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    • 1. 发明授权
    • Low fiber-loading composites with hybridized fiber/matrix interface
    • 低纤维加载复合材料与杂化纤维/基质界面
    • US6069192A
    • 2000-05-30
    • US172334
    • 1998-10-13
    • Shalaby W. ShalabyJacqueline M. AllanMeng Deng
    • Shalaby W. ShalabyJacqueline M. AllanMeng Deng
    • C04B16/06C08L23/06C08L23/10D06M11/55D06M13/288D06M13/332D06M13/368D06M15/263D06M15/65C08K9/00
    • C04B16/0625D06M11/55D06M13/288D06M13/332D06M13/368D06M15/263D06M15/65C08F110/02C08L23/06C08L23/10
    • Disclosed are fiber-reinforced composites having untraditionally low fiber loading and a novel form of hybridized interface. Typical examples of fiber-matrix combinations capable of developing such interfaces include surface-phosphonylated ultrahigh molecular weight polyethylene (UHMW-PE) and polypropylene (PP) yarns (or fabric constructs) and epoxy resin, acrylic resin, and cement. For further improvement of the hybridized interface and the overall composite properties, the surface-phosphonylated fiber may be post-treated with reagents that will improve the abridging of the fibers to the matrix through physicochemically hybridized interfaces. Compared with composites having unmodified fiber, those based on modified ones, with or without post-treatment, exhibit a substantial increase in physicomechanical properties at exceptionally low fiber loading, ranging from about 0.1 to 35 percent by weight, preferably from about 0.1 to about 20 percent by weight, most preferably less than 10 percent by weight. Among these properties are maximum tensile strength, fracture toughness, and modulus.
    • 公开了具有非常低的纤维负载和新颖形式的杂化界面的纤维增强复合材料。 能够开发这种界面的纤维 - 基质组合物的典型实例包括表面膦酰化的超高分子量聚乙烯(UHMW-PE)和聚丙烯(PP)纱线(或织物构造)和环氧树脂,丙烯酸树脂和水泥。 为了进一步改善杂交界面和整体复合性质,可以用可以通过物理化学杂交界面改善纤维对基质的桥接的试剂对表面膦酰化的纤维进行后处理。 与具有未改性纤维的复合材料相比,具有或不具有后处理的基于改性纤维的复合材料在非常低的纤维负载下显示出显着增加的物理机械性能,其范围为约0.1至35重量%,优选约0.1至约20 重量百分比,最优选小于10重量%。 这些性能中的最大拉伸强度,断裂韧性和模量。
    • 4. 发明授权
    • Modulated molecularly bonded inherently conductive polymers on
substrates with conjugated multiple lamellae and shaped articles thereof
    • 在具有共轭多层片及其成型制品的基底上调制分子结合的固有导电聚合物
    • US6117554A
    • 2000-09-12
    • US862945
    • 1997-05-30
    • Shalaby W. ShalabyJacqueline M. Allan
    • Shalaby W. ShalabyJacqueline M. Allan
    • C08G61/12C08J7/12C08J7/16C23C28/00B32B31/06B05D3/00B05D3/04B32B15/04
    • C23C28/00C08G61/122C08G61/124C08J7/12C08J7/16
    • Organic inherently conductive polymers, such as those based on polyaniline, polypyrrole and polythiophene, are sequentially formed in-situ onto polymeric surfaces that are chemically functionalized to molecularly bond the conductive polymers to the substrates. The polymeric substrate is preferably a preshaped or preformed thermoplastic film, fabric, or tube, although other forms of thermoplastic and thermoset polymers can be used as the substrates for functionalization using, most preferably, phosphonylation-based processes followed by exposure to an oxidatively polymerizable compound capable of forming an electrically conductive polymer. It has been found that the degree of electrical conductivity may be modulated by bonding further electrically conductive layers to the article. That is, each underlying conductive layer is functionalized prior to bonding of a subsequent conductive layer thereto until the degree of conductivity is achieved. In an alternative embodiment, metals such as gold or platinum may be bonded to one of the functionalized surfaces.
    • 有机固有导电聚合物,例如基于聚苯胺,聚吡咯和聚噻吩的固体导电聚合物,原位地依次形成在化学官能化以将导电聚合物分子结合到基底上的聚合物表面上。 聚合物基材优选为预成型或预成型的热塑性薄膜,织物或管,尽管其它形式的热塑性和热固性聚合物可用作官能化底物,最优选使用基于膦酰基化的方法,随后暴露于氧化可聚合化合物 能够形成导电聚合物。 已经发现,可以通过将另外的导电层粘合到制品上来调节导电性的程度。 也就是说,每个下面的导电层在其后面的导电层结合之前被功能化,直到达到导电度。 在替代实施例中,诸如金或铂的金属可以结合到功能化表面之一。