告)号：US07635636B2
公开(公告)日：2009-12-22
申请号：US11461587
申请日：2006-08-01
申请人： Michael T. McClure , Jack Chocola , Kevin K. Lin , George Grama
发明人： Michael T. McClure , Jack Chocola , Kevin K. Lin , George Grama
IPC分类号： H01L21/46 , H01L21/30
CPC分类号： H03H9/059
摘要： An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.
摘要翻译：机电装置封装包括永久地结合到封装机电装置的器件晶片的帽材料。使用中间材料将装置和封盖材料在低温下结合在一起，并且包括从装置或盖材料或两者发出的中间材料的结构在接合界面处提供互锁。一个包装包括具有与装置晶片不同材料的匹配材料和类似热膨胀系数的可重复使用的载体晶片和不同材料的低成本封盖晶片。用于将盖材料临时粘合到载体晶片的方法包括将盖材料附接到载体晶片，然后将其分开以减轻与器件晶片的热膨胀失配。

8. 发明授权

US07109635B1 Wafer level packaging of materials with different coefficients of thermal expansion 有权
公开(公告)号：US07109635B1
公开(公告)日：2006-09-19
申请号：US10867172
申请日：2004-06-14
申请人： Michael T. McClure , Jack Chocola , Kevin K. Lin , George Grama
发明人： Michael T. McClure , Jack Chocola , Kevin K. Lin , George Grama
IPC分类号： H01L41/08
CPC分类号： H03H9/059
摘要： An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

9. 发明授权

US07230512B1 Wafer-level surface acoustic wave filter package with temperature-compensating characteristics 有权
标题翻译：晶圆级声表面波滤波器封装具有温度补偿特性
公开(公告)号：US07230512B1
公开(公告)日：2007-06-12
申请号：US10921479
申请日：2004-08-19
申请人： Charles Carpenter , Jack Chocola , Kevin K. Lin , Phillip Welsh
发明人： Charles Carpenter , Jack Chocola , Kevin K. Lin , Phillip Welsh
IPC分类号： H03H9/00 , H03H9/10
CPC分类号： H03H9/02834 , H03H3/08 , H03H9/02559 , H03H9/1071
摘要： A SAW filter is fabricated at a wafer level for providing desirable temperature characteristics. The filter includes a piezoelectric substrate bonded to a carrier substrate, wherein the coefficient of thermal expansion of the carrier substrate is less than the coefficient of thermal expansion of the piezoelectric substrate. Interdigital transducers are formed on the piezoelectric substrate so as to form a SAW composite die structure. A cap substrate having a coefficient of thermal expansion similar to that of the carrier substrate is bonded to the SAW composite die structure for enclosing the interdigital transducers. Plated vias form signal pad interconnects to input and output pads of the interdigital transducer and a sealing pad formed on the surface of the piezoelectric substrate bonds the SAW composite die structure to the cap substrate.
摘要翻译：在晶片级制造SAW滤波器以提供期望的温度特性。滤波器包括接合到载体基板的压电基板，其中载体基板的热膨胀系数小于压电基板的热膨胀系数。在压电基板上形成叉指式换能器，以形成SAW复合模具结构。具有类似于载体基板的热膨胀系数的盖基板被结合到用于包围叉指式换能器的SAW复合模具结构。电镀通孔形成信号焊盘互连到交叉指型传感器的输入和输出焊盘，并且形成在压电基板的表面上的密封垫将SAW复合模具结构粘合到盖基板。

10. 发明授权

US07596849B1 Method of assembling a wafer-level package filter 有权
标题翻译：组装晶圆级封装过滤器的方法
公开(公告)号：US07596849B1
公开(公告)日：2009-10-06
申请号：US11623884
申请日：2007-01-17
申请人： Charles Carpenter , George Grama , Kevin K. Lin
发明人： Charles Carpenter , George Grama , Kevin K. Lin
IPC分类号： H01S4/00
CPC分类号： H03H9/059 , H03H9/0547 , H03H9/1092 , Y10T29/49002 , Y10T29/49208 , Y10T29/5313 , Y10T29/53174 , Y10T29/53257 , Y10T29/53283
摘要： A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.
摘要翻译：晶片级封装滤波器包括具有设置在其表面上的声波器件的器件晶片，所述声波器件至少包括与压电衬底相关联的声波谐振器和连接焊盘。封装衬底包括具有电感器和电容器的电路。封装的衬底具有与压电衬底的热膨胀系数显着不等的热膨胀系数。粘合剂粘合将封盖的衬底连接到器件晶片，用于将声波器件封装在空腔内。电介质外涂层沉积在封装的衬底的一部分上，并且金属化层在连接封装的衬底电路的介电层的一部分上延伸到声波器件的连接焊盘。可选地，将封盖的衬底连接到器件晶片的结合可以提供互锁连接。

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